Provided is a heat-dissipating, shock-absorbing structure which is applicable to an electronic module with a hard disk drive. The heat-dissipating, shock-absorbing structure includes a heat-dissipating frame, an elastomer, and a plurality of heat conduction layers. The heat-dissipating frame has a fixing segment and two extending segments. The extending segments connect with two ends of the fixing segment. The fixing segment connects with one side of the hard disk drive. The distance between the extending segments is greater than the thickness of the hard disk drive. At least a portion of the elastomer is disposed at the extending segments. The heat conduction layers cover the elastomer.

Methods, apparatuses, and systems related to a memory device are described. The memory device may include a non-volatile (NV) memory and a controller. The controller may be configured to predict a temperature of the NV memory based on a real-time temperature of the controller. Based on the predicted temperature of the NV memory, the controller may execute a remedial action to reduce an actual temperature of the NV memory for executing an upcoming operation.

A storage device carrier system includes a carrier assembly configured to releasably engage a storage device and configured to be releasably received within a storage device bay within an IT component. An electrical coupler assembly is configured to electrically couple the storage device to the IT component. A thermal sealing assembly is configured to reduce the leakage of cooling air from around the storage device carrier system.

A data storage enclosure for storing data on digital storage media has a lid that secures to a base. The enclosure has an upper insulating block that is located adjacent the lid and a lower insulating block that is located in the base. Each insulating block has a corresponding cover that overlays and protects its respective block. A storage unit has outer thermal management layers and a center layer located therebetween. The thermal management layers each contain a corresponding heat absorber that absorbs energy and changes from solid to liquid as the temperature of the storage unit begins to rise to excessive temperatures. The center layer contains a digital storage drive that is connected to a flexible cable that is connected to a sacrificial connector. When assembled, the insulating blocks and covers constrain and hold the storage unit and flexible cable.

Methods, apparatuses, and systems related to a memory device are described. The memory device may include a non-volatile (NV) memory and a controller. The controller may be configured to predict a temperature of the NV memory based on a real-time temperature of the controller. Based on the predicted temperature of the NV memory, the controller may execute a remedial action to reduce an actual temperature of the NV memory for executing an upcoming operation.

A data storage device includes a heat source including a memory, and an enclosure within which the heat source is installed. The data storage device also includes a heat spreader within the enclosure and surrounding the heat source. The data storage device further includes a thermal interface material within the enclosure. The thermal interface material is coupled to the heat source and to the heat spreader, thereby providing a first low thermal resistance path between the heat source and the heat spreader. A phase change material is coupled to the thermal interface material such that the thermal interface material provides a second low thermal resistance path between the heat source and the phase change material.

Provided is a PSA sheet having excellent moisture resistance with reduced gas emission.

The sheet body provided by this invention is a laminate sheet body having a PSA layer on at least one face. The sheet body has a moisture permeability of less than 90 g/cm.sup.2 per 24 hour measurement period in in-plane direction of bonding interface of PSA layer, with the sheet body having an internal volume (bulk) forming a permeation channel that has a prescribed length of 2.5 mm, the moisture permeability determined based on a modified MOCON method, at a permeation cell temperature of 40 C., with humidistat gas at a temperature of 40 C. and 90% relative humidity supplied to a wet chamber. It also has an amount of thermally released gas of 10 g/cm.sup.2 or less, determined at 130 C., over 30 minutes, by gas chromatography/mass spectrometry.

A socket includes a housing configured to receive a removable Data Storage Device (DSD) and a Thermal Interface Material (TIM). An assembly of the socket is attached to the housing and configured to expand due to heat. In a thermally expanded state, the assembly causes the TIM to come into contact with the removable DSD to draw heat away from the removable DSD. According to another aspect, a retaining strip or assembly is attached to a housing in a configuration such that the retaining strip or assembly expands due to heat to increase a resistance to removal of the removable DSD from the housing when the retaining strip or assembly is in a thermally expanded state.

Provided is a PSA composition capable of achieving excellent moisture resistance.

The PSA composition provided by the present invention comprises a polymer A and a polymer B different from the polymer A. In each of the polymer A and the polymer B, isobutylene is polymerized at a ratio of 50% by weight or higher.

A video coder is configured to form, in a symmetric motion vector difference mode, a List 0 (L0) base vector using a L0 Advanced Motion Vector Prediction (AMVP) candidate list and a List 1 (L1) base vector using a L1 AMVP candidate list; determine a refined L0 motion vector and a refined L1 motion vector by performing a decoder-side motion vector refinement process that refines the L0 base vector and the L1 base vector; and use the refined L0 motion vector and the refined L1 motion vector to determine a prediction block for a current block of a current picture of the video data.