Patent classifications
G06F1/18
Multi-part device enclosure
- Mikael M. Silvanto ,
- Simon J. Trivett ,
- Matthew S. Theobald ,
- Dinesh C. Mathew ,
- Simon R. Lancaster-Larocque ,
- Robert Y. Cao ,
- Ari P. Miller ,
- Kevin M. Robinson ,
- Houtan R. Farahani ,
- Francesco Ferretti ,
- John Raff ,
- Robert J. Lockwood ,
- Genie Kim ,
- Karan Bir ,
- Keith J. Hendren ,
- Gurshan Deol ,
- Antonio Clarke ,
- Prabhu Sathyamurthy ,
- William A. Counts
An electronic device includes an enclosure formed of a plurality of layers cooperating to define an interior volume. The enclosure includes a first layer formed of a first material and defining a user input surface of the enclosure and a first portion of a side surface of the enclosure. The enclosure also includes a second layer, formed of a second material different from the first material, positioned below the first layer and defining a second portion of the side surface of the enclosure. The enclosure also includes a third layer, formed of a third material different from the first and second materials, positioned below the second layer and defining a bottom surface of the enclosure and a third portion of the side surface of the enclosure.
Die-to-die Dynamic Clock and Power Gating
A system includes a plurality of systems-on-a-chip (SoCs), connected by a network. The plurality of SoCs and the network are configured to operate as a single logical computing system. The plurality of SoCs may be configured to exchange local power information indicative of network activity occurring on their respective portions of the network. A given one of the plurality of SoCs may be configured to determine that a local condition for placing the respective portion of the network corresponding to the given SoC into a reduced power mode has been satisfied. The given SoC may be further configured to place the respective portion of the network into the reduced power mode in response to determining that a global condition for the reduced power mode is satisfied. The global condition may be assessed based upon current local power information for remaining ones of the plurality of SoCs.
FIXING DEVICE FOR FIXING AN EXPANSION CARD IN AN ELECTRONIC DEVICE
A fixing device is provided for fixing an expansion card in an electronic device. The fixing device includes a supporting base, a fastening element and an actuating element. The supporting base includes a sliding rail. The sliding rail is located under the expansion card. The sliding rail includes plural first positioning structures. The fastening element includes a sliding part and a locking part. The sliding part is movably installed on the sliding rail. The locking part is protruded from the sliding part. The expansion card is arranged between the locking part and an expansion port of the electronic device. The actuating element includes a pressing part and an elastic part. The pressing part is connected with the sliding part through the elastic part. The pressing part includes a second positioning structure. The second positioning structure is detachably engaged with one of the plural first positioning structures.
ELECTRONIC DEVICE INCLUDING CONNECTION MEMBER
An electronic device includes a lens frame accommodating a display member, a wearing member connected to the lens frame, a circuit board provided inside the wearing member, a battery provided inside the wearing member, and a connection member including a first end connected to the circuit board, a second end connected to the battery, an elastic member formed of a conductive material, and a wire at least partially surrounded by the elastic member. The battery is electrically connected to the circuit board via the elastic member and the wire.
Display apparatus
The present disclosure relates to a display apparatus. The display apparatus may include a display panel, a peripheral region, an electronic component, and a gap-fill layer. The display panel defines a display region. The peripheral region is adjacent to the display region. The peripheral region includes lines and pads. The lines are disposed in the peripheral region, and the pads are connected to the lines. The electronic component includes connecting pads in contact with the pads. The gap-fill layer is between the display panel and the electronic component, between the connection pads, between the pads, and in the openings. Each of the pads may overlap at least two pads of the connection pads, and the openings may overlap between the connection pads, when viewed in a plan view.
Sealed enclosure power control system
A sealed enclosure power control system for controlling power to an electrical component within an enclosure. The sealed enclosure power control system generally includes an electrical component within the sealed enclosure, a first connector on the sealed enclosure adapted to provide a sealed electrical interface to the electrical component. The first connector has at least one first connector conductor element, and the system further includes a battery within the sealed enclosure, and the system also has a second connector, wherein when the first connector and the second connector are connected together, electrical power from the battery is applied to the electrical component, and when the first connector and the second connector are not connected together, the electrical power is not applied to the electrical component.
Wiring structure, display subtrate and display device
The present disclosure provides a wiring structure, a display substrate and a display device, and belongs to the field of display technology. The wiring structure of the present disclosure comprises a body portion provided with hollow patterns; the body portion has a first side and a second side which are provided opposite to each other along an extending direction of the wiring structure, and both the first and second sides are wavy; the body portion comprises a plurality of conductive elements sequentially connected along the extending direction of the wiring structure; and in each conductive element, a length of a protruding portion on the first side in the extending direction of the wiring structure is different from that of a protruding portion on the second side in the extending direction of the wiring structure.
Technologies for assigning workloads to balance multiple resource allocation objectives
Technologies for allocating resources of managed nodes to workloads to balance multiple resource allocation objectives include an orchestrator server to receive resource allocation objective data indicative of multiple resource allocation objectives to be satisfied. The orchestrator server is additionally to determine an initial assignment of a set of workloads among the managed nodes and receive telemetry data from the managed nodes. The orchestrator server is further to determine, as a function of the telemetry data and the resource allocation objective data, an adjustment to the assignment of the workloads to increase an achievement of at least one of the resource allocation objectives without decreasing an achievement of another of the resource allocation objectives, and apply the adjustments to the assignments of the workloads among the managed nodes as the workloads are performed. Other embodiments are also described and claimed.
System of providing power to chip on mainboard
The disclosure provides a system of providing power to a chip on a mainboard, including: a first power supply, located on the mainboard, and configured to receive a first voltage and to provide a second voltage; and a second power supply and a third power supply, located on the mainboard, wherein the second power supply and the third power supply are electrically connected to the first power supply; so as to receive the second voltage, the second power supply is disposed at a first side of the chip, the third power supply is disposed at a second side of the chip, the second power supply provides a third voltage to the chip, and the third power supply provides a fourth voltage to the chip.
Wiring substrate and display panel
A wiring substrate includes an insulating base that has a plate surface; a first circuit that is provided on the plate surface; a first terminal that is provided on the plate surface, and to which a mounting member is attached; a second terminal that is provided on the plate surface; a first wiring that connects the first circuit and the first terminal to each other; and a second wiring that connects the first terminal and the second terminal to each other, is electrically connected to the first wiring in the first terminal, and has a parallel section in which the second wiring is disposed close to and parallel to the first wiring without being electrically connected to the first wiring outside the first terminal.