A fan receiver assembly (1200) includes a fan receiver (101). The fan receiver includes a rear wall (128) and at least one sidewall (112). At least one deformable clasp (105) is coupled to, and translatable along, the sidewall. The deformable clasp includes at least one latching arm (142) that is pivotable between an axially displaced open position occurring when the latching arm extends beyond a terminal end sidewall and a parallel position occurring when the latching arm is situated between the terminal end and the rear wall. The sidewall defines a d-track (111) having a terminal end (125) and an outward notch (126). A follower situates within the d-track between the deformable clasp and the sidewall. A fan module (102) latches to the fan receiver assembly when the follower situates within the outward notch.

In aspects of processor heat dissipation in a stacked PCB configuration, a computing device includes a processor for executable instructions processing during which the processor generates heat. The computing device also includes a main printed circuit board (PCB) in a stacked PCB configuration, and the processor is affixed to the main printed circuit board. The stacked PCB configuration forms an enclosed cavity through which heat dissipation is restricted. The computing device includes a heat spreader having a first end connected to the processor via the main printed circuit board by a conductive material, and a second end connected to a heat sink located external to the stacked PCB configuration. The heat spreader exits the enclosed cavity via an opening in the enclosed cavity between the stacked PCB configuration, and the heat spreader transfers the heat away from the processor to the heat sink.

In aspects of processor heat dissipation in a stacked PCB configuration, a computing device includes a processor for executable instructions processing during which the processor generates heat. The computing device also includes a main printed circuit board (PCB) in a stacked PCB configuration, and the processor is affixed to the main printed circuit board. The stacked PCB configuration forms an enclosed cavity through which heat dissipation is restricted. The computing device includes a heat spreader having a first end connected to the processor via the main printed circuit board by a conductive material, and a second end connected to a heat sink located external to the stacked PCB configuration. The heat spreader exits the enclosed cavity via an opening in the enclosed cavity between the stacked PCB configuration, and the heat spreader transfers the heat away from the processor to the heat sink.

Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.

A heat exchange ribbon includes a base portion to be attached to a spacer to be mounted to a circuit board, a tail portion substantially parallel to the base portion, and a leg connecting the tail portion to the base portion. A height of the leg extends in the same direction as a height of the base portion and the tail portion so as to create an opening at least partially surrounded by the base portion, the leg, and the tail portion. The base portion, the tail portion, and the leg portion have a one-piece construction. The leg extends below a lower edge of the base portion such that at least a portion of the tail portion is located below a lower edge of the base portion, and at least a portion of an inner surface of the tail portion does not oppose the outer surface of the base portion.

A device includes a thermal mitigation system that operates to reduce performance of a component of the device to prevent the device from getting too hot. The system uses a combination of a time-based technique and a temperature-based technique to perform thermal mitigation. The time-based technique refers to using an indication of the device usage as well as the amount of current drawn by the device at any given time to predict an amount of time that the device is to run in a non-reduced performance mode before reaching a target temperature threshold, and an amount of time for the device to run in a reduced performance mode to cool down. The temperature-based technique refers to monitoring the temperature of the device (or a component of the device) and powering off the device in response to detecting that a monitored temperature exceeds a critical threshold temperature.

A cooling module for a printed circuit board having one or more heat generating components. The cooling module comprises a casing defining a first internal volume adapted for mounting a printed circuit board therein, the casing comprising a first internal major surface and a second internal major surface. The cooling module further comprises a chamber defining a second internal volume in fluid communication with the first internal volume. The first and/or second internal major surface comprises a first cavity. The first and/or second internal major surface further comprises a first channel connecting the first cavity to the second internal volume.

The invention relates to a control device for a driver assistance system, wherein the control device comprises a sensor interface via which the control device can be connected to at least one sensor module to receive data from the at least one sensor module, a power processor which is adapted to detect objects and to provide object data based on the data from the at least one sensor module, and a system interface via which the control device can be connected to a higher-level control device of the driver assistance system for forwarding object data provided by the power processor.

The present disclosure refers to methods and electronics used to test immersion cooling controllers. A representative method comprises operably connecting a simulator device to an immersion cooling controller. The simulator device is used to communicate one or more changes to the immersion cooling controller wherein the one or more changes relate to one or more sensed parameters of an immersion cooling system. The reaction of the controller to the one or more changes is compared to an expected reaction of the controller to determine whether the controller is functioning properly. The controller may be configured to control any parameter of an immersion cooling system including, but not limited to, temperature, water flow, pressure, fluid level, fluid purity, and any combination thereof.

The present disclosure refers to methods and electronics used to test immersion cooling controllers. A representative method comprises operably connecting a simulator device to an immersion cooling controller. The simulator device is used to communicate one or more changes to the immersion cooling controller wherein the one or more changes relate to one or more sensed parameters of an immersion cooling system. The reaction of the controller to the one or more changes is compared to an expected reaction of the controller to determine whether the controller is functioning properly. The controller may be configured to control any parameter of an immersion cooling system including, but not limited to, temperature, water flow, pressure, fluid level, fluid purity, and any combination thereof.