G11C11/5657

MEMORY DEVICE BASED ON FERROELECTRIC CAPACITOR

The present disclosure relates to a memory device based on a ferroelectric capacitor, which includes a control unit for writing data into a memory cell or reading data from the memory cell and a plurality of memory cells arranged in an array; each memory cell includes an external interface, a first switch, a transistor, a first capacitor and a second capacitor, wherein at least one of the first capacitor and the second capacitor is a ferroelectric capacitor; the first switch has a first port connected with a first word line, a second port connected with a bit line, and a third port connected with one end of the first capacitor; and the transistor has a gate electrode connected with another end of the first capacitor and one end of the second capacitor, a source electrode connected with a first read terminal, and a drain electrode connected with a second read terminal, wherein another end of the second capacitor is connected with a second word line. According to the present disclosure, a polarized state of the ferroelectric capacitor in the memory cell is held or changed based on hysteresis characteristics of the ferroelectric capacitor, and the control unit is used to write data into or read data from the memory cell, which can implement non-destructive reading of data and longer endurance of a write operation.

MULTIPLY OPERATION CIRCUIT, MULTIPLY AND ACCUMULATE CIRCUIT, AND METHODS THEREOF
20220374202 · 2022-11-24 ·

Various aspects relate to a multiply and accumulate circuit, the multiply and accumulate circuit including: a plurality of multiply operation cells configured in a matrix arrangement. A respective multiply operation cell of the multiply operation cells includes: a field-effect transistor and a programmable switch in a series connection, wherein the field-effect transistor and the programmable switch are configured to control a current flow through the respective multiply operation cell to realize a multiplication operation. The multiply operation cells of a set of the plurality of multiply operation cells share a corresponding control line to realize an accumulation operation in addition to the multiply operations carried out by the set of multiply operation cells.

RESISTIVE ELECTRODES ON FERROELECTRIC DEVICES FOR LINEAR PIEZOELECTRIC PROGRAMMING

Disclosed are ferroelectric devices including devices for performing a multiplication of analog input signals and resonators. In one aspect, a ferroelectric nanoelectromechanical device includes a first structural beam, a first input electrode disposed on a first top portion of the first structural beam, and an output electrode. The apparatus further includes a first ferroelectric film disposed on a second top portion of the first input electrode, and a first resistive layer disposed on a third top portion of the first ferroelectric film, wherein a first electrode is positioned at a first end of the first resistive layer and a second electrode is positioned at a second end of the first resistive layer.

SYSTEMS AND METHODS TO STORE MULTI-LEVEL DATA

Disclosed herein are related to a memory system and a method of operating the memory system. In one aspect, resistances of a first memory cell, a second memory cell, a third memory cell, and a fourth memory cell are individually set. In one aspect, the first memory cell and the second memory cell are coupled to each other in series between a first line and a second line, and the third memory cell and the fourth memory cell are coupled to each other in series between the second line and a third line. In one aspect, current through the second line according to a parallel resistance of i) a first series resistance of the first memory cell and the second memory cell, and ii) a second series resistance of the third memory cell and the fourth memory cell is sensed. According to the sensed current, multi-level data can be read.

Three-Dimensional Memory Device and Method

In an embodiment, a device includes: a first dielectric layer over a substrate; a word line over the first dielectric layer, the word line including a first main layer and a first glue layer, the first glue layer extending along a bottom surface, a top surface, and a first sidewall of the first main layer; a second dielectric layer over the word line; a first bit line extending through the second dielectric layer and the first dielectric layer; and a data storage strip disposed between the first bit line and the word line, the data storage strip extending along a second sidewall of the word line.

METHODS OF OPERATING MULTI-BIT MEMORY STORAGE DEVICE

A method (of reading a ferroelectric field-effect transistor (FeFET) configured as a 2-bit storage device that stores two bits, wherein the FeFET includes a first source/drain (S/D) terminal, a second S/D terminal, a gate terminal and a ferroelectric layer, a second bit being at a first end of the ferroelectric layer, the first end being proximal to the first S/D terminal) includes reading the second bit including: applying a gate sub-threshold voltage to the gate terminal; applying a read voltage to the second S/D terminal; applying a do-not-disturb voltage to the first S/D terminal; and sensing a first current at the second S/D terminal; and wherein the read voltage is lower than the do-not-disturb voltage.

CIRCUIT DESIGN AND LAYOUT WITH HIGH EMBEDDED MEMORY DENSITY

Various embodiments of the present disclosure are directed towards a memory device. The memory device has a first transistor having a first source/drain and a second source/drain, where the first source/drain and the second source/drain are disposed in a semiconductor substrate. A dielectric structure is disposed over the semiconductor substrate. A first memory cell is disposed in the dielectric structure and over the semiconductor substrate, where the first memory cell has a first electrode and a second electrode, where the first electrode of the first memory cell is electrically coupled to the first source/drain of the first transistor. A second memory cell is disposed in the dielectric structure and over the semiconductor substrate, where the second memory cell has a first electrode and a second electrode, where the first electrode of the second memory cell is electrically coupled to the second source/drain of the first transistor.

Write techniques for a memory device with a charge transfer device

Techniques are provided for writing a high-level state to a memory cell capable of storing three or more logic states. After a sense operation performed by a first sense component and a second sense component, a digit line may be isolated from the first sense component and the second sense component. The high-level state may be stored in the memory cell, then a second state may be stored in the memory cell, in which the second state may be a mid-level state or a low-level state. The second state may be stored based on a write-back component identifying that the second state was stored in the memory cell before the write back procedure.

CIRCUIT DESIGN AND LAYOUT WITH HIGH EMBEDDED MEMORY DENSITY

Various embodiments of the present disclosure are directed towards a memory device. The memory device has a first transistor having a first source/drain and a second source/drain, where the first source/drain and the second source/drain are disposed in a semiconductor substrate. A dielectric structure is disposed over the semiconductor substrate. A first memory cell is disposed in the dielectric structure and over the semiconductor substrate, where the first memory cell has a first electrode and a second electrode, where the first electrode of the first memory cell is electrically coupled to the first source/drain of the first transistor. A second memory cell is disposed in the dielectric structure and over the semiconductor substrate, where the second memory cell has a first electrode and a second electrode, where the first electrode of the second memory cell is electrically coupled to the second source/drain of the first transistor.

STACK REGISTER HAVING DIFFERENT FERROELECTRIC MEMORY ELEMENT CONSTRUCTIONS

Apparatus and method for managing data in a processing system, such as but not limited to a data storage device such as a solid-state drive (SSD). A ferroelectric stack register memory has a first arrangement of ferroelectric memory cells (FMEs) of a first construction and a second arrangement of FMEs of a different, second construction arranged to provide respective cache lines for use by a controller, such as a programmable processor. A pointer mechanism is configured to provide pointers to point to each of the respective cache lines based on a time sequence of operation of the processor. Data sets can be migrated to the different arrangements by the controller as required based on the different operational characteristics of the respective FME constructions. The FMEs may be non-volatile and read-destructive. Refresh circuitry can be selectively enacted under different operational modes.