A compact sensor apparatus having an illumination beam, a beam shaping system, a polarization modulation system, a beam projection system, and a signal detection system. The beam shaping system is configured to shape an illumination beam generated from the illumination system and generate a flat top beam spot of the illumination beam over a wavelength range from 400 nm to 2000 nm. The polarization modulation system is configured to provide tenability of linear polarization state of the illumination beam. The beam projection system is configured to project the flat top beam spot toward a target, such as an alignment mark on a substrate. The signal detection system is configured to collect a signal beam comprising diffraction order sub-beams generated from the target, and measure a characteristic (e.g., overlay) of the target based on the signal beam.

The invention relates to a method for determining a registration error of a structure on a mask for semiconductor lithography, comprising the following method steps: generating an image of at least one region of the mask, determining at least one measuring contour in the image, and matching the forms of a design contour and a measuring contour to one another while at the same time matching the registration of the two contours.

A mark detecting apparatus includes an imaging unit configured to generate an alignment mark image by imaging of an alignment mark on an object, a detecting unit configured to detect the alignment mark in the alignment mark image, and an adjusting unit configured to adjust a parameter relating to the imaging, based on a learning model generated by learning using the alignment mark image in which the alignment mark could not be detected and a first parameter as the parameter for the imaging of the alignment mark image in which the alignment mark could be detected. The adjusting unit acquires a second parameter as a result of inference processing based on the learning model. The imaging unit performs the imaging in a state where the parameter is adjusted to the second parameter.

Embodiments of the present disclosure provide an alignment mark evaluation method and an alignment mark evaluation system. The alignment mark evaluation method includes: setting a process step code of a wafer with an alignment mark to be evaluated as an evaluation code; obtaining a current process step code of the wafer; if it is detected that the current process step code is the evaluation code, switching a step to be executed to an alignment mark evaluation step; and executing the alignment mark evaluation step to evaluate the alignment mark to be evaluated.

Provided herein are molecules and salts thereof, arrays containing molecules and salts thereof, solid supports containing molecules and salts thereof, kits containing molecules or salts thereof, and methods of determining alignment of photolithographic masks comprising molecules or salts thereof.

According to one embodiment, a mark is a mark arranged on a substrate and including a line-and-space pattern having a substantially constant pitch on the substrate, the mark including: a first mark in which the line-and-space pattern extends in a direction at an angle that is less than 90° or greater than 90° with respect to the first direction, the first mark including a pair of first patterns arranged at a distance in a first direction along the substrate or a first periodic pattern having a period in the first direction; and a second mark in which the line-and-space pattern extends in a direction at an angle that is less than 90° or greater than 90° with respect to the second direction, the second mark including a pair of second patterns provided in correspondence with the pair of first patterns and arranged at a distance in a second direction along the substrate and intersecting the first direction or a second periodic pattern provided in correspondence with the first periodic pattern and having a period in the second direction.

A lithographic apparatus having a substrate table, a projection system, an encoder system, a measurement frame and a measurement system. The substrate table has a holding surface for holding a substrate. The projection system is for projecting an image on the substrate. The encoder system is for providing a signal representative of a position of the substrate table. The measurement system is for measuring a property of the lithographic apparatus. The holding surface is along a plane. The projection system is at a first side of the plane. The measurement frame is arranged to support at least part of the encoder system and at least part of the measurement system at a second side of the plane different from the first side.

The present invention provides a processing system that includes a first apparatus and a second apparatus, and processes a substrate, wherein the first apparatus includes a first measurement unit configured to detect a first structure and a second structure different from the first structure provided on the substrate, and measure a relative position between the first structure and the second structure, and the second apparatus includes an obtainment unit configured to obtain the relative position measured by the first measurement unit, a second measurement unit configured to detect the second structure and measure a position of the second structure, and a control unit configured to obtain a position of the first structure based on the relative position obtained by the obtainment unit and the position of the second structure measured by the second measurement unit.

A grating structure for a diffractive optic includes grating lines, each of which is approximated by successive segments. Longitudinal axes of the segments each have an angle relative to a first coordinate axis of a reference coordinate system. A first section of a first one of the grating lines is approximated by a first group of the segments, and a second section adjacent to the first section of the first grating line is approximated by a second group of segments. The longitudinal axes of a major portion of the segments of the first group have a first predetermined angle relative to the first coordinate axis of the reference coordinate system, and the longitudinal axes of a major portion of the segments of the second group have a second predetermined angle different from the first predetermined angle relative to the first coordinate axis of the reference coordinate system.

According to one embodiment, a measurement method includes generating mark position information, determining at least one of a first arrangement pattern or a second arrangement pattern, and calculating displacement between a first member and a second member. The mark position information is generated after the second member is formed on the first member, and indicates a relative positional relationship between a first alignment mark formed on the first member and including bright portions and dark portions, and a second alignment mark formed on the second member and including the bright portions and the dark portions. The first arrangement pattern indicates an arrangement pattern of bright portions and dark portions of the first alignment mark. The second arrangement pattern indicates an arrangement pattern of the bright portions and the dark portions of the second alignment mark. The first arrangement pattern is determined on the basis of captured data of a reference mark formed in a region different from the region where the first alignment mark is formed and the region where the second alignment mark is formed. The displacement is calculated on the basis of the mark position information and at least one of the first arrangement pattern or the second arrangement pattern.