The present invention relates to the field of tape drives, tape transport, tape heads and tape head suspension. More particularly, the present invention is related to magnetic tape data storage and tape recorders that include components designed to minimize or eliminate head-to-tape contact to reduce or eliminate wear and contamination of tape drive heads. Methods and apparatus of the present invention may dynamically control the head-to-media spacing by moving locations of magnetic heads relative to a tape. Such apparatus may include components designed to minimize magnetic spacing. This may be accomplished using actuators that move the magnetic heads, that move the tape, or that move both the magnetic heads and the tape. This may include supporting a back surface of the tape. Alternatively, or additionally, the movement of the tape past the magnetic heads may be performed using mechanisms that contact and drive the back surface of the tape.

The present invention relates to the field of tape drives, tape transport, tape heads and tape head suspension. More particularly, the present invention is related to magnetic tape data storage and tape recorders that include components designed to minimize or eliminate head-to-tape contact to reduce or eliminate wear and contamination of tape drive heads. Methods and apparatus of the present invention may dynamically control the head-to-media spacing by moving locations of magnetic heads relative to a tape. Such apparatus may include components designed to minimize magnetic spacing. This may be accomplished using actuators that move the magnetic heads, that move the tape, or that move both the magnetic heads and the tape. This may include supporting a back surface of the tape. Alternatively, or additionally, the movement of the tape past the magnetic heads may be performed using mechanisms that contact and drive the back surface of the tape.

An apparatus, according to one embodiment, includes a substrate and a closure above the substrate. A gap is positioned between the closure and the substrate, the gap having an array of magnetic transducers extending therealong and unpatterned films. The gap further includes a first layer of a first material having a bulk modulus of elasticity lower than the unpatterned films in the gap. An apparatus according to another embodiment includes a plurality of magnetic transducers arranged in a linear array, and a layer of an expansion material between each adjacent pair of magnetic transducers in the array. An encapsulant is positioned between each layer of the expansion material and the adjacent magnetic transducers. The expansion material has a greater coefficient of thermal expansion than the encapsulant.

An apparatus, according to one embodiment, includes a substrate and a closure above the substrate. A gap is positioned between the closure and the substrate, the gap having an array of magnetic transducers extending therealong and unpatterned films. The gap further includes a first layer of a first material having a bulk modulus of elasticity lower than the unpatterned films in the gap. An apparatus according to another embodiment includes a plurality of magnetic transducers arranged in a linear array, and a layer of an expansion material between each adjacent pair of magnetic transducers in the array. An encapsulant is positioned between each layer of the expansion material and the adjacent magnetic transducers. The expansion material has a greater coefficient of thermal expansion than the encapsulant.

An apparatus, according to one embodiment, includes a module having an array of transducers, and a thermoelectric cooling element positioned proximate to the array of transducers. An apparatus, according to one embodiment, includes a module having an array of transducers, a thermoelectric cooling element positioned proximate to the array of transducers, and a heating element positioned proximate to the array of transducers. A method of maintaining a span of an array of transducers of module to a specification, according to one embodiment, includes determining whether the span of the array of transducers in a module is different than a target based on a specification. In response to determining the span is greater than the target, a control signal is applied to a thermoelectric cooling element positioned proximate to the span of the array of transducers for contracting the span of the array of transducers toward the target.

An apparatus, according to one embodiment, includes a module having an array of transducers, and a thermoelectric cooling element positioned proximate to the array of transducers. An apparatus, according to one embodiment, includes a module having an array of transducers, a thermoelectric cooling element positioned proximate to the array of transducers, and a heating element positioned proximate to the array of transducers. A method of maintaining a span of an array of transducers of module to a specification, according to one embodiment, includes determining whether the span of the array of transducers in a module is different than a target based on a specification. In response to determining the span is greater than the target, a control signal is applied to a thermoelectric cooling element positioned proximate to the span of the array of transducers for contracting the span of the array of transducers toward the target.

At least one jack screw from a tape deck base may be removed. The tape deck base may be below a rigid support base that includes a rigid support shaft in the center of the rigid support base. A piezoelectric stack may be inserted where the at least one jack screw was removed from the tape deck base. The piezoelectric stack may tilt a tape guide roller bearing in a skew direction to improve the motion of tape in a tape path.

At least one jack screw from a tape deck base may be removed. The tape deck base may be below a rigid support base that includes a rigid support shaft in the center of the rigid support base. A piezoelectric stack may be inserted where the at least one jack screw was removed from the tape deck base. The piezoelectric stack may tilt a tape guide roller bearing in a skew direction to improve the motion of tape in a tape path.

In one embodiment, an apparatus includes a module having: an array of transducers formed in thin film structure on a substrate, the array being positioned along a tape bearing surface of the module, and a heating element positioned in the thin film structure and recessed from the tape bearing surface. An apparatus, according to another embodiment, includes a module having an array of transducers formed on a substrate, the array being positioned along a tape bearing surface of the module between skiving edges thereof. A slot is formed in the substrate adjacent one of the skiving edges. A heating element is positioned in the slot.

In one embodiment, an apparatus includes a module having: an array of transducers formed in thin film structure on a substrate, the array being positioned along a tape bearing surface of the module, and a heating element positioned in the thin film structure and recessed from the tape bearing surface. An apparatus, according to another embodiment, includes a module having an array of transducers formed on a substrate, the array being positioned along a tape bearing surface of the module between skiving edges thereof. A slot is formed in the substrate adjacent one of the skiving edges. A heating element is positioned in the slot.