A device for implementing spike-timing-dependent plasticity is provided. The device includes a phase-change element, first and second electrodes disposed respective first and second surfaces of the phase-change element. The phase-change element includes a phase-change material with an inverse resistivity characteristic. The first electrode includes a first heater element, and a first electrical insulating layer which electrically insulates the first resistive heater element from the first electrode and the phase-change element. The second electrode includes a second resistive heater element, and a second electrical insulating layer which electrically insulates the second resistive heater element from the second electrode and the phase-change element.

A phase change (PCM) memory device that includes a PCM and a resistance-capacitance (RC) circuit. The PCM has one or more PCM properties, each PCM property has a plurality of PCM property states. As the PCM property states of a given property are Set or Reset, the PCM property states each produce an incremental change to a property level of the respective/associated PCM property, e.g., PCM conductance. The incremental changes to property level of the PCM memory device are in response to application of one or more of a pulse number of voltage pulses. The RC circuit produces a configuring current that flows through the PCM in response to one or more of the voltage pulses. The configuring current modifies one or more of the incremental changes to one or more of the property levels so that the property level changes lineally with respect to the pulse number. The PCM memory device has use in a synapse connector, e.g., in a memory array. The memory array can be used to store and/or read memory values associated with one or more of the property levels. The memory values can be used as weighting values in a neuromorphic computing application/system, like a neural network.

A semiconductor device is provided. The semiconductor device includes a substrate a substrate, a first electrode structure on the substrate, the first electrode structure including first insulating patterns and first electrode patterns, the first insulating patterns alternately stacked with the first electrode patterns, a second electrode pattern on a sidewall of the first electrode structure, and a data storage film on a sidewall of the second electrode pattern. The data storage film has a variable resistance.

A memory includes first signal lines divided into groups respectively including m (m is an integer equal to or larger than 2) lines, and second signal lines. A memory cell array includes memory cells. (m+2) or more global signal lines are configured to apply a selection voltage to any of the first signal lines. First transistors are provided to correspond to each of the first signal lines in one-to-one correspondence and are connected between the first signal lines and the global signal lines. First selection signal lines are provided to respectively correspond to the groups, and are each connected to gate electrodes of the first transistors included in a corresponding one of the groups in common. The first signal lines located at both ends of each of any two of the groups which are adjacent to each other are connected to mutually different ones of the global signal lines.

Disclosed is a semiconductor device including first conductive lines, second conductive lines crossing the first conductive lines, and memory cells at intersections between the first conductive lines and the second conductive lines. Each of the memory cells includes a magnetic tunnel junction pattern, a bi-directional switching pattern connected in series to the magnetic tunnel junction pattern, and a conductive pattern between the magnetic tunnel junction pattern and the bi-directional switching pattern.

A multi-level cell (MLC) one-selector-one-resistor (1S1R) three-dimensional (3D) cross-point memory system includes at least one MLC 1S1R structure including a stacked arrangement of a phase change memory (PCM) cell and a threshold switch selector. An electrically conductive bit line is in electrical communication with the OTS selector, and an electrically conductive word line is in electrical communication with the PCM cell. A controller is in electrical communication with the bit line and the word line. The controller is configured to select at least one voltage pulse from a group of different voltage pulses comprising a read pulse, a partial set pulse, a set pulse, a partial reset pulse, and a reset pulse, and configured to deliver the selected at least one voltage pulse to the at least one MLC 1S1R structure.

In an embodiment, a method includes receiving, between a positive input terminal and a negative input terminal, a supply voltage, receiving a data signal, generating, by a voltage generator in a branch of a plurality of branches, a branch current as a function of a respective driving signal and of a regulated voltage, each branch connected between the positive input terminal and the negative input terminal, selectively activating the voltage generator as a function of a respective enabling signal and providing, between a positive output terminal and a negative output terminal, the regulated voltage to one or more driving circuits.

According to one embodiment, a method, computer system, and computer program product for increasing linearity of a weight update of a phase change memory (PCM) cell is provided. The present invention may include applying a RESET pulse to amorphize the phase change material of the PCM cell; responsive to applying the RESET pulse, applying an incubation pulse to the PCM cell; and applying a plurality of partial SET pulses to incrementally increase the conductance of the PCM cell.

Systems and methods for reducing the impact of defects within a crossbar memory array when performing multiplication operations in which multiple control lines are concurrently selected are described. A group of memory cells within the crossbar memory array may be controlled by a local word line that is controlled by a local word line gating unit that may be configured to prevent the local word line from being biased to a selected word line voltage during an operation; the local word line may instead be set to a disabling voltage during the operation such that the memory cell currents through the group of memory cells are eliminated. If a defect has caused a short within one of the memory cells of the group of memory cells, then the local word line gating unit may be programmed to hold the local word line at the disabling voltage during multiplication operations.

A memory device includes a memory array comprising a plurality of memory elements and a memory controller coupled to the memory array. The memory controller when in operation receives an indication of a defect in the memory array determines a first location of the defect when the defect is affecting only one memory element of the plurality of memory elements, determines a second location of the defect when the defect is affecting two or more memory elements of the plurality of memory elements, and performs a blown operation on a defective memory element at the second location when the defect is affecting two or more memory elements of the plurality of memory elements.