A system and method for cooling electronic equipment having a power supply unit separate from the equipment, sprayers that spray a dielectric liquid coolant on the top of the equipment lengthwise along one or more fins of one or more heat sinks on the equipment, a reservoir, connectors, and pumps for pumping the liquid coolant from the reservoir and through the sprayer, and an external housing.

A transmission line has a first conductor layer extending in a first direction, a second conductor layer disposed on a side of a first surface of the first conductor layer via a first dielectric layer, the second conductor layer extending in the first direction, and a third conductor layer disposed on a side of a second surface of the first conductor layer opposite to the first surface, via a second dielectric layer, the third conductor layer extending in the first direction, wherein a width, in a second direction intersecting the first direction, of each of the second conductor layer and the third conductor layer is different at a plurality of locations in the first direction, and the first conductor layer, the second conductor layer, and the third conductor layer at least partially overlap each other in a plan view from a normal direction of the first surface.

A transmission line has a first conductor layer extending in a first direction, a second conductor layer disposed on a side of a first surface of the first conductor layer via a first dielectric layer, the second conductor layer extending in the first direction, and a third conductor layer disposed on a side of a second surface of the first conductor layer opposite to the first surface, via a second dielectric layer, the third conductor layer extending in the first direction, wherein a width, in a second direction intersecting the first direction, of each of the second conductor layer and the third conductor layer is different at a plurality of locations in the first direction, and the first conductor layer, the second conductor layer, and the third conductor layer at least partially overlap each other in a plan view from a normal direction of the first surface.

A variable fin stack for cooling components in a chassis of a portable information handling system. The variable fin stack comprises a first array of fins coupled to a first conduit and a second array of fins coupled to a second conduit. When the chassis is in a compact configuration for use in a mobile mode, fins in the second array of fins are positioned between fins in the first array of fins and the chassis maintains a form factor. When the chassis is in an expanded configuration for use in a workstation mode, the second array of fins is withdrawn from the first array of fins and the increased surface area provides increased cooling of components operating at higher power levels.

Systems and methods of adaptive thermal control are provided for information handling system platforms that may be implemented to automate and scale fan control settings by making the fan control settings relative to a reported component thermal control parameter value from a component of an information handling system platform, such as a CPU or other heat generating component. In one example, bounds for system use of vendor or component manufacturer-reported thermal control parameter values may be set for system cooling so as to confine use of these values within information handling system platform limits characterized by a manufacturer of an information handling system platform.

Power consumption of a cooling fan of an information processing device is reduced. A processor reduces a speed of the cooling fan provided in the information processing device, and controls the cooling fan at a first speed when there is no problem with the operation of the information processing device, the first speed being obtained by reducing the speed of the cooling fan. An interface transmits first information indicating the first speed to a management device. The processor receives second information indicating a second speed from the management device that associates the first speed with identification information identifying the information processing device and stores therein the first information indicating the first speed and the identification information, and controls the speed of the cooling fan according to the second speed when the second speed is lower than the first speed.

A heat sink for electronic devices, such as wearable displays, dissipates heat away from and electrical component, such as a microprocessor. An adjustable support assembly permits adjustment of a visual display relative to a user's field of view.

A heat sink for electronic devices, such as wearable displays, dissipates heat away from and electrical component, such as a microprocessor. An adjustable support assembly permits adjustment of a visual display relative to a user's field of view.

A self-sustained, submerged waterborne data center facility that utilizes a closed-looped heat management system that is both energy-efficient and cost-effective is disclosed. Embodiments employ a closed-looped, energy efficient, cost effective thermal management system that leverages natural resources to control thermal conditions and reduce the overall requirement for cooling power.

A self-sustained, submerged waterborne data center facility that utilizes a closed-looped heat management system that is both energy-efficient and cost-effective is disclosed. Embodiments employ a closed-looped, energy efficient, cost effective thermal management system that leverages natural resources to control thermal conditions and reduce the overall requirement for cooling power.