A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include a substrate, a main die that is mounted on the substrate, and multiple transceiver daughter dies that are mounted on the substrate and that are coupled to the main die via corresponding Embedded Multi-die Interconnect Bridge (EMIB) interconnects formed in the substrate. Each of the main die and the daughter dies may include configurable adapter circuitry for interfacing with the EMIB interconnects. The adapter circuitry may include FIFO buffer circuits operable in a 1× mode or 2× mode and configurable in a phase-compensation mode, a clock-compensation mode, an elastic mode, and a register bypass mode to help support a variety of communications protocols with different data width and clocking requirements. The adapter circuitry may also include boundary alignment circuitry for reconstructing (de)compressed data streams.

An apparatus for managing input/output (I/O) data may include a streaming I/O controller to receive data from a load/store domain component and output the data as first streaming data of a first data type comprising a first data movement type and first data format type. The apparatus may also include at least one accelerator coupled to the streaming I/O controller to receive the first streaming data, transform the first streaming data to second streaming data having a second data type different than the first data type, and output the second streaming data. In addition, the apparatus may include a streaming interconnect to conduct the second data to a peer device configured to receive data of the second data type.

A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

Method and system embodying the method for a direct memory access between a data storage and a data processing device via one or more direct memory access units, comprising transferring data between the data storage and a first direct memory access engine of a respective one or more direct memory access units and providing the data for a second direct memory access engine of the respective one or more direct memory access units; and transferring the data provided by the first direct memory access engine by a second direct memory access engine to the data processing device via the second direct memory access engine is disclosed.

Integrated circuit packages with multiple integrated circuit dies are provided. A multichip package may include a substrate, a main die that is mounted on the substrate, and multiple transceiver daughter dies that are mounted on the substrate and that are coupled to the main die via corresponding Embedded Multi-die Interconnect Bridge (EMIB) interconnects formed in the substrate. Each of the main die and the daughter dies may include configurable adapter circuitry for interfacing with the EMIB interconnects. The adapter circuitry may include FIFO buffer circuits operable in a 1× mode or 2× mode and configurable in a phase-compensation mode, a clock-compensation mode, an elastic mode, and a register bypass mode to help support a variety of communications protocols with different data width and clocking requirements. The adapter circuitry may also include boundary alignment circuitry for reconstructing (de)compressed data streams.

Embodiments generally relate to a memory device. In one embodiment, the memory device includes a clock receiver circuit that receives an external clock signal and provides an internal clock signal. The memory device also includes a delay-locked loop circuit (DLL) having an input, and a circuit that receives the internal clock signal. The circuit selects which pulses of the internal clock signal are applied to the input of the DLL, such that no more than two clock pulses selected from at least three consecutive pulses of the external clock signal are applied to the input of the DLL during a predetermined interval. In another embodiment, a method includes receiving an external clock signal at a clock receiver circuit, receiving an internal clock signal from the clock receiver circuit, and selecting which pulses of the internal clock signal are applied to an input of a DLL, where no more than two clock pulses selected from at least three consecutive pulses of the external clock signal are applied to the input of the DLL during a predetermined interval.

A semiconductor device includes a memory circuit, a first FIFO, a second FIFO and an input/output circuit. The memory circuit outputs data. The first FIFO receives data from the memory circuit and outputs data synchronously with a first clock signal. The second FIFO receives data output from the first FIFO and outputs data synchronously with the first clock signal. The input/output circuit outputs data output from the second FIFO. The second FIFO is disposed in the vicinity of the input/output circuit than the first FIFO.

An example method of flow control between remote hosts and a target system over a front-end fabric, the target system including a nonvolatile memory (NVM) subsystem coupled to a back end fabric having a different transport than the front-end fabric is described. The method includes receiving commands from the remote hosts at a controller in the target system for the NVM subsystem. The method further includes storing the commands in a first-in-first-out (FIFO) shared among the remote hosts and implemented in memory of the target system. The method further includes updating virtual submission queues for the remote hosts based on the commands stored in the FIFO. The method further includes providing the commands to the NVM subsystem from the FIFO.

A system, method and computer readable medium for operating a First In, First Out (FIFO) buffer that transfers data between a host and a plurality of endpoints using chip select is disclosed. The method includes receiving a current value of a read pointer and a status for an active endpoint and reading data at a location to which the read pointer points and setting a tag associated with the location to which the read pointer points to indicate availability.