Patent classifications
G11C11/5621
FUNCTIONAL SIGNAL LINE OVERDRIVE
Devices and techniques are disclosed herein to provide a number of different bias signals to each of multiple signal lines of an array of memory cells, each bias signal having an overdrive voltage above a target voltage by a selected increment and an overdrive period, to determine settling times of each of the multiple signal lines to the target voltage for the number of different bias signals, to determine a functional compensation profile for an array of memory cells comprising a relationship between the different bias signals and the determined settling times of the multiple signal lines.
NAND FLASH MEMORY WITH VERTICAL CELL STACK STRUCTURE AND METHOD FOR MANUFACTURING SAME
Disclosed is a method of manufacturing flash memory with a vertical cell stack structure. The method includes forming source lines in a cell area of a substrate having an ion-implanted well and forming an alignment mark relative to the source lines. The alignment mark is formed in the substrate outside the cell area of the substrate. After formation of the source lines, cell stacking layers are formed. After forming the cell stacking layers, cell pillars in the cell stacking layers are formed at locations relative to the previously formed source lines using the alignment mark to correctly locate the cell pillars.
Storage System and Method for Using Read and Write Buffers in a Memory
A storage system allocates single-level cell (SLC) blocks in its memory to act as a write buffer and/or a read buffer. When the storage system uses the SLC blocks as a read buffer, the storage system reads data from multi-level cell (MLC) blocks in the memory and stores the data in the read buffer prior to receiving a read command from a host for the data. When the storage system uses the SLC blocks as a write buffer, the storage system retains certain data in the write buffer while other data is flushed from the write buffer to MLC blocks in the memory.
Loop dependent plane skew methodology for program operation
An apparatus, disclosed herein, comprises a plurality of planes, each plane of the plurality of planes including a plurality of memory cells and a control circuit coupled to the plurality of memory cells. The control circuit is configured to: determine a position of a program loop in a sequence of program loops performed to complete a programming operation; initiate an inhibit bit line ramping event for the first plane including ramping of a set of bit lines of a first plane up to an inhibit voltage and based on the position of the program loop, initiate an inhibit bit line ramping event with a ramping start time delay for a second plane, where the inhibit bit line ramping event for the second plane includes initiating ramping of a set of bit lines of the second plane up to the inhibit voltage after the ramping start time delay.
Memory device and method of operating the same
A memory device includes drain select lines, source select lines, a plurality of word lines arranged between the drain select lines and the source select lines, and a peripheral circuit configured to perform a program operation on selected memory cells connected to a selected word line among the plurality of word lines. The peripheral circuit includes a voltage generator configured to generate a voltage for initializing a channel of a plurality of memory cells respectively connected to the plurality of word lines in a program phase among a plurality of phases included in the program operation.
THREE-DIMENSIONAL MEMORY DEVICE WITH THREE-DIMENSIONAL PHASE-CHANGE MEMORY
Three-dimensional (3D) memory devices with 3D phase-change memory (PCM) and methods for forming and operating the 3D memory devices are disclosed. In an example, a 3D memory device includes a first semiconductor structure including an array of NAND memory cells, and a first bonding layer including first bonding contacts. The 3D memory device also further includes a second semiconductor structure including a second bonding layer including second bonding contacts, a semiconductor layer and a peripheral circuit and an array of PCM cells between the second bonding layer and the semiconductor layer. The 3D memory device further includes a bonding interface between the first and second bonding layers. The first bonding contacts are in contact with the second bonding contacts at the bonding interface.
Read only memory (ROM)-emulated memory (REM) profile mode of memory device
A programmable memory device includes a read only memory (ROM) block to store instructions associated with functionality of the programmable memory device. The device includes a memory array having a set of reserved pages to store updates to be performed on the ROM block. The device includes a controller coupled to the ROM block and the memory array. The controller is to execute the instructions to: execute a set features command; program, in execution of the set features command, a set of sub-feature parameters to a specified feature address of the set of reserved pages, wherein the set of sub-feature parameters are to trigger operation within a ROM-emulated memory (REM) profile mode; and program a REM-profiled page of the set of reserved pages with REM data received from a host system.
Memory cell, memory array and operation method using the same
A memory cell includes: a transistor having a control terminal coupled to a first node; a first terminal coupled to a first signal line; and a second terminal coupled to a second signal line; a first resistance element, having a first terminal coupled to the first node and a second terminal coupled to a second node; and a second resistance element, having a first terminal coupled to the first node and a second terminal coupled to a third node.
MEMORY SYSTEM
According to one embodiment, a memory system includes a first memory, an interface circuit, and a processor. The interface circuit is configured to receive a first request from an external device. The processor is configured to select a mode among a plurality of modes in response to the first request, and perform, on data read from the first memory, error correction of the selected mode.
STANDBY BIASING TECHNIQUES TO REDUCE READ DISTURBS
Devices and techniques are disclosed herein to provide a high-voltage bias signal in a standby state of the storage system without exceeding a limited maximum standby current allowance of the storage system. The high-voltage bias signal can enable a string driver circuit in the standby state to couple a global word line to a local word line, to provide a bias to, or sink a voltage from, a pillar of a string of memory cells of the storage system in the standby state, such as to reduce read disturbances in the storage system.