G11C11/565

Multinary bit cells for memory devices and network applications and method of manufacturing the same

A memory device may include at least one multinary memory cell. Each multinary memory cell includes a parallel connection of N sub-bit units. N is an integer greater than 1. Each of the N sub-bit units includes a series connection of a respective transistor and a respective capacitor. A first sub-bit unit includes a first capacitor having a capacitance of C, and each i-th sub-unit includes an i-th capacitor having a capacitance of about 2.sup.i-1×C. A multinary bit having 2.sup.N values may be stored. A device network including multiple multinary logic units is also provided. Each of multiple multinary logic unit includes a parallel connection of N sub-bit units. Each sub-bit unit includes a series connection of a respective transistor and a respective capacitor having capacitance ratios of powers of 2.

Determining threshold values for voltage distribution metrics

Systems and methods are disclosed including a memory device and a processing device operatively coupled to the memory device. The processing device can perform operations including determining a value of a data state metric associated with data stored in a part of a block of the memory device; responsive to determining that the value of the data state metric satisfies a first threshold criterion, determining a first value reflecting a voltage distribution metric associated with at least the part of the block; determining a second value reflecting at least one of a deterioration slope indicative of a data deterioration rate associated with a first portion of the memory device or an error rate associated with a second portion of the memory device; feeding the first value and the second value to a neural network; and receiving, from the neural network, an instruction to perform a media management operation.

3D semiconductor device and structure with oxide bonding
11757030 · 2023-09-12 · ·

A semiconductor device, the device including: a first silicon layer including first single crystal silicon; an isolation layer disposed over the first silicon layer; a first metal layer disposed over the isolation layer; a second metal layer disposed over the first metal layer; a first level including a plurality of transistors, the first level disposed over the second metal layer, where the isolation layer includes an oxide to oxide bond surface, where the plurality of transistors include a second single crystal silicon region; and a third metal layer disposed over the first level, where a typical first thickness of the third metal layer is at least 50% greater than a typical second thickness of the second metal layer.

Neuromorphic device based on memory

A neuromorphic device includes a memory cell array that includes first memory cells corresponding to a first address and storing first weights and second memory cells corresponding to a second address and storing second weights, and a neuron circuit that includes an integrator summing first read signals from the first memory cells and an activation circuit outputting a first activation signal based on a first sum signal of the first read signals output from the integrator.

Semiconductor memory device, memory system, and write method
11621039 · 2023-04-04 · ·

According to one embodiment, a memory system includes a semiconductor memory device including a memory cell capable of holding at least 4-bit data and a controller configured to control a first write operation and a second write operation based on the 4-bit data. The controller includes a conversion circuit configured to convert 4-bit data into 2-bit data. The semiconductor memory device includes a recovery controller configured to recover the 4-bit data based on the converted 2-bit data and data written in the memory cell by the first write operation. The first write operation is executed based on the 4-bit data received from the controller, and the second write operation is executed based on the 4-bit data recovered by the recovery controller.

Driver for non-binary signaling

Methods, systems, and devices related to an improved driver for non-binary signaling are described. A driver for a signal line may include a set of drivers of a first type and a set of drivers of a second type. When the driver drives the signal line using multiple drivers of the first type, at least one additional driver of the first type may compensate for non-linearities associated with one or more other drivers of the first type, which may have been calibrated at other voltages. The at least one additional driver of the first type may be calibrated for use at a particular voltage, to compensate for non-linearities associated with the one or more other drivers of the first type as exhibited at that particular voltage.

MULTINARY BIT CELLS FOR MEMORY DEVICES AND NETWORK APPLICATIONS AND METHOD OF MANUFACTURING THE SAME
20230360698 · 2023-11-09 ·

A memory device may include at least one multinary memory cell. Each multinary memory cell includes a parallel connection of N sub-bit units. N is an integer greater than 1. Each of the N sub-bit units includes a series connection of a respective transistor and a respective capacitor. A first sub-bit unit includes a first capacitor having a capacitance of C, and each i-th sub-unit includes an i-th capacitor having a capacitance of about 2.sup.i−1×C. A multinary bit having 2.sup.N values may be stored. A device network including multiple multinary logic units is also provided. Each of multiple multinary logic unit includes a parallel connection of N sub-bit units. Each sub-bit unit includes a series connection of a respective transistor and a respective capacitor having capacitance ratios of powers of 2.

APPARATUSES, SYSTEMS, AND METHODS FOR FREQUENCY-DEPENDENT SIGNAL MODULATION
20220392518 · 2022-12-08 · ·

Apparatuses, systems, and methods for high-pass filtering pre-emphasis circuits. A device may use a pre-emphasis driver to provide a multi-level signal based on multiple binary signals. The pre-emphasis driver includes a primary driver coupled in parallel with at least one equalizer path, each of which includes an equalizer driver and a filtering element. The filtering element may be an AC filtering element, such as a capacitor. The equalizer paths may contribute equalized signal(s) which have a high-pass filtering behavior. The pre-emphasis circuit may combine the primary signal from the primary driver and the equalized signals to generate an overall output multi-level signal. In some embodiments, the pre-emphasis driver may be a pulse amplitude modulated (PAM) driver, such as a PAM4 driver with four levels of the multi-level driver.

DETERMINING THRESHOLD VALUES FOR VOLTAGE DISTRIBUTION METRICS
20220415412 · 2022-12-29 ·

Systems and methods are disclosed including a memory device and a processing device operatively coupled to the memory device. The processing device can perform operations including determining a value of a data state metric associated with data stored in a part of a block of the memory device; responsive to determining that the value of the data state metric satisfies a first threshold criterion, determining a first value reflecting a voltage distribution metric associated with at least the part of the block; determining a second value reflecting at least one of a deterioration slope indicative of a data deterioration rate associated with a first portion of the memory device or an error rate associated with a second portion of the memory device; feeding the first value and the second value to a neural network; and receiving, from the neural network, an instruction to perform a media management operation.

Feedback for multi-level signaling in a memory device
11543995 · 2023-01-03 · ·

Methods, systems, and devices for feedback for multi-level signaling in a memory device are described. A receiver may use a modulation scheme to communicate information with a host device. The receiver may include a first circuit, a second circuit, a third circuit, and a fourth circuit. Each of the first circuit, the second circuit, the third circuit, and the fourth circuit may determine, for a respective clock phase, a voltage level of a signal modulated using the modulation scheme. The receiver may include a first feedback circuit, a second feedback circuit, a third feedback circuit, and a fourth feedback circuit. The first feedback circuit that may use information received from the first circuit at the first clock phase and modify the signal input into the second circuit for the second clock phase.