Provided is a semiconductor device including a substrate, a tunneling insulating film disposed on the substrate, a control gate electrode disposed on the tunneling insulating film, a first floating gate electrode disposed between the control gate electrode and the tunneling insulating film, a second floating gate electrode disposed between the first floating gate electrode and the tunneling insulating film, a first control gate insulating film disposed between the first floating gate electrode and the control gate electrode, a second control gate insulating film disposed between the second floating gate electrode and the first floating gate electrode, and a source electrode and a drain electrode disposed on the substrate to be spaced apart from each other with respect to the control gate electrode, wherein the control gate electrode includes a first metal material, wherein the first floating gate electrode includes a second metal material, wherein the second floating gate electrode includes a third metal material, wherein the first to third metal materials are different from each other, wherein an oxidizing power of the second metal material is smaller than an oxidizing power of the first metal material.

Some embodiments include apparatus and methods having a memory cell with a first electrode, a second electrode, and a dielectric located between the first and second electrodes. The dielectric may be configured to allow the memory cell to form a conductive path in the dielectric from a portion of a material of the first electrode to represent a first value of information stored in the memory cell. The dielectric may also be configured to allow the memory cell to break the conductive path to represent a second value of information stored in the memory cell.

A memory device may be provided, including first, second and third electrodes, first and second mask elements and a switching layer. The first mask element may be arranged over a portion of and laterally offset from the first electrode. The second electrode may be arranged over the first mask element. The second mask element may be arranged over the second electrode. The third electrode may be arranged over a portion of and laterally offset from the second mask element. The switching layer may be arranged between the first electrode and the third electrode, along a first side surface of the first mask element, a first side surface of the second electrode and a first side surface of the second mask element.

A memory unit is controlled by a word line, a reference voltage and a bit-line clamping voltage. A non-volatile memory cell is controlled by the word line and stores a weight. A clamping module is electrically connected to the non-volatile memory cell via a bit line and controlled by the reference voltage and the bit-line clamping voltage. A clamping transistor of the clamping module is controlled by the bit-line clamping voltage to adjust a bit-line current. A cell detector of the clamping module is configured to detect the bit-line current to generate a comparison output according to the reference voltage. A clamping control circuit of the clamping module switches the clamping transistor according to the comparison output and the bit-line clamping voltage. When the clamping transistor is turned on by the clamping control circuit, the bit-line current is corresponding to the bit-line clamping voltage multiplied by the weight.

A liquid electrochemical memory device is provided. In one aspect, the device includes a memory region for storing at least two bits, the memory region having a first volume; and a liquid electrolyte region fluidically connected to the memory region, the liquid electrolyte region having a second volume larger than the first volume. The device further includes a working electrode exposed to the memory region, and a counter electrode exposed to the liquid electrolyte region. The device also includes an electrolyte filling the memory region and the liquid electrolyte region, in physical contact with the working electrode and the counter electrode, the electrolyte including at least two conductive species. The device further includes a control unit for biasing the working electrode and the counter electrode.

A resistive random-access memory (ReRAM) device may include a thermally engineered layer that is positioned adjacent to an active layer and configured to act as a heat sink during filament formation in response to applied voltages. The thermally engineered layer may act as one of the electrodes on the ReRAM device and may be adjacent to any side of the active layer. The active layer may also include a plurality of individual active layers. Each of the active layers may be associated with a different dielectric constant, such that the middle active layer has a dielectric constant that is significantly higher than the other two surrounding active layers.

A liquid electrochemical memory device is provided. In one aspect, the device includes a memory region for storing at least two bits, the memory region having a first volume; and a liquid electrolyte region fluidically connected to the memory region, the liquid electrolyte region having a second volume larger than the first volume. The device further includes a working electrode exposed to the memory region, and a counter electrode exposed to the liquid electrolyte region. The device also includes an electrolyte filling the memory region and the liquid electrolyte region, in physical contact with the working electrode and the counter electrode, the electrolyte including at least two conductive species. The device further includes a control unit for biasing the working electrode and the counter electrode.

Methods, systems, and devices for operating memory cell(s) are described. A resistance of a storage element included in a memory cell may be programmed by applying a voltage to the memory cell that causes ion movement within the storage element, where the storage element remains in a single phase and has different resistivity based on a location of the ions within the storage element. In some cases, multiple of such storage elements may be included in a memory cell, where ions within the storage elements respond differently to electric pulses, and a non-binary logic value may be stored in the memory cell by applying a series of voltages or currents to the memory cell.

A semiconductor device including a substrate that has a first region and a second region, a plurality of lower conductive patterns on the substrate, the plurality of lower conductive patterns including a first conductive pattern in the first region of the substrate and a second conductive pattern in the second region of the substrate, a magnetic tunnel junction on the first conductive pattern, a contact between the magnetic tunnel junction and the first conductive pattern, a through electrode on the second conductive pattern, and a plurality of upper conductive patterns on the magnetic tunnel junction and the through electrode. The contact includes a first contact on the lower conductive patterns, a second contact on the first contact, and a first barrier layer that covers a bottom surface and a lateral surface of the second contact.

A semiconductor device including a substrate that has a first region and a second region, a plurality of lower conductive patterns on the substrate, the plurality of lower conductive patterns including a first conductive pattern in the first region of the substrate and a second conductive pattern in the second region of the substrate, a magnetic tunnel junction on the first conductive pattern, a contact between the magnetic tunnel junction and the first conductive pattern, a through electrode on the second conductive pattern, and a plurality of upper conductive patterns on the magnetic tunnel junction and the through electrode. The contact includes a first contact on the lower conductive patterns, a second contact on the first contact, and a first barrier layer that covers a bottom surface and a lateral surface of the second contact.