Volatile memory devices may be on a first memory module that is coupled to a memory controller by a first signal path. A nonvolatile memory device may be on a second memory module that is coupled to the first memory module by a second signal path. A memory transaction for the nonvolatile memory device may be transferred from the memory controller to at least one of the volatile memory devices using the first signal path and data associated with the memory transaction is to be written from at least one of the volatile memory devices to the nonvolatile memory device using the second signal path and a control signal. A durability circuit may generate the control signal based on a comparison of a number of write transactions to a particular memory location with a threshold value.

A cascaded memory system includes a memory module having a primary interface coupled to a memory controller via a first communication channel and a secondary interface coupled to a second memory module via a second communication channel. The first memory module buffers and repeats signals received on the primary and secondary interfaces to enable communications between the memory controller and the secondary memory module.

According to one embodiment, there is provided a memory system including a controller, a plurality of memory chips, and a channel. The controller outputs a clock signal, a timing control signal and a data signal. Each of the plurality of memory chips includes at least a clock input terminal, a timing control input terminal, a timing control output terminal, a data input terminal and a data output terminal. The channel includes a loop bus which connects the controller and the plurality of memory chips in a ring shape. The controller is able to control operation timings of the memory chips by transmitting the clock signal and the timing control signal to the plurality of memory chips via the channel.

An input/output (I/O) block for a semiconductor integrated circuit (IC), which includes: at least one I/O buffer, configured to define at least one signal path in respect of a connection to a remote I/O block via a communication channel, each signal path causing a respective signal edge slope; and an I/O sensor, coupled to the at least one signal path and configured to generate an output signal indicative of one or both of: (a) a timing difference between the signal edge for a first signal path and the signal edge for a second signal path, and (b) an eye pattern parameter for one or more of the at least one signal path.

Systems and methods for multi-chip programming for phased arrays are provided herein. In certain embodiments, a semiconductor device includes one or more inputs configured to receive frame data, an internal memory configured to store the received frame data, and a shift register configured to receive the frame data and comprising a plurality of shift register bit positions. The device further includes a latch configured to store a command type, a first multiplexor configured to select at least one first bit from the shift register based on the command type and provide the at least one first bit to the latch, an output configured to output the frame data, and a second multiplexor configured to select at least one second bit from the shift register based on the command type and provide the at least one second bit to the output.

Methods, systems, and devices for delay calibration oscillators for a memory device are described. In some examples, a memory device may include a delay chain operable (e.g., for a calibration operation) in a ring oscillator configuration that includes a pulse generator. The pulse generator may be configured to output a pulse signal responsive to a transition of an input signal. By generating a pulse signal in a feedback loop of a ring oscillator, the ring oscillator may support a cycle that does not rely on both a first transition propagation pass (e.g., a rising edge propagation) and a responsive, opposite transition propagation pass (e.g., a falling edge propagation) through the delay chain, which may support a ring oscillator cycle time (e.g., period) that more closely represents aspects of the delay chain that are meant to be calibrated.

An apparatus is described. The apparatus includes a DIMM hub circuit. The DIMM hub circuit includes first bus interface circuitry, control circuitry and second bus interface circuitry. The first bus interface circuitry is to receive header information and payload information from a host. The control circuitry is to process the header information and recognize that the payload is to be passed to a target component that is coupled to the DIMM hub circuit through a second bus that is a same type of bus as the first bus. The second bus interface circuitry to send the payload information over the second bus to the target component, wherein, the payload information is to include embedded header information to be processed by the target component.

Methods, systems, and apparatuses for a memory device that is configurable based on the type of substrate used to couple the memory device with a host device are described. The reconfigurable memory device may include a plurality of components for different configurations. Various components of the reconfigurable memory die may be activated/deactivated based on a type of substrate used in the memory device. The memory device may include an input/output (I/O) interface that is variously configurable. A first configuration may cause the memory device to communicate signals modulated using a first modulation scheme across a channel of a first width. A second configuration may cause the memory device to communicate signals modulated using a second modulation scheme across a channel of a second width. The I/O interface may include one or more switching components to selectively couple pins of a channel together and/or selectively couple components to various pins.

The present disclosure includes apparatuses and methods related to memory module interfaces. A memory module, which may include volatile memory or nonvolatile memory, or both, may be configured to communicate with a host device via one interface and to communicate with another memory module using a different interface. Memory modules may thus be added or removed from a system without impacting a PCB-based bus to the host, and memory modules may communicate with one another without accessing a bus to the host. The host interface may be configured according to one protocol or standard, and other interfaces between memory modules may be configured according to other protocols or standards.

A memory module can be programmed to deliver relatively wide, low-latency data in a first access mode, or to sacrifice some latency in return for a narrower data width, a narrower command width, or both, in a second access mode. The narrow, higher-latency mode requires fewer connections and traces. A controller can therefore support more modules, and thus increased system capacity. Programmable modules thus allow computer manufacturers to strike a desired balance between memory latency, capacity, and cost.