A multiphase programming scheme for programming a plurality of memory cells of a data storage system includes a first programming phase in which a first set of voltage distributions of the plurality of memory cells is programmed by applying a first plurality of program pulses to word lines of the plurality of memory cells, and a second programming phase in which a second set of voltage distributions is programmed by applying a second plurality of program pulses to the word lines of the plurality of memory cells. The second programming phase includes maintaining a margin of separation between two adjacent voltage distributions of the second set of voltage distributions after each of the second plurality of program pulses. This scheme achieves better margin using an aggressive quick pass approach, which helps with data recovery in case of power loss events.

According to one embodiment, a memory system includes n memory cells, each capable of storing j bits of data; and a controller. The controller is configured to write a first portion of each of first data to n-th data from among n×j data with consecutive logical addresses to the n memory cells one by one. The first data has a lowest logical address among the n×j pieces of data. The first data to the n-th data have ascending consecutive logical addresses. The controller is configured to write the first portion of one of the first to n-th data as a first bit of the j bits, and write the first portion of another one of the first to n-th data except said one of the first to n-th data as a second bit of the j bits.

Memories might include a plurality of strings of memory cells, a plurality of access lines each connected to the strings of memory cells, and a controller configured to cause the memory to determine a particular voltage level applied to each of the access lines that is deemed to activate each memory cell of a first subset of the strings of series-connected memory cells programmed to store respective data states that are each lower than or equal to a first data state of a plurality of data states, apply the particular voltage level to a particular access line of the plurality of access lines, and for each memory cell connected to the particular access line that is contained in a second subset of the strings of series-connected memory cells, determine whether that memory cell is deemed to be activated while applying the particular voltage level to the particular access line.

There are provided a semiconductor memory device and a method for operating the same. The semiconductor memory device includes: a memory cell array with a plurality of memory cells programmed to a plurality of program states; a peripheral circuit configured for performing a program operation on selected memory cells among the plurality of memory cells through a plurality of program loops; a current sensing circuit for determining a verify result of each of the plurality of program states by performing an individual state current sensing operation on the selected memory cells among the memory cells; and a control logic for controlling the current sensing circuit to perform the individual state current sensing operation, based on a number of program loops, among a plurality of program loops, that are performed.

Aspects of a storage device including a memory and a controller are provided. The memory can include memory dies that draw a current from a current source during a program operation. The controller may monitor for an alarm signal from the memory dies on a first common channel between the controller and the memory dies. The alarm signal indicates that a corresponding memory die is entering an operational state that draws a peak current from the current source for the program operation. The controller can receive, from the memory dies, one or more alarm signals on the first common channel within a predetermined threshold time. The controller can transmit a postpone signal on a second common channel to the memory dies based on the one or more alarm signals received within the predetermined threshold time.

Some embodiments include apparatuses and methods using first and second data lines coupled to respective first and second memory cell strings; an access line shared by first and second memory cells of the first and second memory cell strings, respectively; and a control unit including circuitry to perform operations including charging the first data line to a first voltage during a first time interval of an operation performed on first and second memory cells; holding the second data line at a second voltage during the first time interval; charging the first data line to a third voltage during a second time interval of the operation; charging the second data line to a fourth voltage during the second time interval; and determining, during the second time interval of the operation, whether the first memory cell reaches a first threshold voltage and whether the second memory cell reaches a second threshold voltage.

A memory device includes a plurality of memory cell transistors, a first word line, a controller, and a storage circuit. Each of the plurality of memory cell transistors stores a plurality of pieces of bit data. The first word line is connected to a plurality of first memory cell transistors in the plurality of memory cell transistors. The controller performs a loop process including repetition of a program loop including a program operation and a first verification operation. The storage circuit stores status information. The controller performs the loop process, then performs a second verification operation, and stores first status data corresponding to a result of the loop process and second status data corresponding to a result of the second verification operation in the storage circuit, in a write operation using the plurality of first memory cell transistors as targets.

Apparatuses and techniques are described for modifying program and erase parameters in a memory device in which memory cells can be operated in a single bit per cell (SLC) mode or a multiple bits per cell mode. In one approach, the stress on a set of memory cells in an SLC mode is reduced during programming and erasing when the number of program-erase cycles for the block in the SLC mode is below a threshold. For example, during programming, the program-verify voltage and program voltages can be reduced to provide a shallower than normal programming. During erasing, the erase-verify voltage can be increased while the erase voltages can be reduced to provide a shallower than normal erase. When the number of program-erase cycles for the block in the SLC mode is above the threshold, the program and erase parameters revert to a default levels.

A non-volatile memory system erasing groups of connected memory cells separately performs erase verify for memory cells connected to even word lines to generate even results and erase verify for memory cells connected to odd word lines to generate odd results. The even results and the odd results are used to determine if the erase verify process indicates that the erasing has successful completed. In addition, for each group of connected memory cells, a last even result for the group is compared to a last odd result for the group. Even if the erase verify indicated that the erasing has successfully completed, the system may determine that the erasing failed (i.e. due to a defect) if the number of groups of connected memory cells that have the last even result different than the last odd result is greater than a limit.

Provided herein may be a memory system. The memory system may include a memory device including a memory block and a peripheral circuit, and a memory controller configured to transmit a program command based on a single-level cell scheme to the memory device so as to increase threshold voltages of the selection transistors included in the memory block after an erase operation has been performed on the memory block, and transmit, to the memory device, a read command to perform a check operation, wherein the read command indicates a first read voltage and a second read voltage higher than the first read voltage, and the check operation includes a check of whether the threshold voltages fall within a range between the first and second read voltages, or a check of whether the threshold voltages are lower than the first read voltage or higher than the second read voltage.