A memory macro includes a first memory cell array, a first tracking circuit and a first pre-charge circuit. The first tracking circuit includes a first set of memory cells configured as a first set of loading cells responsive to a first set of control signals, a second set of memory cells configured as a first set of pull-down cells responsive to a second set of control signals, and a first tracking bit line coupled to the first set of memory cells and the second set of memory cells. The first set of pull-down cells and the first set of loading cells are configured to track a memory cell of the first memory cell array. The first pre-charge circuit is coupled to the first tracking bit line, and is configured to charge the first tracking bit line to a pre-charge voltage level responsive to a third set of control signals.

An impedance calibration circuit includes a first code generator, a first code storing circuit, a second code generator and a second code storing circuit. The first code generator generates a pull-up control code obtained from a result of comparing a target output high level (VOH) voltage with a first voltage of a first node. The first code storing circuit stores the pull-up control code when the target VOH voltage becomes the same as the first voltage. The second code generator generates a pull-down control code obtained from a result of comparing the VOH voltage with a second voltage of a second node. The second storing circuit stores the pull-down control code when the target VOH voltage becomes the same as the second voltage. The first code storing circuit and the second code storing circuit store pull-up control code and pull-down control code pairs respectively.

A method of controlling an NVM device can include: (i) receiving, by an interface, a write command from a host; (ii) beginning execution of a write operation on a first array plane of a memory array in response to the write command, where the memory array includes a plurality of NVM cells arranged in a plurality of array planes; (iii) receiving, by the interface, a read command from the host; (iv) suspending the write operation in response to detection of the read command during execution of the write operation; (v) beginning execution of a read operation on a second array plane in response to the read command; and (vi) resuming the write operation after the read operation has at least partially been executed.

A control method, for a memory array, the control method comprises programming the bit-cell of the memory array in a programming stage; and discharging the bit-cell of the memory array in a discharge stage; wherein the programming stage comprises: programming the bit-cell of the memory array with a plurality of programming voltage pulses; wherein the discharge stage comprises: isolating a select line of the bit-cell of the memory array; and generating a programming voltage pulse to the bit-cell of the memory array; wherein the programming stage can be suspended to a suspend stage by a suspend command after the discharge stage; wherein the suspend command is received during one of the plurality of programming voltage pulse.

Integrated circuits with an array of memory cells are provided. Each memory cell may include at least one pair of cross-coupled inverters, write access transistors, and optionally a separate read port. The cross-coupled inverters in each memory cell may have a positive power supply terminal. The positive power supply terminal of each memory cell along a given column in the array may be coupled to a corresponding pull-up transistor. The pull-up transistor may receive a control signal from a pull-up weakening control circuit. The control signal may be temporarily elevated during write operations and may otherwise be driven back down to ground to help optimize read performance. The pull-up weakening control circuit may be implemented using a chain of n-channel transistors or a resistor chain.

A semiconductor memory device is implemented as strings of storage transistors, where the storage transistors in each string have drain terminals connected to a bit line and gate terminals connected to respective word lines. In some embodiments, the semiconductor memory device includes a reference bit line structure to provide a reference bit line signal for read operation. The reference bit line structure configures word line connections to provide a reference bit line to be used with a storage transistor being selected for read access. The reference bit line structure provides a reference bit line having the same electrical characteristics as an active bit line and is configured so that no storage transistors are selected when a word line is activated to access a selected storage transistor associated with the active bit line.

A pseudo-triple-port memory is provided that includes a plurality of pseudo-triple-port bitcells, each pseudo-triple-port first bitcell having a first read port including a first word line coupled to a first bit line through a first access transistor, a second read port including a second word line coupled to a second bit line through a second access transistor, and a write port including both the word lines, both the bit lines, and the pair of access transistors.

Methods and systems for controlling refresh operations of a memory device. A method disclosed herein includes receiving, by a refresh controller of the memory device, a refresh command from a host for performing the refresh operation on a plurality of memory rows. The method further includes selecting, by the refresh controller, at least one memory row from the plurality of memory rows for the refresh operation using a refresh-row selection circuitry. The at least one memory row is selected by performing digital reading or analog reading of at least one row condition cell (RCC) and at least one supplemental cell that are connected to each memory row of the memory rows. The method further includes performing, by the refresh controller, the refresh operation on the selected at least one memory row.

A bitcell architecture for a pseudo-triple-port memory is provided that includes a a bitcell arranged on a semiconductor substrate, the bitcell defining a bitcell width and a bitcell height and including a first access transistor and a second access transistor. A first metal layer adjacent the semiconductor substrate is patterned to form a pair of local bit lines arranged within the bitcell width. The pair of local bit lines includes a local bit line coupled to a terminal of the first access transistor and includes a complement local bit line coupled to a terminal of the second access transistor.

The present disclosure is directed to an integrated circuit that includes a non-volatile memory (NVM). The integrated circuit includes a bias generator that produces stable wordline and bitline voltages for a reliable read operation of the NVM. This disclosure is directed to low voltage memory operations of memory read, erase verify, and program verify. The present disclosure is directed to non-volatile memory circuits that can also operate at low supply voltages in digital voltage supply range.