A nonvolatile memory supports a standby state where the memory is ready to receive an access command to execute, and a deep power down state where the memory ignores all access commands. The memory can transition from the standby state to the deep power down state in response to a threshold amount of time in the standby state. Thus, the memory can enter the standby state after a command and then transition to the deep power down state after the threshold time.

A power down detection circuit and a semiconductor storage apparatus, which can adjust a power down detection level while suppressing temperature dependence, are provided. The power down detection circuit includes a BGR circuit, a trimming circuit, a resistance division circuit, and a comparator. The BGR circuit generates a reference voltage based on a supply voltage. The trimming circuit adjusts the reference voltage based on a trimming signal to generate a reference voltage for power down detection. The resistance division circuit generates an internal voltage lower than the supply voltage. The comparator detects that the internal voltage is lower than the reference voltage for power down detection and outputs a reset signal.

A semiconductor device and an operation method capable of operating with high reliability are provided. A voltage monitoring circuit (100) of the disclosure includes: a power-on detection part (110) configurated to detect whether a supply voltage (EXVDD) of an external power supply terminal has reached a power-on voltage level; a timer (120) configurated to measure a predetermined time when the power-on voltage level is detected; a through current generation part (130) configurated to generate a through current between the external power supply terminal and GND during a period when the timer (120) measures the predetermined time; and a power-off detection part (140) configurated to detect whether a drop of the supply voltage (EXVDD) has reached a power-off voltage level when the through current is generated.

An integrated circuit includes a driving circuit and an enable control circuit. The driving circuit is configured to perform a setup operation based on a first driving current and perform a preset operation, using different driving currents, based on a first enable signal and a second enable signal. The enable control circuit is configured to generate the first and second enable signals.

Various implementations described herein are related to a device having memory circuitry activated by a power-gated supply. The device may include level shifting circuitry that receives a switch control signal in a first voltage domain, shifts the switch control signal in the first voltage domain to a second voltage domain, and provides the switch control signal in the second voltage domain. The device may include power-gating circuitry activated by the switch control signal in the second voltage domain, and the power-gating circuitry may provide the power-gated supply to the memory circuitry to trigger activation of the memory circuitry with the power-gated supply when activated by the switch control signal in the second voltage domain.

Operating a memory unit using a low-power DC source. The low-power DC source provides lesser power than that required to operate the memory unit. In an embodiment, charge from the low-power source is stored on a charge storage device in a first time interval. The memory unit is operated using the charge storage device as a second power source in a second time interval. A portion of one of the first time interval and the second time interval does not overlap with the other one of the first time interval and the second time interval.

A technique reduces power consumption of a bit cell in a memory and provides write assistance to the bit cell. When the bit cell is active, a power-saving write-assist circuit coupled to the bit cell is selectively sized according to a type of memory access. When the bit cell is inactive, the virtual power supply node floats to a predetermined voltage between a first voltage on a first power supply node coupled to the bit cell and a second voltage on a second power supply node coupled to the bit cell. A method for controlling power consumption of a bit cell and assisting a write to the bit cell includes providing a reference voltage to a virtual power supply node coupled to the bit cell. The reference voltage is provided based on an operational state of the bit cell and a type of memory access to the bit cell.

A semiconductor device that can automatically transition from a standby mode to a deep power down (DPD) mode is provided. The semiconductor device includes a DPD controller supporting the DPD mode and multiple internal circuits. The DPD controller measures a time since a time point of entering the standby mode and generates multiple power down enable signals for further reducing power consumption in the standby mode in response to elapse of a measurement time, so that operations of the multiple internal circuits are stopped in stages.

Apparatuses and methods related to power domain boundary protection in memory. A number of embodiments can include using a voltage detector to monitor a floating power supply voltage used to power a number of logic components while a memory device operates in a reduced power mode, and responsive to the voltage detector detecting that the floating power supply voltage reaches a threshold value while the memory device is in the reduced power mode, providing a control signal to protection logic to prevent a floating output signal driven from one or more of the logic components from being provided across a power domain boundary to one or more of a different number of logic components.

A semiconductor memory device includes an array of memory cells arranged in a plurality of rows and columns, with each memory cell including a plurality of bit cell transistors. The semiconductor memory device further includes a plurality of write assist circuits, including one or more write assist circuits within each column of the array of memory cells, each write assist circuit configured to provide a core voltage to memory cells within the same column and to reduce the core voltage during a write operation. The array of memory cells and the plurality of write assist circuits have a common semiconductor layout.