A personal laboratory includes a self-contained, miniaturized, portable kit that provides for design, testing, and automated assembling, dissembling, and reassembling of a physical system (rather than a simulation) with flexibility as to the variety of configurations of components that may be designed and assembled, and easy integration of complex components. The personal laboratory includes a reconfigurable system, the reconfigurable system includes a plurality of functional components, and a plurality of connectors configured for operatively connect respective functional components to other functional components; a stimulus generator configured to apply a stimulus to the reconfigurable system; and a measurement system configured to measure a response to the applied stimulus generated by the reconfigurable system. In the context of electronic circuits, the reconfigurable system is a reconfigurable circuit, the functional components are circuit elements and the connectors are electrical connectors.

A method is provided. The method includes: obtaining a parameter value of a determined dimension parameter, an initial parameter value of a dimension parameter to be optimized, and a target capacitance value of an interdigital capacitor; partitioning a geometric structure of the interdigital capacitor to obtain a plurality of sections of the interdigital capacitor, where the plurality of sections are in a one-to-one correspondence with a plurality of coplanar multiple-transmission line models; obtaining a capacitance value expression of the interdigital capacitor based on the plurality of coplanar multiple-transmission line models; determining, based on the parameter value of the determined dimension parameter, the target capacitance value, and the capacitance value expression of the interdigital capacitor, a loss function including the dimension parameter to be optimized; and optimizing, based on the initial parameter value by minimizing the loss function, the parameter value of the dimension parameter to be optimized.

An electronic design flow generates an electronic architectural design layout for analog circuitry from a schematic diagram. The electronic design flow assigns analog circuits of the schematic diagram to various categories of analog circuits. The electronic design flow places various analog standard cells corresponding to these categories of analog circuits into analog placement sites assigned to the analog circuits. These analog standard cells have a uniform cell height which allows these analog standard cells to be readily connected or merged to digital standard cells which decreases the area of the electronic architectural design layout. This uniformity in height between these analog standard cells additionally provides a more reliable yield when compared to non-uniform analog standard cells.

An electronic design flow generates an electronic architectural design layout for analog circuitry from a schematic diagram. The electronic design flow assigns analog circuits of the schematic diagram to various categories of analog circuits. The electronic design flow places various analog standard cells corresponding to these categories of analog circuits into analog placement sites assigned to the analog circuits. These analog standard cells have a uniform cell height which allows these analog standard cells to be readily connected or merged to digital standard cells which decreases the area of the electronic architectural design layout. This uniformity in height between these analog standard cells additionally provides a more reliable yield when compared to non-uniform analog standard cells.

Proposed is a shape design technology for a wireless power transmission system, the shape design system including: a learning module configured to perform learning based on shape information and compensation information input in relation to a design target and generate new shape information; and an analysis module configured to evaluate wireless power transmission performance based on the shape information from the learning module and provide the learning module with a performance evaluation result.

A method for making an electromagnetic band gap structure includes performing a single full wave simulation for the structure using a computer to perform the simulation, extracting a multiple port scattering matrix based on the single full wave simulation using a computer, and measuring or estimating a transmission of waves across the body between a first port and a second port of the body. The body has multiple ports between the first port and the second port that are defined by scattering elements using the computer. The matrix may be reduced to a two by two matrix recursively one dimension at a time using the computer.

A system and method for adding hierarchy to a netlist. A netlist is received and converted into a connected graph. Location parameters for the nodes of the connected graph are mapped onto the connected graph. Landmark structures are identified in the connected graph, wherein identifying includes recording a location associated with each landmark structure. Patterns are searched for in the connected graph, wherein searching proceeds outward from an anchor defined by the location of each of the identified landmark structures.

A semiconductor structure includes a power grid layer (including a first metallization layer) and a set of cells. The first metallization layer includes: conductive first and second portions which provide correspondingly a power-supply voltage and a reference voltage, and which have corresponding long axes oriented substantially parallel to a first direction; and conductive third and fourth portions which provide correspondingly the power-supply voltage and the reference voltage, and which have corresponding long axes oriented substantially parallel to a second direction substantially perpendicular to the first direction. The set of cells is located below the PG layer. Each cell is monostate cell which lacks an input signal and has a single output state. The cells are arranged to overlap at least one of the first and second portions in a repeating relationship with respect to at least one of the first or second portions of the first metallization layer.

A semiconductor structure includes a power grid layer (including a first metallization layer) and a set of cells. The first metallization layer includes: conductive first and second portions which provide correspondingly a power-supply voltage and a reference voltage, and which have corresponding long axes oriented substantially parallel to a first direction; and conductive third and fourth portions which provide correspondingly the power-supply voltage and the reference voltage, and which have corresponding long axes oriented substantially parallel to a second direction substantially perpendicular to the first direction. The set of cells is located below the PG layer. Each cell is monostate cell which lacks an input signal and has a single output state. The cells are arranged to overlap at least one of the first and second portions in a repeating relationship with respect to at least one of the first or second portions of the first metallization layer.

Virtual oscillator control systems, devices, and techniques are provided. One example device includes a processor configured to implement a virtual oscillator circuit and output an oscillating waveform based on the virtual oscillator circuit and power electronics operatively coupled to the processor and configured to convert, based on the oscillating waveform, direct current (DC) electricity to alternating current (AC) electricity. The processor may be further configured to extract, from the virtual oscillator circuit, a virtual current based on an output current of the AC electricity, and output the oscillating waveform further based on an input voltage of the DC electricity.