A memory device includes a driver that drives a data line connected with an external device, an internal ZQ manager that generates an internal ZQ start signal, a selector that selects one of the internal ZQ start signal and a ZQ start command from the external device, based on a ZQ mode, a ZQ calibration engine that generates a ZQ code by performing ZQ calibration in response to a selection result of the selector, and a ZQ code register that loads the ZQ code onto the driver in response to a ZQ calibration command from the external device.

A bit line is pre-charged based on a clock signal internal to a bit line pre-charge circuit when a bit line pre-charge window is within a margin of a predetermined pre-charge window. A bit line is pre-charged based on a clock signal external to the bit line pre-charge circuit when the bit line pre-charge window is outside the margin of the predetermined pre-charge window.

A memory circuit includes a NAND logic gate configured to receive a first bit line signal and a second bit line signal, and to generate a first signal. The memory circuit further includes a first N-type transistor coupled to the NAND logic gate, and configured to receive a first pre-charge signal. The memory circuit further includes a second N-type transistor coupled to the first N-type transistor and a reference voltage supply, and configured to receive a first clock signal. The memory circuit further includes a first latch coupled to the NAND logic gate, and configured to latch the first signal in response to at least the first clock signal or the first pre-charge signal.

In a method of testing a nonvolatile memory device including a first semiconductor layer in which and a second semiconductor layer is formed prior to the first semiconductor layer, circuit elements including a page buffer circuit are provided in the second semiconductor layer, an on state of nonvolatile memory cells which are not connected to the page buffer circuit is mimicked by providing a conducting path between an internal node of a bit-line connection circuit connected between a sensing node and a bit-line node of the page buffer circuit and a voltage terminal to receive a first voltage, a sensing and latching operation with the on state being mimicked is performed in the page buffer circuit and a determination is made as to whether the page buffer circuit operates normally is made based on a result of the sensing and latching operation.

A pseudo dual port memory device in which an operating speed is improved and stability is increased is provided. The pseudo dual port memory device may include a memory cell, a pair of bit lines connected to the memory cell, a write driver, a sense amp, and a column multiplexer which is connected to the bit lines, receives a write multiplexer control signal and a read multiplexer control signal, connects the bit lines to the write driver in response to the write multiplexer control signal, and connects the bit lines to the sense amp in response to the read multiplexer control signal. A precharge control signal generation circuit which is connected to the column multiplexer may generate a precharge control signal on the basis of the read and write multiplexer control signals, and a bit line precharge circuit may precharge the bit lines based on the precharge control signal.

Methods, systems, and apparatuses related to memory operation with on-die termination (ODT) are provided. A memory device may be configured to provide ODT at a first portion (e.g., rank) during communications at a second portion (e.g., rank). For example, a memory device may receive a first command instructing a first portion to perform a first communication. The device may transmit, from the first portion, a signal instructing a second portion to enter an ODT mode. The device may perform, with the first portion, the first communication with a host while the second portion is in the ODT mode. The signal may be provided at an ODT I/O terminal of the first portion coupled to an ODT I/O terminal of the second portion.

A semiconductor device includes a cell block and a data block. The cell block includes an operation circuit having a first capacitor and a second capacitor and an input circuit configured to couple the first capacitor and the second capacitor to a bit line according to differential voltages provided via word lines and corresponding to a first data. The data block includes a capacitor array having a variable capacitance corresponding to a value of a second data; and a coupling switch configured to couple the bit line and the data block. The cell block and the data block may be used to perform a Multiply and Accumulate (MAC) operation.

A memory device includes a memory cell array and a transmitter, wherein the transmitter includes a pulse amplitude modulation (PAM) encoder configured to generate a PAM-n first input signal (where n is an integer greater than or equal to 4) from data read from the memory cell array; a pre-driver configured to generate a second input signal based on the first input signal and based on a calibration code signal, and output the second input signal using a first power voltage; and a driver configured to output a PAM-n DQ signal using a second power voltage lower than the first power voltage in response to the second input signal.

Embodiments of the present disclosure provide an apparatus including a memory array including a plurality of sub-arrays. A plurality of temporary storage units (TSUs) is coupled to the plurality of sub-arrays. Each TSU indicates whether the respective sub-array is undergoing one of a read operation and a write operation. A control circuit is coupled to each of the plurality of sub-arrays through a data bus. The control circuit transmits a read pulse or a write pulse as a first pulse with a delay in response to the sub-array undergoing the read operation or the write operation and transmits, instantaneously, the first pulse to one of the plurality of sub-arrays in response to the sub-array not undergoing the read operation or the write operation.

A semiconductor system may include a first semiconductor device and a second semiconductor device. The first semiconductor device compares a received signal with an original signal to generate a driving force control signal. The first semiconductor device also drives the original signal using a driving force in accordance with the driving force control signal to output an external transmission signal. The second semiconductor device receives the external transmission signal to generate a positive signal and a negative signal. The second semiconductor device also generates a restoration signal in response to the positive signal and the negative signal. The second semiconductor device additionally outputs the restoration signal as the external transmission signal to the first semiconductor device.