Various embodiments provide for active suppression circuitry. The active suppression circuitry can be used with a circuit for a memory system, such as a dual data rate (DDR) memory system. For example, some embodiments provide an active suppression integrated circuit. The active suppression integrated circuit can be used by a memory system to efficiently suppress power supply noise caused by resonance of a power delivery network (PDN) of the memory system, thereby improving power integrity of the memory system input/output.

Disclosed are a non-volatile memory device, a memory system including the same and a read method of the memory system, in which the non-volatile memory device includes a first storage in which a basic offset level for a read retry operation is stored, a second storage in which an additional offset level for the read retry operation is stored, and a voltage generator suitable for adjusting, when the read retry operation is performed, a read voltage by using the basic offset level and further by selectively using the additional offset level depending on a read operation.

A physically unclonable function (PUF) includes a bit cell that includes a latch and a switch to selectively couple the latch to a supply voltage node. A first transmission gate couples a first bit line to a first internal node of the latch and a second transmission gate couples a second bit line to a second internal node of the latch. A digital to analog converter (DAC) circuit is selectively coupled to the first internal node through the first bit line and the first transmission gate and to the second internal node through the second bit line and the second transmission gate, to thereby precharge the latch before the first bit cell is read. The latch regenerates responsive to the switch being closed to connect the latch to the supply voltage node. The first and second bit lines are used to read the regenerated value of the latch.

A method of controlling a charging voltage, the method including: receiving first environmental information from an environmental sensor, setting a voltage level of the charging voltage to a first voltage level in response to the first environmental information; charging a secondary power source including at least one capacitor with the charging voltage having the first voltage level; receiving second environmental information from the environmental sensor; in response to the second environmental information being different than the first environmental information, changing the voltage level of the charging voltage; and charging the secondary power source with the charging voltage having the changed voltage level.

A voltage regulator and a semiconductor memory device having the same are disclosed. The voltage regulator includes an amplifier configured to amplify a difference between a reference voltage and a feedback voltage to generate an amplifier output voltage, a voltage feedback unit connected between an output supply voltage generation node and a ground voltage and configured to generate the feedback voltage, a first transfer gate unit connected between an input supply voltage and the voltage generation node and driven in response to the amplifier output voltage to provide first current, a current load replica unit connected between the voltage generation node and the ground voltage and configured to consume the first current, and a transfer unit connected between the input supply voltage and the voltage generation node and driven in response to the amplifier output voltage when the current load unit performs an operation, to provide second current.

This document describes apparatuses and techniques for write timing compensation. In various aspects, a write timing compensator of a memory controller can apply a delay to data signals transmitted to a memory circuit based on various operating parameters, which may include voltage or latency information. In some cases, the memory controller or memory circuit powers components of write timing compensation circuitry using a dynamic power rail that scales with an operating voltage of the memory circuit. By so doing, the write timing compensator or compensation circuits may improve signal integrity of data signals communicated between the memory controller and the memory circuit at different frequencies and voltages.

This document describes apparatuses and techniques for multi-rail power transition. In various aspects, a power rail controller transitions a memory circuit (e.g., of a memory die) from a first power rail to a second power rail. The power rail controller then changes a voltage of the first power rail from a first voltage to a second voltage. The power rail controller may also adjust termination impedance or a clock frequency of the memory circuit before transitioning the memory circuit to the second power rail. The power rail controller then transitions the memory circuit from the second power rail to the first power rail to enable operation of the memory circuit at the second voltage. By so doing, the power rail controller may improve the reliability of memory operations when transitioning operation of the memory circuit from the first voltage to the second voltage.

A memory device includes a plurality of data input/output (I/O) groups each including data I/O circuits, each data I/O circuit comprising a transistor having a predetermined threshold voltage according to a bulk voltage supplied to a bulk terminal thereof; a control circuit suitable for generating a control signal according to a data I/O mode; and a plurality of voltage supply circuits suitable for independently supplying bulk voltages to the plurality of data I/O groups, and changing, in response to the control signal, a level of a bulk voltage corresponding to data I/O groups unused in the data I/O mode, among the plurality of data I/O groups.

A memory device that is operable at a first voltage domain and a second voltage domain includes a memory array, a power saving mode pin and a word line level shifter circuit. The memory array operates at the first voltage domain. The power saving mode pin is configured to receive a power saving mode enable signal that is at the second voltage domain. The power saving mode enable signal is configured to enable a power saving mode of the memory device. The word line level shifter circuit is coupled to the memory array and the power saving mode pin, and is configured to clamp a word line of the memory array to a predetermined voltage level that corresponds to a first logic state during the power saving mode of the memory device.

A semiconductor device includes a level conversion circuit. The level conversion circuit includes a first transistor, a second transistor, a current limiting element, and a voltage adjusting circuit. The first transistor includes a gate connected to an input node. A signal corresponding to a first power supply voltage is input to the input node. The second transistor has a source connected to a drain of the first transistor, a drain connected to a second power supply voltage that is higher than the first power supply voltage, and a gate connected to a first node. The current limiting element is electrically connected between the first node and an output node. The voltage adjusting circuit adjusts a voltage of the first node in accordance with the signal input to the input node.