According to one embodiment, a disk device includes a housing including a bottom wall including a protrusion with a first surface, a recording medium arranged in the housing, a printed circuit board attached to the bottom wall, an electronic component mounted on the printed circuit board and including a second surface facing the first surface, and a radiation sheet including a third surface which is contact with the first surface, and a fourth surface which is in contact with the second surface. An area of the first surface is less than an area of the third surface of the radiation sheet, or an area of the second surface is less than an area of the fourth surface of the radiation sheet.

A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of at least one material that is a thermally conductive plastic that combines to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.

A determination is made whether read/write is enabled within the tape drive storage unit. In response to determining that read/write is enabled, a determination is made whether a temperature within the tape drive storage unit exceeds a threshold value. In response to determining that the temperature within the tape drive storage unit exceeds the threshold value, a determination is made of a direction of travel of a tape media within the tape drive storage unit. In response to determining that the direction of travel is a forward direction, a first cooling device is powered on. The first cooling device lowers the temperature of a first guide roller and the tape media coming off a first tape storage reel prior to the tape media passing by a read/write head within the tape drive storage unit.

A tape drive includes a housing defining an internal volume, a heat-generating element disposed within the internal volume, a thermally-conductive element, a first end of the thermally-conductive element in thermal communication with the heat-generating element, and a heat dissipation unit disposed in an external volume outside of the internal volume, wherein a second end of the thermally-conductive element is disposed in the external volume and is in thermal communication with the heat dissipation unit.

The present disclosure relates to a chassis and a heat sink for use in the chassis. Disks in rows are arranged in the chassis, and the heat sink comprises an air ingress channel extending from a first end of a housing of the chassis to a side portion of the disks away from the first end; an air egress channel extending from the first end to a second end opposite to the first end, the air egress channel being spaced apart from the air ingress channel by the disks; an intermediate channel comprised of gaps between the disks and fluidically communicating the air ingress channel with the air egress channel; and a fan disposed in the air egress channel and being operable to form a negative pressure in the air egress channel.

A data storage library includes an array of drive slots each configured to receive a data storage drive therein. The data storage library also includes a nozzle for creating an air curtain across a front of the array of drive slots and a fan for creating an airflow through the nozzle. A method includes selectively instructing a fan to create an airflow through a nozzle for creating an air curtain across a front of an array of drive slots in the data storage library. A computer program product is configured to perform the foregoing method.

Provided herein is an apparatus including a disk drive base, wherein the disk drive base includes a first metal composition with a first CTE (coefficient of thermal expansion). A disk drive cover is attached to the disk drive base, wherein the disk drive cover includes a second metal composition with a second CTE that are different from the first metal composition and the first CTE. An arm is connected to a reader and a writer, wherein the arm is coupled to the disk drive base, the reader and the writer are separated by a distance, and the distance affects an MR (magnetoresistive) offset. In response to temperature changes between 0 C. and 60 C., the first material and the second material expand and contract comparably and proportionally. In further response to the temperature changes between 0 C. and 60 C., a change in the MR offset is less than 10% or a preferably defined range of a track pitch on a recording medium attached to the disk drive base.

A data storage enclosure for storing data on digital storage media has a lid that secures to a base. The enclosure has an upper insulating block that is located adjacent the lid and a lower insulating block that is located in the base. Each insulating block has a corresponding cover that overlays and protects its respective block. A storage unit has outer thermal management layers and a center layer located therebetween. The thermal management layers each contain a corresponding heat absorber that absorbs energy and changes from solid to liquid as the temperature of the storage unit begins to rise to excessive temperatures. The center layer contains a digital storage drive that is connected to a flexible cable that is connected to a sacrificial connector. When assembled, the insulating blocks and covers constrain and hold the storage unit and flexible cable.

A socket includes a housing configured to receive a removable Data Storage Device (DSD) and a Thermal Interface Material (TIM). An assembly of the socket is attached to the housing and configured to expand due to heat. In a thermally expanded state, the assembly causes the TIM to come into contact with the removable DSD to draw heat away from the removable DSD. According to another aspect, a retaining strip or assembly is attached to a housing in a configuration such that the retaining strip or assembly expands due to heat to increase a resistance to removal of the removable DSD from the housing when the retaining strip or assembly is in a thermally expanded state.

An apparatus for mounting a hard disk drive unit and an optical disk drive unit to an electronic device includes a supporting bracket defining an accommodating space for the hard disk drive unit and the optical disk drives unit and a clip. The supporting bracket includes a connecting plate and a resilient latching member attached to the connecting plate and located within the connecting plate. The clip corresponds to the resilient latching member and is configured to be attached to the optical disk drive unit. The resilient latching member is switchable between a clip-locking position and a clip-unlocking position.