Semiconductor memory is provided wherein a memory cell includes a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell. The cell further includes a nonvolatile memory comprising a resistance change element configured to store data stored in the floating body under any one of a plurality of predetermined conditions. A method of operating semiconductor memory to function as volatile memory, while having the ability to retain stored data when power is discontinued to the semiconductor memory is described.

A memory system for performing a recovery operation is provided. A memory system includes a memory device including a plurality of memory cells constituting a plurality of sub-sets, and a memory controller for controlling the memory device. The memory controller controls the memory device to manage a read count indicating a number of read operations performed by the memory device for each of the plurality of sub-sets, and to perform a recovery operation on a sub-set, among the plurality of sub-sets, based on the read count corresponding to the read count. Each of a plurality of sub-sets includes a plurality of pages. Each of the plurality of pages is a unit in which a read operation is performed in the plurality of memory cells.

A non-volatile memory includes a first semiconductor layer vertically stacked on a second semiconductor layer and including a first memory group, a second memory group, a third memory group and a fourth memory group. The second semiconductor layer includes a first region, a second region, a third region and a fourth region respectively underlying the first memory group, second memory group, third memory group and fourth memory group. The first region includes one driving circuit connected to memory cells of one of the second memory group, third memory group and fourth memory group through a first word line, and another driving circuit connected to memory cells of the first memory group through a first bit line, wherein the first word line and first bit line extend in the same horizontal direction.

A resistive random access memory includes a memory cell including a resistive element having a resistance which varies according to a write operation and stores data according to the resistance of the resistive element, a reference resistive element having a resistance set to a first value, a voltage line set to a first voltage during a first write operation in which the resistance of the resistive element is varied from a second value higher than the first value to the first value, and a voltage control circuit arranged between first ends of the two resistive elements. The voltage control circuit adjusts a value of the first voltage supplied from the voltage line so as to reduce a difference between currents flowing through the two resistive elements during the first write operation, and supply the adjusted first voltage to the first ends of the two resistive elements.

There are provided a variable resistance memory device and a manufacturing method of the same. The variable resistance memory device includes: a first electrode; a second electrode arranged in a vertical direction from the first electrode; and an oxide layer having an oxygen deficient region extending in the vertical direction between the second electrode and the first electrode.

A programmable resistive memory element and a method of adjusting a resistance of a programmable resistive memory element are provided. The programmable resistive memory element includes at least one resistive memory element. Each resistive memory element includes an Indium-Gallium-Zinc-Oxide (IGZO) resistive layer, a first electrical contact and a second electrical contact. The first and second electrical contacts are disposed on the IGZO resistive layer in the same plane. The programmable resistive memory element includes a voltage generator coupled to the first and second electrical contacts, constructed and arranged to apply a thermal treatment to the resistive memory element to adjust a resistance of the resistive memory element.

This application provides a storage device and a data writing method. The storage device may be used in a neural network. The storage device includes a memristor unit, a current-controlled circuit, and a write circuit. The memristor unit has a structure of one-transistor and one-resistive random access memory 1T1R. The current-controlled circuit is configured to limit a current passing through the memristor unit to a target current, where the target current is determined based on target conductance of the memristor unit and a gate voltage of the transistor, and the target conductance is used to indicate target data to be written into the memristor unit. The write circuit is configured to load a write voltage to the memristor unit in cooperation with the current-controlled circuit, to write the target data to the memristor unit.

Disclosed herein are related to a memory cell including one or more programmable resistors and a control transistor. In one aspect, a programmable resistor includes a gate structure and one or more source/drain structures for forming a transistor. A resistance of the programmable resistor may be set by applying a voltage to the gate structure, while the control transistor is enabled. Data stored by the programmable resistor can be read by sensing current through the programmable resistor, while the control transistor is disabled. In one aspect, the one or more programmable resistors and the control transistor are implemented by same type of components, allowing the memory cell to be formed in a compact manner through a simplified the fabrication process.

An ionic transistor including a first source, a first drain spaced apart from the first source, and a first storage layer electrically connected to the first source and the first drain. The ionic transistor also includes a second source spaced apart from the first source, a second drain spaced apart from the second source, and a second storage layer electrically connected to the second source and the second drain. The ionic transistor further includes an electrolyte layer situated between and electrically connected to the first and second storage layers. The ionic transistor may be implemented as non-volatile memory in a machine learning (ML) application.

Disclosed herein are related to a circuit and a method of reading or sensing multiple bits of data stored by a multi-level cell. In one aspect, a first reference circuit is selected from a first set of reference circuits, and a second reference circuit is selected from a second set of reference circuits. Based at least in part on the first reference circuit and the second reference circuit, one or more bits of multiple bits of data stored by a multi-level cell can be determined. According to the determined one or more bits, a third reference circuit from the first set of reference circuits and a fourth reference circuit from the second set of reference circuits can be selected. Based at least in part on the third reference circuit and the fourth reference circuit, additional one or more bits of the multiple bits of data stored by the multi-level cell can be determined.