A magnetic head includes a main pole configured to serve as a first electrode, an upper pole containing a trailing magnetic shield configured to a serve as a second electrode, and an electrically conductive portion located in a trailing gap between the main pole and the trailing magnetic shield. The electrically conductive portion is not part of a spin torque oscillator stack, and the electrically conductive portion includes at least one electrically conductive, non-magnetic material layer. The main pole and the trailing magnetic shield are electrically shorted by the electrically conductive portion across the trailing gap between the main pole and the trailing magnetic shield such that an electrically conductive path is present between the main pole and the trailing magnetic shield through the electrically conductive portion.

A magnetic head includes a main pole configured to serve as a first electrode, an upper pole containing a trailing magnetic shield configured to a serve as a second electrode, and an electrically conductive portion located in a trailing gap between the main pole and the trailing magnetic shield. The electrically conductive portion is not part of a spin torque oscillator stack, and the electrically conductive portion includes at least one electrically conductive, non-magnetic material layer. The main pole and the trailing magnetic shield are electrically shorted by the electrically conductive portion across the trailing gap between the main pole and the trailing magnetic shield such that an electrically conductive path is present between the main pole and the trailing magnetic shield through the electrically conductive portion.

A head gimbal assembly (HGA) for a hard disk drive includes a primary dimple having a secondary structure protruding from the primary dimple, where a flexure is movably coupled with a load beam via the primary dimple, and where the secondary structure is configured to restrict the point of contact between the load beam and the flexure. Such an arrangement avoids any shift in the axis of rotation of the flexure, and the attached slider, due to any undesirable protrusion from the primary dimple which may arise in the manufacturing process. Examples of secondary structures include a micro-dimple, a ridge, and an embedded mass of material.

The present disclosure generally relates to a magnetic media drive employing a magnetic recording head. The magnetic recording head comprises a main pole, a hot seed layer, and a write assist stack disposed between the main pole and the hot seed layer. In one embodiment, the write assist stack comprises a seed layer, a spin torque layer, and a notch layer. One or more of the seed layer and the notch layer have a first cross-track width and the spin torque layer has a second cross-track width less than the first cross track width. In another embodiment, the write assist stack comprises a seed layer, a spin polarization layer, and a notch layer. One or more of the seed layer and the notch layer have a first cross-track width and the spin polarization layer has a second cross-track width less than the first cross track width.

The present disclosure generally relates to a magnetic media drive employing a magnetic recording head. The magnetic recording head comprises a main pole, a hot seed layer, and a write assist stack disposed between the main pole and the hot seed layer. In one embodiment, the write assist stack comprises a seed layer, a spin torque layer, and a notch layer. One or more of the seed layer and the notch layer have a first cross-track width and the spin torque layer has a second cross-track width less than the first cross track width. In another embodiment, the write assist stack comprises a seed layer, a spin polarization layer, and a notch layer. One or more of the seed layer and the notch layer have a first cross-track width and the spin polarization layer has a second cross-track width less than the first cross track width.

A method includes immersing a wafer in an electrolyte including a plurality of compounds having elements of a high damping magnetic alloy with very low impurity and small uniform grain size. The method also includes applying a pulsed current with a certain range of duty cycle and pulse length to the wafer when the wafer is immersed in an electrolyte. The wafer is removed from the electrolyte when a layer of the high damping magnetic alloy is formed on the wafer.

A method includes immersing a wafer in an electrolyte including a plurality of compounds having elements of a high damping magnetic alloy with very low impurity and small uniform grain size. The method also includes applying a pulsed current with a certain range of duty cycle and pulse length to the wafer when the wafer is immersed in an electrolyte. The wafer is removed from the electrolyte when a layer of the high damping magnetic alloy is formed on the wafer.

According to one embodiment, a magnetic head includes first and second magnetic poles, and a stacked body provided between the first and second magnetic poles. The stacked body includes a first magnetic layer, a second magnetic layer provided between the second magnetic pole and the first magnetic layer, a third magnetic layer provided between the second magnetic pole and the second magnetic layer, a first non-magnetic layer provided between the first magnetic layer and the first magnetic pole, a second non-magnetic layer provided between the second and first magnetic layers, a third non-magnetic layer provided between the third and second magnetic layers, and a fourth non-magnetic layer provided between the second magnetic pole and the third magnetic layer. A thickness of the first magnetic layer is thicker than a thickness of the second magnetic layer. A thickness of the third magnetic layer is thicker than the second layer thickness.

According to one embodiment, a disk device includes a recording medium, a first magnetic head, a first wiring member, a flexible printed circuit board, and a wire. The first wiring member is electrically connected to the first magnetic head. The flexible printed circuit board includes a surface, a first fixed part fixed to a first component, and a second fixed part fixed to a second component, and is electrically connected to the first magnetic head through the first wiring member. The wire on the flexible printed circuit board extends along the surface such that the wire extends between the first fixed part and the second fixed part in a direction intersecting at an angle of lager than 45 degrees and not larger than 90 degrees with an extending direction of a virtual shortest line that connects the first fixed part to the second fixed part along the surface.

According to one embodiment, a disk device includes a recording medium, a first magnetic head, a first wiring member, a flexible printed circuit board, and a wire. The first wiring member is electrically connected to the first magnetic head. The flexible printed circuit board includes a surface, a first fixed part fixed to a first component, and a second fixed part fixed to a second component, and is electrically connected to the first magnetic head through the first wiring member. The wire on the flexible printed circuit board extends along the surface such that the wire extends between the first fixed part and the second fixed part in a direction intersecting at an angle of lager than 45 degrees and not larger than 90 degrees with an extending direction of a virtual shortest line that connects the first fixed part to the second fixed part along the surface.