A mark detecting apparatus includes an imaging unit configured to generate an alignment mark image by imaging of an alignment mark on an object, a detecting unit configured to detect the alignment mark in the alignment mark image, and an adjusting unit configured to adjust a parameter relating to the imaging, based on a learning model generated by learning using the alignment mark image in which the alignment mark could not be detected and a first parameter as the parameter for the imaging of the alignment mark image in which the alignment mark could be detected. The adjusting unit acquires a second parameter as a result of inference processing based on the learning model. The imaging unit performs the imaging in a state where the parameter is adjusted to the second parameter.

Embodiments of the present disclosure provide an alignment mark evaluation method and an alignment mark evaluation system. The alignment mark evaluation method includes: setting a process step code of a wafer with an alignment mark to be evaluated as an evaluation code; obtaining a current process step code of the wafer; if it is detected that the current process step code is the evaluation code, switching a step to be executed to an alignment mark evaluation step; and executing the alignment mark evaluation step to evaluate the alignment mark to be evaluated.

The present invention provides a processing system that includes a first apparatus and a second apparatus, and processes a substrate, wherein the first apparatus includes a first measurement unit configured to detect a first structure and a second structure different from the first structure provided on the substrate, and measure a relative position between the first structure and the second structure, and the second apparatus includes an obtainment unit configured to obtain the relative position measured by the first measurement unit, a second measurement unit configured to detect the second structure and measure a position of the second structure, and a control unit configured to obtain a position of the first structure based on the relative position obtained by the obtainment unit and the position of the second structure measured by the second measurement unit.

A method and system for optimizing forces applied to actuators during a nanoimprint lithography process is provided. A first set of forces within a first set of force limits is selected to be applied to edges of a template. A first residual distortion representative of a first predicted overlay error associated with a simulated imprinting method in which the first set of forces are applied to the edges of the template is estimated. A second set of forces is selected within a second set of force limits to be applied to the edges of the template. A second residual distortion is estimated that is representative of a second predicted overlay error associated with the simulated imprinting method in which the second set of forces are applied to edges of the template. An initial set of forces having a narrowest set of force limits and residual distortion that is below a residual threshold from among the first set of forces and the second set of forces is selected.

An apparatus for measuring a height of a substrate for processing in a lithographic apparatus is disclosed. The apparatus comprises a first sensor for sensing a height of the substrate over a first area. The apparatus also comprises a second sensor for sensing a height of the substrate over a second area. The apparatus further comprises a processor adapted to normalize first data corresponding to a signal from the first sensor with a second sensor footprint to produce a first normalized height data, and to normalize second data corresponding to a signal from the second sensor with a first sensor footprint to produce a second normalized height data. The processor is adapted to determine a correction to a measured height of the substrate based on a difference between the first and second normalized height data.

A method including calculating, using an objective function, which includes a regression model used to estimate an array of a plurality of regions on a substrate and a regularization term used to limit a value of a coefficient of the regression model, a value of each of a plurality of coefficients included in the regression model, with which the objective function becomes not more than a reference value, extracting, based on the calculated values, the coefficient having the value not less than a threshold value from the plurality of coefficients, and obtaining, using a regression model including only the extracted coefficient, an array of a plurality of regions on a substrate.

Systems, apparatuses, and methods are provided for generating level data. An example method can include receiving first level data for a first region of a substrate. The first region can include a first subregion having a first surface level, and a second subregion having a second surface level. The example method can further include generating, based on the first level data, measurement control map data. The example method can further include generating, based on the measurement control map data, second level data for a second region of the substrate. The second region can include a plurality of third subregions each having a third surface level equal to about the first surface level, and, optionally, no region having a surface level equal to about the second surface level.

A measurement apparatus that measures position information of a measurement target is provided. The apparatus includes a scope configured to generate an image by capturing an image of the measurement target, and a processor configured to obtain position information of the measurement target based on the image. The processor is configured to generate a plurality of image components using a statistical technique from a plurality of images generated by the scope, output the plurality of generated image components, perform processing based on the plurality of image components, and determine the position information based on a result of the processing.

A method for generating an alignment signal that includes detecting local dimensional distortions of an alignment mark and generating the alignment signal based on the alignment mark. The alignment signal is weighted based on the local dimensional distortions of the alignment mark. Detecting the local dimensional distortions can include irradiating the alignment mark with radiation, the alignment mark including a geometric feature, and detecting one or more phase and/or amplitude shifts in reflected radiation from the geometric feature. The one or more phase and/or amplitude shifts correspond to the local dimensional distortions of the geometric feature. A parameter of the radiation, an alignment inspection location within the geometric feature, an alignment inspection location on a layer of a structure, and/or a radiation beam trajectory across the geometric feature may be determined based on the one or more detected phase and/or amplitude shifts.

A method of, and associated apparatuses for, performing a position measurement on an alignment mark including at least a first periodic structure having a direction of periodicity along a first direction. The method includes obtaining signal data relating to the position measurement and fitting the signal data to determine a position value. The fitting uses one of a modulation fit or a background envelope periodic fit.