A multi-chip package includes: an interposer; a first IC chip over the interposer, wherein the first IC chip is configured to be programmed to perform a logic operation, comprising a NVM cell configured to store a resulting value of a look-up table, a sense amplifier having an input data associated with the resulting value from the NVM cell and an output data associated with the first input data of the sense amplifier, and a logic circuit comprising a SRAM cell configured to store data associated with the output data of the sense amplifier, and a multiplexer comprising a first set of input points for a first input data set for the logic operation and a second set of input points for a second input data set having data associated with the data stored in the SRAM cell, wherein the multiplexer is configured to select, in accordance with the first input data set, an input data from the second input data set as an output data for the logic operation; and a second IC chip over the interposer, wherein the first IC chip is configured to pass data associated with the output data for the logic operation to the second IC chip through the interposer.

Disclosed herein are related to a memory cell including magnetic tunneling junction (MTJ) devices. In one aspect, the memory cell includes a first layer including a first transistor and a second transistor. In one aspect, the first transistor and the second transistor are connected to each other in a cross-coupled configuration. A first drain structure of the first transistor may be electrically coupled to a first gate structure of the second transistor, and a second drain structure of the second transistor may be electrically coupled to a second gate structure of the first transistor. In one aspect, the memory cell includes a second layer including a first MTJ device electrically coupled to the first drain structure of the first transistor and a second MTJ device electrically coupled to the second drain structure of the second transistor. In one aspect, the second layer is above the first layer.

System and methods for implementing a multiply and accumulate (MAC) operation are described. In an example, a device can multiply an input digital signal with an input current to generate a current signal. The device can further divide the current signal into a plurality of currents. The device can further sample the plurality of currents sequentially using the same clock frequency. The device can further combine the plurality of sampled currents to generate an output current signal.

A semiconductor circuit includes a first circuit that applies an inverted voltage of a voltage at a first node to a second node, a second circuit that applies an inverted voltage of a voltage at the second node to the first node, a first transistor that couples the first node to a third node, and a first memory element having a first terminal coupled to the third node and a second terminal to which a control voltage is to be applied. The semiconductor circuit further includes a second transistor having a drain coupled to the third node and a gate coupled to one of the first node or the second node, a third transistor having a drain coupled to the third node and a gate coupled to the other of the first node or the second node, and a driver.

An electronic circuit includes a cell array including memory cells each including a bistable circuit that includes first and second inverter circuits, each having a first mode characterized by there being substantially no hysteresis in transfer characteristics and a second mode characterized by there being hysteresis in the transfer characteristics, and being switchable between the first and second modes, and a control circuit configured to, after powering off a first memory cell that store data that are not required to be retained, put the bistable circuit in a remaining second memory cell into the second mode, and supply a second power supply voltage that allows the bistable circuit in the second mode to retain data and is lower than a first power supply voltage supplied to the bistable circuit when data is read and/or written, to the bistable circuit in the second memory cell while maintaining the second mode.

A multi-chip package includes: an interposer; a first IC chip over the interposer, wherein the first IC chip is configured to be programmed to perform a logic operation, comprising a NVM cell configured to store a resulting value of a look-up table, a sense amplifier having an input data associated with the resulting value from the NVM cell and an output data associated with the first input data of the sense amplifier, and a logic circuit comprising a SRAM cell configured to store data associated with the output data of the sense amplifier, and a multiplexer comprising a first set of input points for a first input data set for the logic operation and a second set of input points for a second input data set having data associated with the data stored in the SRAM cell, wherein the multiplexer is configured to select, in accordance with the first input data set, an input data from the second input data set as an output data for the logic operation; and a second IC chip over the interposer, wherein the first IC chip is configured to pass data associated with the output data for the logic operation to the second IC chip through the interposer.

Technologies for various memory structures for artificial intelligence (AI) applications and methods thereof are described. An XNOR circuit along with a sense amplifier may be combined with an array (or multiple arrays) of memory such as non-volatile memory (NVM) or an NVM, SRAM combination to perform an XNOR operation on the data read from the memory. Various versions may include different connections allowing simplification of circuitry or timing. In some examples, memory array may include programmable resistor/switch device combinations, or multiple columns connected to a single XNOR+SA circuit.

Disclosed are embodiments of a non-volatile static random access memory (NV-SRAM) cell. The NV-SRAM cell includes a static random access memory (SRAM) circuit (e.g., a conventional high performance, high reliability SRAM circuit). However, in order to avoid volatility while still retaining the advantages associated with SRAM circuit operation, the NV-SRAM cell also includes a pair of NVM circuits. These NVM circuits capture data values stored on the data nodes of the SRAM circuit prior to power down and rewrite those data values back onto the data nodes of the SRAM circuit upon power up. Also disclosed are embodiments of a method of operating a selected NV-SRAM cell in a memory array.

A multi-chip package includes a field-programmable-gate-array (FPGA) integrated-circuit (IC) chip configured to perform a logic function based on a truth table, wherein the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip comprises multiple non-volatile memory cells therein configured to store multiple resulting values of the truth table, and a programmable logic block therein configured to select, in accordance with one of the combinations of its inputs, one from the resulting values into its output; and a memory chip coupling to the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip, wherein a data bit width between the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip and the memory chip is greater than or equal to 64.

Disclosed herein are related to a memory cell including magnetic tunneling junction (MTJ) devices. In one aspect, the memory cell includes a first layer including a first transistor and a second transistor. In one aspect, the first transistor and the second transistor are connected to each other in a cross-coupled configuration. A first drain structure of the first transistor may be electrically coupled to a first gate structure of the second transistor, and a second drain structure of the second transistor may be electrically coupled to a second gate structure of the first transistor. In one aspect, the memory cell includes a second layer including a first MTJ device electrically coupled to the first drain structure of the first transistor and a second MTJ device electrically coupled to the second drain structure of the second transistor. In one aspect, the second layer is above the first layer.