A method of controlling a temperature of the semiconductor device includes operating an semiconductor apparatus; maintaining a temperature of a vessel of the semiconductor apparatus with a first cooling output by a cooling controller; heating the vessel for removing a material on the vessel; transferring a first signal, by a converter, to the cooling controller when heating the vessel; and reducing the first cooling output to a second cooling output by the cooling controller base on the first signal.

A system includes a radiation source, first and second phased arrays, and a detector. The first and second phased arrays include optical elements, a plurality of ports, waveguides, and phase modulators. The optical elements radiate radiation waves. The waveguides guide radiation from a port of the plurality of ports to the optical elements. Phase modulators adjust phases of the radiation waves. One or both of the first and second phased arrays form a first beam and/or a second beam of radiation directed toward a target structure based on the port coupled to the radiation source. The detector receives radiation scattered by the target structure and generates a measurement signal based on the received radiation.

A lithography system comprises an illumination system configured to produce abeam of radiation, a support configured to support a patterning device configured to impart a pattern on the beam, a projection system configured to project the patterned beam onto a substrate, and an alignment system comprising an illuminator. The illuminator comprises an optical fiber, an optical fiber protector (714), an optical fiber support (700) comprising a first support arm assembly configured to support the optical fiber protector, an optical system, and an optical system support comprising a second support arm assembly configured to support the optical system.

An optical module structure is provided. The optical module structure includes a holder, an elastic damper layer, and an optical component. The holder has an inner surface; the elastic damper layer is on the inner surface and has a trench at a first surface of the elastic damper layer; and the optical component is engaged with the elastic damper layer through the trench. Also, an optical system is provided. The optical system includes a light source, an, and a reflector, wherein a plurality of optical components in the optical module are arranged along a direction perpendicular to a direction of gravity.

An optical module structure is provided. The optical module structure includes a holder, an elastic damper layer, and an optical component. The holder has an inner surface; the elastic damper layer is on the inner surface and has a trench at a first surface of the elastic damper layer; and the optical component is engaged with the elastic damper layer through the trench. Also, an optical system is provided. The optical system includes a light source, an, and a reflector, wherein a plurality of optical components in the optical module are arranged along a direction perpendicular to a direction of gravity.

An alignment system configured to be substantially insensitive to thermal variations in its system during alignment measurements. The alignment system includes a sensor system, a support structure, a sensing element, a position measurement system, and an athermal interface between the sensing element and the support structure. The sensor system is configured to determine a position of an alignment mark on a substrate and the support structure is configured to support the sensor system. The sensing element is configured to detect an unintentional displacement of the support structure and the position measurement system is configured to measure the unintentional displacement relative to a reference element based on the detected unintentional displacement. The athermal interface is configured to prevent detection of temperature induced displacement of the support structure by the sensing element.

Embodiments described herein provide a method for cleaning contamination from sensors in a lithography tool without requiring recalibrating the lithography tool. More particularly, embodiments described herein teach cleaning the sensors using hydrogen radicals for a short period while the performance drifting is still above the drift tolerance. After a cleaning process described herein, the lithography tool can resume production without recalibration.

A mask transfer system and transfer method, including an inner mask store (1) used for storing masks, a rotating mechanical arm used for moving the masks, and a mask fork (3) connected to the rotating mechanical arm and used for picking up the masks. The rotating mechanical arm is provided with a micro-adjustment piece (4) used for coordinating with the rotating mechanical arm to compensate position deviations of the masks picked up by the mask fork, so as to implement mask pre-alignment. The mask transfer system and transfer method achieve the effect of being low in cost.

Provided herein are approaches for processing reticle blanks. In one approach, a reticle processing system includes a support assembly having a plate coupled to a frame, and a carrier assembly coupled to the support assembly. In one approach, the carrier assembly includes a carrier base coupled to the plate, a reticle disposed over the carrier base, and a carrier shield disposed over the reticle, wherein the carrier shield may include a central opening formed therein, allowing for placement and extraction of the reticle. In one approach, when the carrier assembly is placed atop the support assembly, a plurality of pins extend from the plate through corresponding openings in the carrier base, the plurality of pins supporting the carrier assembly so the carrier base, the reticle, and the carrier shield are each independently supported and vertically separated from one another.

A method of performing a lithographic exposure of a substrate, the substrate being held on a substrate table, the substrate table comprising a cooling system operative to cool the substrate table, the method comprising performing an alignment measurement of the substrate, applying heat to the substrate table to reduce cooling of the substrate table provided by the cooling system, the heat being applied between a time at which the alignment measurement is performed and a time at which the lithographic exposure is performed and performing the lithographic exposure of the substrate.