A single-event-upset (SEU) stabilized memory cell includes a latch portion including a cross-coupled latch, and at least one cross coupling circuit path in the latch portion including a first series-connected pair of vertical resistors.

A digital system includes a non-volatile calculating register having a set of latches configured to perform a calculation. A set of non-volatile storage cells is coupled to the set of latches. Access detection logic is coupled to the calculating register and is operable to initiate a calculation of a next value by the calculating register each time the calculating register is accessed by an accessing module. The access detection logic is operable to cause the next value to be stored in the set of non-volatile storage cells at the completion of the calculation as an atomic transaction. After a power loss or other restore event, the contents of the calculating register may be restored from the non-volatile storage cells.

Disclosed is a semiconductor device including first conductive lines, second conductive lines crossing the first conductive lines, and memory cells at intersections between the first conductive lines and the second conductive lines. Each of the memory cells includes a magnetic tunnel junction pattern, a bi-directional switching pattern connected in series to the magnetic tunnel junction pattern, and a conductive pattern between the magnetic tunnel junction pattern and the bi-directional switching pattern.

Technologies for a three-dimensional (3D) multi-bit non-volatile dynamic random access memory (nvDRAM) device, which may include a DRAM array having a plurality of DRAM cells with single or dual transistor implementation and a non-volatile memory (NVM) array having a plurality of NVM cells with single or dual transistor implementations, where the DRAM array and the NVM array are arranged by rows of word lines and columns of bit lines. The nvDRAM device may also include one or more of isolation devices coupled between the DRAM array and the NVM array and configured to control connection between the dynamic random access bit lines (BLs) and the non-volatile BLs. The word lines run horizontally and may enable to select one word of memory data, whereas bit lines run vertically and may be connected to storage cells of different memory address.

To reduce the area of a memory cell having a backup function. A storage device includes a cell array, and a row circuit and a column circuit that drive the cell array. The cell array includes a first power supply line, a second power supply line, a word line, a pair of bit lines, a memory cell, and a backup circuit. The cell array is located in a power domain where power gating can be performed. In the power gating sequence of the cell array, data in the memory cell is backed up to the backup circuit. The backup circuit is stacked over a region where the memory cell is formed. A plurality of wiring layers are provided between the backup circuit and the memory cell. The first power supply line, the second power supply line, the word line, and the pair of bit lines are located in different wiring layers.

A semiconductor device 50 of the invention includes a supply voltage VCC, a plurality of registers 14, a PMOS transistor P, an AND gate 12, and a determination circuit 16. The registers 14 include a first register and a second register. The first register can keep data, and the second register can keep a check bit. The PMOS transistor P and the AND gate 12 are both connected between the supply voltage VCC and the registers 14, and both control the supply from the supply voltage VCC to the registers 14. The determination circuit 16 determines whether the check bit kept in the second register is correct or not in a DPD (deep-power-down) mode. An operating margin of the second register is worse than that of the first register. While the determination circuit 16 determines that the check bit kept in the second register is incorrect, the PMOS transistor P provides the supply voltage VCC to the registers 14.

A random bit cell includes a latch and a nonvolatile memory cell. The nonvolatile memory cell includes a storage circuit, a control element, an erase element, and a read circuit. The storage circuit is coupled to a first terminal of the latch. The storage circuit includes a floating gate transistor having a first terminal, a second terminal, and a floating gate. The control element has a first terminal coupled to a control line, and a control terminal coupled to the floating gate of the floating gate transistor. The erase element has a first terminal coupled to an erase line, and a control terminal coupled to the floating gate of the floating gate transistor. The read circuit is coupled to a bit line, a select gate line, and the floating gate of the floating gate transistor.

A novel memory device is provided.

The memory device including a plurality of memory cells arranged in a matrix, and each of the memory cells includes a transistor and a capacitor. The transistor includes a first gate and a second gate, which include a region where they overlap with each other with a semiconductor layer therebetween. The memory device has a function of operating in a writing mode, a reading mode, a refresh mode, and an NV mode. In the refresh mode, data retained in the memory cell is read, and then the read data is written to the memory cell again for first time. In the NV mode, data retained in the memory cell is read, the read data is written to the memory cell again for second time, and then a potential at which the transistor is turned off is supplied to the second gate. The NV mode operation enables data to be stored for a long time even when power supply to the memory cell is stopped. The memory cell can store multilevel data.

Methods of operating memory might include storing information indicative of a data value of a digit of data stored in a particular memory cell of the memory prior to programming a subsequent digit of data to the particular memory cell, programming the subsequent digit of data to the particular memory cell, monitoring a voltage level of a supply voltage to the memory while programming the subsequent digit of data, and, if the voltage level of the supply voltage falls below a threshold while programming the subsequent digit of data and the information indicative of the data value of the digit of data has a particular logic level, causing a change in threshold voltage of one memory cell of a pair of gate-connected non-volatile memory cells, and inhibiting the other memory cell of the pair of gate-connected non-volatile memory cells from a change in threshold voltage.

A semiconductor device includes first conductive lines, second conductive lines crossing the first conductive lines, and memory cells at intersections between the first conductive lines and the second conductive lines. Each of the memory cells includes a magnetic tunnel junction pattern, a bi-directional switching pattern connected in series to the magnetic tunnel junction pattern, and a conductive pattern between the magnetic tunnel junction pattern and the bi-directional switching pattern.