A semiconductor system may include a first semiconductor device and a second semiconductor device. The first semiconductor device compares a received signal with an original signal to generate a driving force control signal. The first semiconductor device also drives the original signal using a driving force in accordance with the driving force control signal to output an external transmission signal. The second semiconductor device receives the external transmission signal to generate a positive signal and a negative signal. The second semiconductor device also generates a restoration signal in response to the positive signal and the negative signal. The second semiconductor device additionally outputs the restoration signal as the external transmission signal to the first semiconductor device.

A signal transmitting and receiving apparatus including: a first on-die termination circuit connected to a first pin through which a first signal is transmitted or received and, when enabled, the first on-die termination circuit is configured to provide a first termination resistance to a signal line connected to the first pin; a second on-die termination circuit connected to a second pin through which a second signal is transmitted or received and, when enabled, the second on-die termination circuit is configured to provide a second termination resistance to a signal line connected to the second pin; and an on-die termination control circuit configured to independently control an enable time and a disable time of each of the first on-die termination circuit and the second on-die termination circuit.

Described herein are embodiments related to first-pass continuous read level calibration (cRLC) operations on memory cells of memory systems. A processing device determines that a first programming pass of a programming operation has been performed on a memory cell of a memory component. The processing device performs a cRLC operation on the memory cell to calibrate a read level threshold between a first first-pass programming distribution and a second first-pass programming distribution before a second programming pass of the programming operation is performed on the memory cell.

A memory device as provided may apply a pulse amplitude modulation method to data (DQ) signal transmission/reception and may scale a DQ signal according to an operating frequency condition, so as to improve data transmission performance and effectively improve power consumption. The memory device includes a memory cell array, and a data input/output circuit configured to scale a DQ signal that includes data read from the memory cell array and output the scaled DQ signal. The data input/output circuit is configured to scale the DQ signal based on an n-level pulse amplitude modulation (PAMn) (where n is 4 or a greater integer) with a DQ parameter that corresponds an operating frequency condition and output the DQ signal. Other aspects include memory controllers that communicate with the memory devices, and memory systems that include the memory devices and memory controllers.

Methods, systems, and devices for dynamic read voltage techniques are described. In some examples, a memory device may include one or more partitions made up of multiple disjoint subsets of memory arrays. The memory device may receive a read command to read the one or more partitions and enter a drift determination phase. During the drift determination phase, the memory device may concurrently apply a respective voltage of a set of voltages to each disjoint subset and determine a quantity of memory cells in each disjoint subset that have a threshold voltage below the applied voltage. Based on a comparison between the determined quantity of memory cells and a predetermined quantity of memory cells, the memory device may select a voltage from the set of voltages and utilize the selected voltage to read the one or more partitions.

A memory device includes: a first clock receiver configured to receive a first clock signal; a second clock receiver configured to receive a second clock signal when data is input or output, wherein the second clock signal has a first clock frequency in a preamble period, and has a second clock frequency different from the first clock frequency after the preamble period; a command decoder configured to receive a clock synchronization command synchronized with the first clock signal and generate a clock synchronization signal, wherein the clock synchronization signal is generated during the preamble period; and a clock synchronizing circuit configured to generate a plurality of division clock signals in response to the second clock signal, latch the clock synchronization signal during the preamble period, and selectively provide the plurality of division clock signals as internal data clock signals according to a result of the latching.

In some embodiments, an in-memory-computing SRAM macro based on capacitive-coupling computing (C3) (which is referred to herein as “C3SRAM”) is provided. In some embodiments, a C3SRAM macro can support array-level fully parallel computation, multi-bit outputs, and configurable multi-bit inputs. The macro can include circuits embedded in bitcells and peripherals to perform hardware acceleration for neural networks with binarized weights and activations in some embodiments. In some embodiments, the macro utilizes analog-mixed-signal capacitive-coupling computing to evaluate the main computations of binary neural networks, binary-multiply-and-accumulate operations. Without needing to access the stored weights by individual row, the macro can assert all of its rows simultaneously and form an analog voltage at the read bitline node through capacitive voltage division, in some embodiments. With one analog-to-digital converter (ADC) per column, the macro cab realize fully parallel vector-matrix multiplication in a single cycle in accordance with some embodiments.

Methods, systems, and devices for multiple concurrent modulation schemes in a memory system are described. Techniques are provided herein to communicate data using a modulation scheme having at least three levels and using a modulation scheme having at least two levels within a common system or memory device. Such communication with multiple modulation schemes may be concurrent. The modulated data may be communicated to a memory die through distinct signal paths that may correspond to a particular modulation scheme. An example of a modulation scheme having at least three levels may be pulse amplitude modulation (PAM) and an example of a modulation scheme having at least two levels may be non-return-to-zero (NRZ).

Methods, systems, and devices for signal path biasing in an electronic system (e.g., a memory system) are described. In one example, a memory device, a host device, or both may be configured to bias a signal path, between an idle state and an information transfer or between an information transfer and an idle state, to an intermediate or mid-bias voltage level, which may reduce signal interference associated with such transitions. In various examples, the described biasing to a voltage, such as a mid-bias voltage, may be associated with an access command or other command for information to be communicated between devices of the electronic system, such as a command for information to be communicated between a memory device and a host device.

A semiconductor device includes a cell circuit including a plurality of memory arrays, and a control circuit configured to control the cell circuit. A memory array of the plurality of memory arrays has a plurality of sub-arrays including a first sub-array and a second sub array, and an array connecting circuit configured to connect bit lines of the first sub-array to respective corresponding bit lines of the second sub-array according to a copy signal. The semiconductor device may further include a partial sum circuit configured to perform charge sharing between a plurality of bit lines of the first sub-array.