The semiconductor wafer is preheated at a preheating temperature, and then irradiated with a flash of light from a flash lamp. The upper radiation thermometer measures a temperature of a front-surface of a semiconductor wafer which is raised by irradiation with a flash of light. When the front-surface temperature of the semiconductor wafer measured by the upper radiation thermometer reaches the target temperature, the supply of a current to the flash lamps is stopped to lower the front-surface temperature of the semiconductor wafer. Since the supply of a current to the flash lamps is stopped when the measured temperature of the front-surface of the semiconductor wafer reaches the target temperature, the front-surface temperature of the semiconductor wafer can be accurately raised to the target temperature regardless of the front-surface state and reflectance of the semiconductor wafer.

The semiconductor wafer is preheated at a preheating temperature, and then irradiated with a flash of light from a flash lamp. The upper radiation thermometer measures a temperature of a front-surface of a semiconductor wafer which is raised by irradiation with a flash of light. When the front-surface temperature of the semiconductor wafer measured by the upper radiation thermometer reaches the target temperature, the supply of a current to the flash lamps is stopped to lower the front-surface temperature of the semiconductor wafer. Since the supply of a current to the flash lamps is stopped when the measured temperature of the front-surface of the semiconductor wafer reaches the target temperature, the front-surface temperature of the semiconductor wafer can be accurately raised to the target temperature regardless of the front-surface state and reflectance of the semiconductor wafer.

A toilet seat assembly is provided including a seat base with a housing and a seat lid, and further including a washing apparatus, a drying apparatus, and a spray canister device positioned in the housing. A controller having a user interface is configured to communicate with a control unit of the toilet seat assembly to control operation of the components of the toilet seat assembly. So configured, a user may operate the toilet seat assembly to clean the user's perineal region via the washing apparatus, dry the user's perineal region via the drying apparatus, and spray the user's perineal region with one or more liquid products via the spray canister device.

A toilet seat assembly is provided including a seat base with a housing and a seat lid, and further including a washing apparatus, a drying apparatus, and a spray canister device positioned in the housing. A controller having a user interface is configured to communicate with a control unit of the toilet seat assembly to control operation of the components of the toilet seat assembly. So configured, a user may operate the toilet seat assembly to clean the user's perineal region via the washing apparatus, dry the user's perineal region via the drying apparatus, and spray the user's perineal region with one or more liquid products via the spray canister device.

A temperature control device for controlling a temperature of a temperature control object is provided. The temperature control device includes a heating mechanism having a heating source configured to heat the temperature control object, a cooling mechanism having a cooling source configured to cool the temperature control object, an infrared sensor configured to measure the temperature of the temperature control object, and a temperature controller configured to allow a control system including a sliding mode control to control the heating mechanism and the cooling mechanism based on a measurement signal from the infrared sensor and perform a feedback control of the temperature of the temperature control object.

A temperature control device for controlling a temperature of a temperature control object is provided. The temperature control device includes a heating mechanism having a heating source configured to heat the temperature control object, a cooling mechanism having a cooling source configured to cool the temperature control object, an infrared sensor configured to measure the temperature of the temperature control object, and a temperature controller configured to allow a control system including a sliding mode control to control the heating mechanism and the cooling mechanism based on a measurement signal from the infrared sensor and perform a feedback control of the temperature of the temperature control object.

A temperature control system and method are provided. The temperature control system includes: a bearing platform including a central platform and multiple edge platforms arranged around same; multiple temperature control modules each connected to a respective edge platform and configured to regulate temperature of a corresponding region of a wafer on the edge platform; a parameter acquisition module configured to acquire temperatures of the wafer; and a processing module configured to acquire a temperature abnormal region of the wafer and regulate a temperature of the temperature control module corresponding to the temperature abnormal region. The parameter acquisition module is used to acquire the temperatures of the wafer on the bearing platform, to acquire the temperature abnormal region of the wafer. Then, the processing module acquires the corresponding temperature control module based on the position of the temperature abnormal region. The temperatures at specific positions of a wafer are accurately controlled.

An optical heating device for heating a substrate includes: a chamber for accommodating the substrate; a pair of transmissive windows disposed on the wall of the chamber, the transmissive window facing each other for allowing light for heating to enter inside the chamber; a support member for supporting the substrate to face each of the main surfaces of the substrate and the pair of transmissive windows each other; a plurality of LED elements for emitting light toward the substrate supported by the support member; a flash lamp for emitting light toward the substrate supported by the support member; and a first lighting control unit for controlling the lighting of the flash lamp after a predetermined time has elapsed since the time of lighting the LED elements.

A biologically temperature-controlled electronics shell component is adapted to constitute an outer shell and/or a middle shell of an electronic product such as a mobile phone, a tablet device, a laptop computer a wearable device, and the like. A heat source is provided in the electronic product. The shell component includes an outer shell body and an outer heat-conducting sheet. The outer shell body includes at least one hole extending through inner and outer surfaces thereof. The outer heat-conducting sheet corresponding to the heat source and combined with the outer shell body includes a heat-conducting portion corresponding to the hole. Radiant heat generated by the heat source can be absorbed by and dissipated through the outer heat-conducting sheet and conducted through a user's skin which is contacting the heat-conducting portion.

A biologically temperature-controlled electronics shell component is adapted to constitute an outer shell and/or a middle shell of an electronic product such as a mobile phone, a tablet device, a laptop computer a wearable device, and the like. A heat source is provided in the electronic product. The shell component includes an outer shell body and an outer heat-conducting sheet. The outer shell body includes at least one hole extending through inner and outer surfaces thereof. The outer heat-conducting sheet corresponding to the heat source and combined with the outer shell body includes a heat-conducting portion corresponding to the hole. Radiant heat generated by the heat source can be absorbed by and dissipated through the outer heat-conducting sheet and conducted through a user's skin which is contacting the heat-conducting portion.