A method for storing information in SRAM bit cell arrays provides for lowering voltage supplied to the SRAM bit cell arrays, with voltage lowering controlled by a connected voltage control circuit. Writing, reading, and correcting information storable in the SRAM bit cell arrays is accomplished using an error correcting code (ECC) block connected to at least some of the SRAM bit cell arrays. The ECC block is configurable to repair stored information.

A memory cell comprising includes a silicon-on-insulator (SOI) substrate, an electrically floating body transistor fabricated on the silicon-on-insulator (SOI) substrate, and a charge injector region. The floating body transistor is configured to have more than one stable state through an application of a bias on the charge injector region.

A memory cell comprising includes a silicon-on-insulator (SOI) substrate, an electrically floating body transistor fabricated on the silicon-on-insulator (SOI) substrate, and a charge injector region. The floating body transistor is configured to have more than one stable state through an application of a bias on the charge injector region.

Methods, systems, and devices for non-destructive pattern identification at a memory device are described. A memory device may perform pattern identification within the memory device and output a flag indicating whether a first data pattern matches with a second data pattern. The memory device may access one or more memory cells, via a word line, and latch the second data pattern of the memory cells to a sense amplifier. The memory device may deactivate the word line, which may result in isolating the memory cells from potential destruction of data. The memory device may write a first data pattern to the sense amplifier and compare the first data pattern and second data pattern at the sense amplifier. The memory device may output a signal indicating whether the data patterns match.

A circuit of cells used as a memory array and capable of in-memory arithmetic which includes a plurality of signed ternary processing, each signed ternary processing cell includes a first memory cell, adapted to hold a first digital value, a second memory cell, adapted to hold a second digital value, wherein a binary combination of the first digital value and the second digital value establishes a first signed ternary operand, a signed ternary input forming a second signed ternary operand, and a signed ternary output, wherein the signed ternary output represents a signed multiplication of the first signed ternary operand and the second signed ternary operand, a sense circuit adapted to output a subtraction result.

A memory device includes a storage circuit, a first driving circuit, and a second driving circuit. The storage circuit stores first data and compares the first data and second data. The first driving circuit selectively drives a matching line to a first logic state, depending on a comparison result of the first data and the second data by the storage circuit. The second driving circuit drives the matching line to a second logic state regardless of the comparison result.

A method for storing information in SRAM bit cell arrays provides for lowering voltage supplied to the SRAM bit cell arrays, with voltage lowering controlled by a connected voltage control circuit. Writing, reading, and correcting information storable in the SRAM bit cell arrays is accomplished using an error correcting code (ECC) block connected to at least some of the SRAM bit cell arrays. The ECC block is configurable to repair stored information.

A method for storing information in SRAM bit cell arrays provides for lowering voltage supplied to the SRAM bit cell arrays, with voltage lowering controlled by a connected voltage control circuit. Writing, reading, and correcting information storable in the SRAM bit cell arrays is accomplished using an error correcting code (ECC) block connected to at least some of the SRAM bit cell arrays. The ECC block is configurable to repair stored information.

A semiconductor device that enables a memory size reduction is provided. The semiconductor device includes a converter circuit, a memory circuit, and a detection circuit. The converter circuit has a function of converting first data that includes a digital voltage value to second data that includes an analog current value. The memory circuit has a function of storing third data that includes an analog current value. The detection circuit has a function of generating data that indicates whether the analog current values of the second and third data match.

A memory device includes a storage circuit, a first driving circuit, and a second driving circuit. The storage circuit stores first data and compares the first data and second data. The first driving circuit selectively drives a matching line to a first logic state, depending on a comparison result of the first data and the second data by the storage circuit. The second driving circuit drives the matching line to a second logic state regardless of the comparison result.