Patent classifications
G06F2200/203
HINGED DIMM COOLING DEVICE
A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.
Graphite thermal conduit spring
A portable information handling system transfers thermal energy associated with operation of processing components between rotationally coupled housing portions through a thermal spreader disposed between the housing portions, such as a sheet having one or more layers of graphite. A tensioning assembly engages the thermal sheet to manage excess material associated with varying rotational orientations of the housing portions.
Graphite thermal conduit spring
A portable information handling system transfers thermal energy associated with operation of processing components in a main housing portion through a graphite torsion spring formed from a graphite sheet by cutting arms to extend out of opposing corners of a central portion and rolling the central portion about a central axis. The graphite torsion spring passes thermal energy between the housing portions with the spring releasing tension as the housing portions rotate from a closed to an open position and the central axis disposed about a hinge pin that couples the housing portions to each other.
Portable electronic device
A portable electronic device including a first body, a second body, a pivot element, a heat source, a first flexible heat conductive element, and a flip cover is provided. The pivot element is connected to the second body, and the second body is pivotally connected to the first body through the pivot element. The heat source is disposed in the first body. The first flexible heat conductive element is thermally coupled to the heat source and extends toward the pivot element from the heat source. The first flexible heat conductive element passes through the pivot element and extends into the inside of the second body and is thus thermally coupled to the second body. The flip cover is pivotally connected to the first body and located on a moving path of the pivot element.
CONDUCTING HEAT THROUGH A HINGE
Examples are disclosed that relate to heat transfer devices comprising a vapor chamber and a flexible hinge. One disclosed example provides an electronic device comprising a first portion and a second portion connected by a hinge region, and a vapor chamber extending from the first portion to the second portion across the hinge region, the vapor chamber comprising a first layer comprising titanium, a second layer comprising titanium joined to the first layer to form the vapor chamber, a working fluid within the vapor chamber, and a third layer comprising titanium positioned between the first layer and the second layer, the third layer comprising one or more features configured to conduct the working fluid via capillary action.
INFORMATION HANDLING SYSTEM DYNAMIC THERMALTRANSFER CONTROL
A portable information handling system transfers thermal energy associated with operation of a CPU to a location distal the CPU with a vapor chamber thermally interfaced with the CPU. A pressure adapter interfaced with the vapor chamber selectively changes the pressure within the vapor chamber to adjust the saturation point of a liquid in the vapor chamber that manages thermal transfer efficiency. For example, a controller interfaced with the pressure adapter modifies thermal transfer characteristics of the vapor chamber to control thermal conditions at the information handling system, such as in response to a temperature sensed at a housing surface, a battery, a display or at other locations of the information handling system.
GRAPHITE THERMAL CONDUIT SPRING
A portable information handling system transfers thermal energy associated with operation of processing components between rotationally coupled housing portions through a thermal spreader disposed between the housing portions, such as a sheet having one or more layers of graphite. A tensioning assembly engages the thermal sheet to manage excess material associated with varying rotational orientations of the housing portions.
INFORMATION HANDLING SYSTEM THERMAL FLUID HINGE
A portable information handling system transfers thermal energy associated with operation of processing components in a first housing portion to a thermal exchanger in a second housing portion through a hinge that rotationally couples the first and second housing portions. The hinge has first and second axles that each define a channel. Fluid heated at the first housing portion passes through the channel to the thermal exchanger where thermal energy is rejected from the system. In one embodiment, a second hinge having first and second axles that each define a channel provides a return path for the fluid from the second housing portion to the first housing portion.
GRAPHITE THERMAL CONDUIT SPRING
A portable information handling system transfers thermal energy associated with operation of processing components in a main housing portion through a graphite torsion spring formed from a graphite sheet by cutting arms to extend out of opposing corners of a central portion and rolling the central portion about a central axis. The graphite torsion spring passes thermal energy between the housing portions with the spring releasing tension as the housing portions rotate from a closed to an open position and the central axis disposed about a hinge pin that couples the housing portions to each other.
INFORMATION HANDLING SYSTEM THERMALLY CONDUCTIVE HINGE
A portable information handling system transfers thermal energy associated with operation of a CPU from a main housing portion to a lid housing portion with thermal conduction through a hinge assembly that rotationally couples the main and lid housing portions to each other. For example, thermal conduits insert into a hinge body and transfer thermal energy across the hinge body through a thermally conductive interface, such as the hinge body itself, thermal grease disposed in the hinge body, a liquid that fills a cavity of the hinge body shared by the thermal conduits, and a vapor chamber integrated in the hinge body.