Provided herein is an apparatus comprising a deposition chamber with a cathode, and a means for creating an asymmetric field about the cathode.

Provided herein is an apparatus comprising a deposition chamber with a cathode, and a means for creating an asymmetric field about the cathode.

Various apparatuses, systems, methods, and media are disclosed for heat-assisted magnetic recording (HAMR) that includes a HAMR medium with a seed-thermal barrier structure. The seed-thermal barrier structure is positioned between a heat sink layer and a magnetic recording layer. In some examples, the seed-thermal barrier structure has a first layer including MgOTiO (MTO), a second layer including TiN on the first layer, a third layer on the second layer, and a fourth layer including MTO on the third layer. The third layer, in some examples, includes at least one of: RuAl, Pt, PtZr, PtTa, Rh, FePt, CrMo, or Cr.

Various apparatuses, systems, methods, and media are disclosed for heat-assisted magnetic recording (HAMR) that includes a HAMR medium with a seed-thermal barrier structure. The seed-thermal barrier structure is positioned between a heat sink layer and a magnetic recording layer. In some examples, the seed-thermal barrier structure has a first layer including MgOTiO (MTO), a second layer including TiN on the first layer, a third layer on the second layer, and a fourth layer including MTO on the third layer. The third layer, in some examples, includes at least one of: RuAl, Pt, PtZr, PtTa, Rh, FePt, CrMo, or Cr.

There is provided a substrate processing system comprising: a plurality of transfer modules having transfer mechanisms configured to transfer substrates; and a plurality of process modules connected to the plurality of transfer modules. The transfer mechanisms of the plurality of transfer modules transfer a plurality of substrates sequentially and serially to the plurality of process modules, and each of the plurality of transfer modules has an aligner configured to align a substrate when transferring the substrate to the process module connected to a relevant transfer module.

There is provided a substrate processing system comprising: a plurality of transfer modules having transfer mechanisms configured to transfer substrates; and a plurality of process modules connected to the plurality of transfer modules. The transfer mechanisms of the plurality of transfer modules transfer a plurality of substrates sequentially and serially to the plurality of process modules, and each of the plurality of transfer modules has an aligner configured to align a substrate when transferring the substrate to the process module connected to a relevant transfer module.