Embodiments herein describe a sub-micron 3D diffractive optics element and a method for forming the sub-micron 3D diffractive optics element. In a first embodiment, a method is provided for forming a sub-micron 3D diffractive optics element on a film stack disposed on a substrate without planarization. The method includes forming a hardmask on a top surface of a film stack. Forming a mask material on a portion of the top surface and a portion of the hardmask. Etching the top surface. Trimming the mask. Etching the top surface again. Trimming the mask a second time. Etching the top surface yet again and then stripping the mask material.

Method of patterning a surface of an object or a tool with nano and/or micro structure elements having dimensions in a range of 1 nanometer to 1 millimeter, comprising the steps of producing a flexible mask with said nano or micro structure pattern formed on a surface of said flexible mask, chemically activating said surface of the flexible mask and/or said surface to be patterned of the tool, placing said patterned surface of the flexible mask in contact with said surface to be patterned of the object or tool, promoting a covalent bonding reaction between said patterned surface of the flexible mask in contact with said surface to be patterned, removing the flexible mask from the tool whereby a layer of said flexible mask remains bonded to said surface to be patterned of the tool, etching said surface to be patterned of the tool whereby the bonded layer of flexible mask material resists etching. An anti-activation mask defining a periphery of the surface area to be patterned, or peripheries of the surface area to be patterned if there are a plurality of separate portions of surface area to be patterned, is deposited on the flexible mask prior to placing the patterned surface of the flexible mask on the surface to be patterned. The anti-activation mask prevents bonding of the flexible mask to the surface of the object or tool in areas where the anti-activation mask is present.

Method of patterning a surface of an object or a tool with nano and/or micro structure elements having dimensions in a range of 1 nanometer to 1 millimeter, comprising the steps of producing a flexible mask with said nano or micro structure pattern formed on a surface of said flexible mask, chemically activating said surface of the flexible mask and/or said surface to be patterned of the tool, placing said patterned surface of the flexible mask in contact with said surface to be patterned of the object or tool, promoting a covalent bonding reaction between said patterned surface of the flexible mask in contact with said surface to be patterned, removing the flexible mask from the tool whereby a layer of said flexible mask remains bonded to said surface to be patterned of the tool, etching said surface to be patterned of the tool whereby the bonded layer of flexible mask material resists etching. An anti-activation mask defining a periphery of the surface area to be patterned, or peripheries of the surface area to be patterned if there are a plurality of separate portions of surface area to be patterned, is deposited on the flexible mask prior to placing the patterned surface of the flexible mask on the surface to be patterned. The anti-activation mask prevents bonding of the flexible mask to the surface of the object or tool in areas where the anti-activation mask is present.

A method for integrating a synthetic hologram in an image of a scene, including: forming, from a first image of the scene, a first matrix including pixels of two shades according to the gray level of the corresponding pixel of the first image, and a second matrix, image of the gray level difference between the corresponding pixels of the first image and of the first matrix; forming a third matrix based on a second image; forming a fourth matrix having each pixel including a central area with a surface area determined by the corresponding element of the second matrix and off-centered in the pixel according to the corresponding pixel of the third matrix; and performing a lithography of an opaque layer at the surface of a plate according to the pattern defined by the fourth pixel matrix.