A memory device includes a first memory group including plural first non-volatile memory cells capable of storing multi-bit data, and a second memory group including plural second non-volatile memory cells capable of storing single-bit data. A program operation controller builds the multi-bit data based on data inputted from an external device, performs a logical operation regarding partial data among the multi-bit data to generate a parity, programs the parity in the second memory group after programming the partial data in the first memory group, perform a verification operation regarding the partial data after a sudden power-off (SPO) occurs, recovers the partial data based on the parity and a result of the verification operation, and programs recovered partial data in the first memory group.

A method of operating a semiconductor memory device programming selected memory cells to store bits of data in each of the selected memory cells includes foggy programming and fine programming.

A circuit and method for data transmission, and a storage apparatus are provided. A mode register decoding module is configured to generate a mode register unselected enable signal, a mode register read enable signal, or a mode register write enable signal according to received mode register address information, a mode register read control signal, or a mode register write control signal. A mode register read-write module is configured to: cache data on data line according to mode register write enable signal in write state, and output selected data and unselected data after setting the unselected data to zero according to the mode register read enable signal and the mode register unselected enable signal in a read state. The logic gate module is configured to calculate an OR value of the data outputted by each mode register read-write module in the read state and output a calculation result.

Methods, systems, and devices for stacked memory dice and combined access operations are described. A device may include multiple memory dice. One die may be configured as a master, and another may be configured as a slave. The master may communicate with a host device. A slave may be coupled with the master but not the host device. The device may include a first die (e.g., master) and a second die (e.g., slave). The first die may be coupled with a host device and configured to output a set of data in response to a read command. The first die may supply a first subset of the data and obtain a second subset of the data from the second die. In some cases, the first die may select, based on a data rate, a modulation scheme (e.g., PAM4, NRZ, etc.) and output the data using the selected modulation scheme.

Embodiments provide a read operation circuit, a semiconductor memory, and a read operation method. The read operation circuit includes: a DBI encoder configured to read read data from a memory bank, and determine whether to invert the read data according to the number of bits of high data in the read data to output global bus data for transmission through a global bus and DBI data for transmission through a DBI signal line, a DBI port being configured to receive the DBI data; a parallel-to-serial conversion circuit configured to perform parallel-to-serial conversion on the global bus data to generate output data of the DQ port; a data buffer module connected to the memory bank through the global bus; and a precharge module connected to a precharge signal line and configured to set an initial state of the global bus to Low.

Control logic in a memory device receives a request to read data from a memory array of a memory device, the request comprising an indication of a segment of the memory array where the data is stored, and determines whether a write temperature associated with the data is stored in a flag byte corresponding to the segment of the memory array. Responsive to determining that the write temperature associated with the data is stored in the flag byte, the control logic determines a cross-temperature for the data based on the write temperature and a read temperature at a time when the request to read the data is received, determines a program/erase cycle count associated with the segment of the memory array, and determines, based on the cross-temperature and the program/erase cycle count, whether to perform a corrective action to calibrate a read voltage level to be applied to the memory array to read the data from the segment.

A memory device supporting multi-address read operations improves throughput on a bi-directional serial port. The device includes a memory array and an input/output port having an input mode and an output mode. The input/output port has at least one signal line used alternately in both the input and output modes. A controller includes logic configured to execute a multi-address read operation in response to receiving a read command on the input/output port, the multi-address read operation including receiving a first address and a second address using the at least one signal line before outputting data.

A memory system includes a plurality of memory devices, each connected to internal channels respectively including an internal data channel and an internal control channel, and each configured to perform communication based on a first interface protocol, a controller connected to an external channel including an external data channel and an external control channel and configured to perform communication based on a second interface protocol, and an interface circuit connecting the external channel to each of the internal channels. The interface circuit is configured to perform channel conversion by serializing a parallel data signal received from the controller through the external data channel and outputting the serialized signal to the internal control channel included in a first one of the internal channels, or parallelizing a signal received through the external control channel and outputting the parallelized signal to the internal data channel included in the first one of the internal channels.

Methods of operating a memory device are disclosed. A method may include receiving a write command, and in response to the write command, performing a write operation without precharging a local input/output line subsequent to receipt of the write command and prior to performing the write operation. Another method may include receiving a read command, performing a read operation in response to the read command, and receiving an additional command without precharging the local input/output line subsequent to performing the read operation and prior to receiving the additional command. Memory devices and systems are also disclosed.

A PIM device includes a plurality of first storage regions, a second storage region, and a column control circuit. The second storage region is coupled to each of the plurality of first storage regions through a data transmission line. The column control circuit generates a memory read control signal for reading data stored in an initially selected storage region of the plurality of first storage regions and a buffer write control signal for writing the data read from the initially selected storage region to the second storage region. The column control circuit generates a global buffer read control signal for reading the data written to the second storage region and a memory write control signal for writing the data read from the second storage region to a subsequently selected storage region of the plurality of first storage regions.