A tiled display device includes a first display substrate including a plurality of light emitting areas defined by one or more banks, a second display substrate adjacent to the first display substrate and including a plurality of light emitting areas, a coupling member coupling the first display substrate and the second display substrate, and a color conversion substrate including a plurality of light transmitting areas corresponding to the plurality of light emitting areas of each of the first display substrate and the second display substrate, and a plurality of light blocking areas between the plurality of light transmitting areas and corresponding to the one or more banks or the coupling member.

A tiled display device includes a first display substrate including a plurality of light emitting areas defined by one or more banks, a second display substrate adjacent to the first display substrate and including a plurality of light emitting areas, a coupling member coupling the first display substrate and the second display substrate, and a color conversion substrate including a plurality of light transmitting areas corresponding to the plurality of light emitting areas of each of the first display substrate and the second display substrate, and a plurality of light blocking areas between the plurality of light transmitting areas and corresponding to the one or more banks or the coupling member.

An LED board includes a flexible printed circuit and multiple LED-mounted parts arrayed on the circuit board at regular intervals in a constant direction. The LED-mounted parts each include multiple LEDs. The circuit board includes LED portions including the LED-mounted parts and non-LED portions including no LED-mounted parts that are arrayed alternately. The LED-mounted parts each have, in an array direction in which the LED-mounted parts are arrayed, a dimension equal to an interval between adjacent LED-mounted parts of the arrayed LED-mounted parts. A surface emitter includes multiple LED boards fitted together, with LED-mounted parts on each LED board overlapping non-LED portions of an adjacent LED board of the LED boards. The LED board and the surface emitter with the above structures easily upsize a video display device.

Provided is a display apparatus including a screen portion in which unit panels in which a plurality of pixels formed from light-emitting elements is disposed are arranged, in which a first pixel-to-pixel pitch that is a space between two outer end pixels adjacent to each other across outer peripheries of the unit panels is equal to or larger than a second pixel-to-pixel pitch that is a space between each of the outer end pixels in each of the unit panels and a pixel adjacent to the outer end pixel, and the pixel-to-pixel pitches adjacent to each other in the array of the pixel-to-pixel pitches in a direction in which the first pixel-to-pixel pitch and the second pixel-to-pixel pitch are arranged in the unit panel are set to be P(in)≤P(out) where P(in) denotes the pixel-to-pixel pitch located on a central side of the unit panel and P(out) denotes the pixel-to-pixel pitch located on an outer peripheral side of the unit panel.

A repairing component including a micro-LED chip including an electrode and having an electrode plane on which the electrode is disposed, and an anisotropic conductive layer disposed to be in contact with the electrode disposed on the electrode plane of the micro-LED chip, where the anisotropic conductive layer has an area matching with an area of the electrode plane.

According to one embodiment, an electronic device includes an insulating base including a first portion which is stretchable and a second portion which is adjacent to the first portion and is stretchable, the first portion and the second portion being integrally formed, and electrical elements disposed in the first portion and the second portion, respectively. A first elongation rate of the first portion is different from a second elongation rate of the second portion.

According to one embodiment, a display device includes a first insulating substrate including a first surface, a second surface on an opposite side to the first surface and a concave portion located in the second surface, and a first light-emitting element and a second light-emitting element, located in the concave portion, and an inner wall of the concave portion includes a first inclined area and a second inclined area opposing the first inclined area, the first light-emitting element being located on the first inclined area, and the second light-emitting element being located on the second inclined area.

An electronic device able to be operated with a first state and a second state includes a substrate and light emitting units. When the electronic device is extended along a direction from the first state to the second state, the substrate has a first width in the first state and a second width in the second state in the direction, and the second width is greater than the first width. The light emitting units are disposed on the substrate and can be in a mode of ON. The number of the light emitting units being in the mode of ON in the second state is greater than that in the first state. The numbers of the light emitting units being in the mode of ON per unit area of the substrate while in the first state and second state are respectively defined as PPA_1 and PPA_2, and 1.5×PPA_1≥PPA_2≥0.5×PPA_1.

The present invention relates to an LED element substrate on which an LED element is to be provided and which includes a glass, in which at least one main surface of the substrate is black, and one or more LED elements are to be provided on the black main surface, and relates to an LED element substrate on which an LED element is to be provided and which includes a glass, in which at least one main surface of the substrate is black, the substrate comprises a plurality of holes, and one or more LED elements are to be provided on an inside of each of the holes.

A tiling display apparatus including a substrate, multiple display units, an adhesive layer and multiple driver chips is provided. The display units are disposed on the substrate and each has a circuit substrate, multiple light emitting devices and at least one bonding pad. The circuit substrate has a first surface and a second surface opposite to each other. The light emitting devices are disposed on the first surface. The at least one bonding pad is disposed on the second surface, and is electrically coupled to the light emitting devices. The adhesive layer connects the substrate and the display units. The substrate and the adhesive layer have a plurality of openings arranged corresponding to the openings. Multiple bonding pads of the display units are positioned in the openings. The driver chips are electrically bonded to the bonding pads of the display units through the openings.