Apparatus and associated methods relate to generating a wiring schema with more than one safety device sharing at least one test signal through one or more external terminal blocks when the number of terminals required by safety devices exceeds the number of available terminals of a safety controller. In an illustrative example, the method may include determining a total number of terminals A of safety devices to be connected to a safety evaluation device having a number of terminals B. If A is greater than B, the method may then include generating a wiring schema that one or more external terminal blocks may show indicia of electrical connections between an identified set of safety devices and a shared terminal of the safety evaluation device associated with that set. Various embodiments may advantageously expand a number of devices to be connected to the safety evaluation device.

Apparatus and associated methods relate to generating a wiring schema with more than one safety device sharing at least one test signal through one or more external terminal blocks when the number of terminals required by safety devices exceeds the number of available terminals of a safety controller. In an illustrative example, the method may include determining a total number of terminals A of safety devices to be connected to a safety evaluation device having a number of terminals B. If A is greater than B, the method may then include generating a wiring schema that one or more external terminal blocks may show indicia of electrical connections between an identified set of safety devices and a shared terminal of the safety evaluation device associated with that set. Various embodiments may advantageously expand a number of devices to be connected to the safety evaluation device.

An integrated circuit includes a first gate electrode structure extending in a first direction. The integrated circuit includes a second gate electrode structure extending in the first direction and separated in a second direction from the first gate electrode structure. The integrated circuit includes a conductive feature. The conductive feature includes a first section electrically connected to the second portion, a second section electrically connected to the second gate structure, and a third section electrically connecting the first section and the second section, wherein the third section extends in a third direction angled with respect to both the first direction and the second direction.

A system and methods are disclosed that generate a physical roadmap for the connectivity of a network, such as a network-on-chip (NoC). The roadmap includes a set of possible positions for placement of edges and nodes, which are known to be an acceptable and good position for placement of these network elements, that honors the constraints of the network. These known positions are made available to the system for synthesis of the network and generating the connectivity and placement based on the physical roadmap.

A floating body SRAM cell that is readily scalable for selection by a memory compiler for making memory arrays is provided. A method of selecting a floating body SRAM cell by a memory compiler for use in array design is provided.

A floating body SRAM cell that is readily scalable for selection by a memory compiler for making memory arrays is provided. A method of selecting a floating body SRAM cell by a memory compiler for use in array design is provided.

An integrated circuit (IC) chip can include a given core at a position in the IC chip that defines a given orientation, wherein the given core is designed to perform a particular function. The IC chip can include another core designed to perform the particular function. The other core can be flipped and rotated by 180 degrees relative to the given core such that the other core is asymmetrically oriented with respect to the given core. The IC chip can also include a compare unit configured to compare outputs of the given core and the other core to detect a fault in the IC chip.

An integrated circuit (IC) chip can include a given core at a position in the IC chip that defines a given orientation, wherein the given core is designed to perform a particular function. The IC chip can include another core designed to perform the particular function. The other core can be flipped and rotated by 180 degrees relative to the given core such that the other core is asymmetrically oriented with respect to the given core. The IC chip can also include a compare unit configured to compare outputs of the given core and the other core to detect a fault in the IC chip.

A method of making a semiconductor device includes electrically connecting a component to a first side of a first fuse, wherein the first fuse is a first distance from the component. The method further includes electrically connecting the component to a first side of a second fuse, wherein the second fuse is a second distance from the component, and the second distance is different than the first distance. The method further includes electrically connecting a second side of the second fuse to a dummy vertical interconnect segment.

A method of making a semiconductor device includes electrically connecting a component to a first side of a first fuse, wherein the first fuse is a first distance from the component. The method further includes electrically connecting the component to a first side of a second fuse, wherein the second fuse is a second distance from the component, and the second distance is different than the first distance. The method further includes electrically connecting a second side of the second fuse to a dummy vertical interconnect segment.