A method for providing a thermal feedback performed by a feedback device is disclosed. The method includes: applying an operating power to a thermoelectric element to start a thermoelectric operation for outputting a thermal feedback; stopping the application of the operating power to terminate the thermoelectric operation; and when the application of the operating power is stopped, applying a buffering power to the thermoelectric element to reduce a temperature returning speed of a contact surface so that a thermal inversion illusion is prevented. The thermal inversion illusion being opposite to the outputted thermal feedback.

A liquid lens system includes a liquid lens and a heating device disposed in, on, or near the liquid lens. The liquid lens system can include a temperature sensor. The heating device can be responsive to a temperature signal generated by the temperature sensor. A camera module can include the liquid lens system. A method of operating a liquid lens includes detecting a temperature of the liquid lens and heating the liquid lens in response to the detected temperature. Various embodiments disclosed herein can reduce, impede, or prevent crosstalk between components of the liquid lens, or the effects thereof.

A temperature control method and an electronic cigarette. The method includes: when an electronic cigarette is in a temperature holding mode, obtaining a first holding temperature corresponding to the current temperature holding mode; adjusting the holding temperature of the electronic cigarette from the first holding temperature to a second holding temperature according to adjustment reference information; and adjusting the temperature of the electronic cigarette to the holding temperature. The present application solves the problem of a few heating modes of electronic cigarettes in the prior art, and increases heating modes of electronic cigarettes

A method for providing a thermal feedback, includes executing a virtual reality application providing a virtual space that includes a virtual area to which an area temperature attribute is assigned, and a virtual object to which an object temperature attributed is assigned. An area event that reflects that a player character enters the virtual area is detected. A feedback device is controlled to output thermal feedback associated to the area temperature attribute when the area event is detected, the feedback device outputting the thermal feedback using a thermoelectric element performing a thermoelectric operation. An object event reflecting the player character is influenced by the virtual object is detected. The feedback device is controlled to override the thermal feedback associated to the area temperature attribute and output thermal feedback associated to the object temperature when the object is detected while the player character is in the virtual area.

A method for providing a thermal feedback, includes executing a virtual reality application providing a virtual space that includes a virtual area to which an area temperature attribute is assigned, and a virtual object to which an object temperature attributed is assigned. An area event that reflects that a player character enters the virtual area is detected. A feedback device is controlled to output thermal feedback associated to the area temperature attribute when the area event is detected, the feedback device outputting the thermal feedback using a thermoelectric element performing a thermoelectric operation. An object event reflecting the player character is influenced by the virtual object is detected. The feedback device is controlled to override the thermal feedback associated to the area temperature attribute and output thermal feedback associated to the object temperature when the object is detected while the player character is in the virtual area.

An electronic component handling apparatus, for handling a DUT having a temperature detection circuit and pressing the DUT against a socket electrically connected to a tester testing the DUT, includes: a temperature adjuster adjusting a temperature of the DUT; a first calculator calculating the temperature of the DUT based on a detection result of the temperature detection circuit; a temperature controller controlling the temperature adjuster; and a first receiver receiving a first signal output from the tester, a temperature control including a first temperature control based on the temperature of the DUT calculated by the first calculator and a second temperature control, and the temperature controller switching the temperature control of the DUT from the first temperature control to the second temperature control when the first receiver receives the first signal after the temperature controller starts the first temperature control.

An electronic component handling apparatus, for handling a DUT having a temperature detection circuit and pressing the DUT against a socket electrically connected to a tester testing the DUT, includes: a temperature adjuster adjusting a temperature of the DUT; a first calculator calculating the temperature of the DUT based on a detection result of the temperature detection circuit; a temperature controller controlling the temperature adjuster; and a first receiver receiving a first signal output from the tester, a temperature control including a first temperature control based on the temperature of the DUT calculated by the first calculator and a second temperature control, and the temperature controller switching the temperature control of the DUT from the first temperature control to the second temperature control when the first receiver receives the first signal after the temperature controller starts the first temperature control.

Systems and methods can control refrigeration within a refrigerated freight container. Thermal sensor nodes can be positioned within the freight container. Temperature measurements can be wirelessly relayed from the sensor nodes to a gateway associated with the freight container. The received temperature measurements can be aggregated and logged at the gateway. Thermal models of the freight container and associated cargo loads can be established in response to the logged temperature measurements and loading plan for the foreign container. The refrigeration system can be controlled in response to processing the thermal models. The refrigeration system can be controlled to optimize compliance parameters associated with the cargo loads.

Systems and methods can control refrigeration within a refrigerated freight container. Thermal sensor nodes can be positioned within the freight container. Temperature measurements can be wirelessly relayed from the sensor nodes to a gateway associated with the freight container. The received temperature measurements can be aggregated and logged at the gateway. Thermal models of the freight container and associated cargo loads can be established in response to the logged temperature measurements and loading plan for the foreign container. The refrigeration system can be controlled in response to processing the thermal models. The refrigeration system can be controlled to optimize compliance parameters associated with the cargo loads.

The present invention relates to a heating system component, including a carrier unit having a dry side, a wet side, a groove provided on the dry side, and a medium leading section at least partially opposite a medium flow area on the wet side; a heating unit at least partially received in the groove; a heat conducting plate assembly that comprises a first heat capturing plate portion that is thermally coupled to the heating unit, a second heat capturing plate portion that is thermally coupled to the medium leading section of the carrier unit, a first heat releasing plate portion, and a second heat releasing plate portion; at least one printed circuit board comprising circuitry with a first sensor area and a second sensor area, wherein the circuitry is configured to sense a first temperature at the first sensor area and a second temperature at the second sensor area; a housing accommodating at least a part of the printed circuit board and at least a part of the heat conducting plate assembly in such a way that the first sensor area is thermally coupled to the first heat releasing plate portion and the second sensor area is thermally coupled to the second heat releasing plate portion.