A computer system includes a mist cooling system. The mist cooling system suspended droplets of dielectric fluid in air to form a mist and conveys the mist to heat producing components of the computer system. The liquid droplets of the mist wet the heat producing components and remove waste heat as part of a phase change from a liquid phase to a vapor phase. Vaporized dielectric fluid is condensed via a heat exchanger in a chassis of the computer system and is returned to a reservoir for use in generating mist.

The instant application pertains to new liquid level monitoring apparatus and a cooling system for computer components that employs the liquid level monitoring apparatus. In one embodiment, the liquid level measurement device comprises a load cell and a buoyancy element. The buoyancy element is configured to be partially submerged in a dielectric liquid. The load cell and the buoyancy element are operably connected such that a change in liquid volume may be determined using Archimedes' principle.

In some examples, a controller for air and liquid cooling of electrical equipment is provided. The controller can include a cooling profile assignment module to assign a hybrid cooling profile based on temperature readings of electrical equipment; an air cooling control module to control a forced airflow cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile; and a liquid cooling control module to control a liquid cooling system for the electrical equipment in accordance with the assigned hybrid cooling profile. The assigned hybrid cooling profile can indicate that the forced airflow cooling system is to be used as a primary cooling system for the electrical equipment unless temperature readings indicate that a heat profile of the electrical equipment is above a thermal threshold.

A computer module includes a substrate having redistribution layers comprising conductors and dielectrics formed on both sides of the substrate. Selected thin film conductors have a half pitch of 2 μm or less. Semiconductor components selected from bare die, chiplets, stacked devices, and low-profile packaged devices are flip chip mounted on the substrate. After grinding and polishing operations, a polished planar surface extends across each side of the substrate, coincident with the back side of the semiconductor components. Copper sheets are bonded to the polished planar surfaces using die attach films. A water-cooled server comprises multiple computer modules disposed in a tank with cooling water circulating around the modules. It dissipates 6.3 MW at a water flow rate of 339 gallons per minute and has a power density of 1 kW/in.sup.3.

A user device that can be touched by a user includes a heat source that can generate heat; a case body covering the heat source; and a polymer-containing heat storage body attached to the case body.

The apparatus for measuring performance of a suspension for cooling a computer processing unit is a measurement and testing tool allowing for the fabrication of new suspensions, and measuring and testing their short-term and long-term thermal performance in real time on any liquid-cooled computer processing unit. The suspension is prepared in a sample receiving reservoir and pumped across the unit, and then input to an air-cooled heat exchanger for recirculation back to the sample receiving reservoir. Temperatures of the working fluid are measured between the sample receiving reservoir and the computer processing unit, between the unit and the heat exchanger, and after output from the heat exchanger. Pressure differentials of the working fluid is measured across the computer processing unit and across the heat exchanger.

The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.

Tool-less apparatus and methods are provided for sealing flow of cooling air from the outlet of a cooling fan blower to the inlet of a heat exchanger within a chassis enclosure of an information handling system. The disclosed apparatus and methods may be implemented in a tool-less manner by employing tool-less chassis mounting features that mate with tool-less cooling fan mounting features to mechanically align and secure an air outlet of a cooling fan blower in sealing relationship with an air inlet of a heat exchanger within a chassis enclosure of an information handling system by properly aligning the axes of a cooling fan in relation to the inlet of the heat exchanger so that in on embodiment no gap exists between the cooling air outlet of the cooling fan and the cooing air inlet of the heat exchanger.

A system and method for cooling components and a chassis in a portable information handling system includes a pressure barrier that divides the chassis into a plurality of zones, an evacuative fan in a first zone to generate airflow across components to cool the components and a hyperbaric fan in a second zone to increase air pressure in the second zone. The pressure barrier may provide thermal isolation, acoustic dampening and electromagnetic insulation. A controller communicatively coupled to the fans can operate each fan independently to cool components for improved performance and maintain a surface temperature of the chassis below a temperature for user comfort.

A data processor cartridge comprising a housing to accommodate two data processor assemblies, and further comprising: a first connector (2A) to receive a first data processor assembly (10); and a second connector (2B) to receive a second data processor assembly (11); and wherein the second connector (2B) is arranged to receive the second data processor in an inverted orientation as compared to the orientation in which the first connector receives the first data processor assembly.