A heating component for insertion into and vaporization of an aerosol-forming medium includes: a shell, provided with a cavity; a heating medium filled in the cavity for heating in an alternating magnetic field; and a temperature control element accommodated in the cavity and for measuring a temperature. In an embodiment, the temperature control element is at least one of a positive temperature coefficient (PTC) element, a negative temperature coefficient (NTC) element, or a thermocouple.

A heating component for insertion into and vaporization of an aerosol-forming medium includes: a shell, provided with a cavity; a heating medium filled in the cavity for heating in an alternating magnetic field; and a temperature control element accommodated in the cavity and for measuring a temperature. In an embodiment, the temperature control element is at least one of a positive temperature coefficient (PTC) element, a negative temperature coefficient (NTC) element, or a thermocouple.

A temperature-sensing device configured to monitor a temperature is disclosed. The temperature-sensing device includes: a first capacitor comprising a first oxide layer with a first thickness; a second capacitor comprising a second oxide layer with a second thickness, wherein the second thickness of the second oxide layer is different from the first thickness of the first oxide layer; and a control logic circuit, coupled to the first and second capacitors, and configured to determine whether the monitored temperature is equal to or greater than a threshold temperature based on whether at least one of the first and second oxide layers breaks down.

System and methods for motor drive electronics are provided. Aspects include receiving, by a controller on a motor driver electronics (MDE) component, voltage data associated with a thermoelectric generator, wherein the MDE component is configured to operate an electric motor, and wherein the MDE component comprises a power card including one or more components, determining a temperature reading based on the voltage data, enacting an action associated with the MDE component based at least in part on the temperature reading.

System and methods for motor drive electronics are provided. Aspects include receiving, by a controller on a motor driver electronics (MDE) component, voltage data associated with a thermoelectric generator, wherein the MDE component is configured to operate an electric motor, and wherein the MDE component comprises a power card including one or more components, determining a temperature reading based on the voltage data, enacting an action associated with the MDE component based at least in part on the temperature reading.

A temperature-sensing device configured to monitor a temperature is disclosed. The temperature-sensing device includes: a first capacitor comprising a first oxide layer with a first thickness; a second capacitor comprising a second oxide layer with a second thickness, wherein the second thickness of the second oxide layer is different from the first thickness of the first oxide layer; and a control logic circuit, coupled to the first and second capacitors, and configured to determine whether the monitored temperature is equal to or greater than a threshold temperature based on whether at least one of the first and second oxide layers breaks down.

An interface module includes: N pairs of input connectors that are electrically conductive and that are configured to connect to and disconnect from N different temperature sensors, respectively; and M output connectors that are electrically conductive, where each pair of input connectors includes: a first input connector configured to connect to and disconnect from a first connector soldered to a first wire connected to one of the N different temperature sensors; and a second input connector configured to connect to and disconnect from a second connector soldered to a second wire connected to the one of the N different temperature sensors, where the second input connectors are electrically connected to second ones of the M output connectors, respectively, and where the first input connectors of the N pairs of input connectors are all electrically connected to a node that is connected to a first one of the M output connectors.

An interface module includes: N pairs of input connectors that are electrically conductive and that are configured to connect to and disconnect from N different temperature sensors, respectively; and M output connectors that are electrically conductive, where each pair of input connectors includes: a first input connector configured to connect to and disconnect from a first connector soldered to a first wire connected to one of the N different temperature sensors; and a second input connector configured to connect to and disconnect from a second connector soldered to a second wire connected to the one of the N different temperature sensors, where the second input connectors are electrically connected to second ones of the M output connectors, respectively, and where the first input connectors of the N pairs of input connectors are all electrically connected to a node that is connected to a first one of the M output connectors.

A method of forming structure includes providing a substrate in a reaction chamber, forming a first layer overlaying the substrate, and forming a second layer onto the first layer. Temperature of the first layer is controlled during the forming of the first layer using infrared electromagnetic radiation emitted by the first layer. Temperature of the second layer is controlled during the forming of the second layer using infrared electromagnetic radiation emitted by the second layer. Semiconductor device structures and semiconductor processing systems are also described.

Systems and methods can control refrigeration within a refrigerated freight container. Thermal sensor nodes can be positioned within the freight container. Temperature measurements can be wirelessly relayed from the sensor nodes to a gateway associated with the freight container. The received temperature measurements can be aggregated and logged at the gateway. Thermal models of the freight container and associated cargo loads can be established in response to the logged temperature measurements and loading plan for the foreign container. The refrigeration system can be controlled in response to processing the thermal models. The refrigeration system can be controlled to optimize compliance parameters associated with the cargo loads.