An integrated circuit includes an input/output (I/O) circuit configured to receive a first signal and a second signal and a fault detection circuit. The I/O circuit includes an I/O terminal, an I/O buffer, and a pull resistor having a first terminal coupled to the I/O terminal. The fault detection circuit is configured to determine whether a predetermined number of toggles of the first signal occurs while the second signal is held at a constant logic state, assert a fault indicator when the predetermined number of toggles occurs, and negate the fault indicator when the predetermined number of toggles does not occur.

Methods, systems, and devices for performing quick precharge command sequences are described. An operating mode that is associated with a command sequence having a reduced duration relative to another operating mode may be configured at a memory device. The operating mode may be configured based on determining that a procedure does not attempt to preserve or is independent of preserving a logic state of accessed memory cells, among other conditions. While operating in the mode, the memory device may perform a received precharge command using a first set of operations having a first duration—rather than a second set of operations having a second set of operations having a second, longer duration—to perform the received precharge command. The first set of operations may also use less current or introduce less disturbance into the memory device relative to the second set of operations.

Memory devices, systems including memory devices, and methods of operating memory devices are described, in which memory device are configured to add variable delays to a command. The variable delays may be provided by a host device (e.g., a test equipment) using a test mode of the memory devices. Alternatively, the variable delays may be stored in nonvolatile memory (NVM) components of the memory devices. Further, mode registers of the memory devices may be set to indicate that the command is associated with the variable delays stored in the NVM components. Further, the memory devices may include delay components configured to add the variable delays to the command. Such variable delays facilitate staggered execution of the command across multiple memory devices so as to avoid (or mitigate) issues related to an instantaneous, large amount of current drawn from a power supply connected to the memory devices.

In certain aspects, a circuit for ZQ resistor calibration can include a first input configured to receive a first default configuration. The circuit can also include a second input configured to receive a first calibration value based on a first comparison. The circuit can further include a first output configured to provide a first resistor code for a first resistor category. The circuit can additionally include a second output configured to provide a second resistor code for a second resistor category different from the first resistor category. The circuit can also include a first logic circuit configured to receive a signal from the first input and a signal from the second input, and provide a signal to the first output. The signal to the first output can include the first resistor code. The first resistor code can be different from the second resistor code.

A memory device includes a memory array comprising a plurality of memory elements and a memory controller coupled to the memory array. The memory controller when in operation receives an indication of a defect in the memory array determines a first location of the defect when the defect is affecting only one memory element of the plurality of memory elements, determines a second location of the defect when the defect is affecting two or more memory elements of the plurality of memory elements, and performs a blown operation on a defective memory element at the second location when the defect is affecting two or more memory elements of the plurality of memory elements.

A method to manufacture a semiconductor device includes: bonding a first wafer and a second wafer to be stacked vertically with one another, in which the first wafer provides a plurality of memory components and the second wafer provides a control circuit; forming a plurality of input/output channels on a surface of one of the first and second wafers; and cutting the bonded first and second wafers into a plurality of dices; wherein a plurality of first conductive contacts in the first wafer are electrically connected to the control circuit and the first conductive contacts in combinations with a plurality of first conductive vias in the first wafer form a plurality of transmission channels through which the control circuit is capable to access the memory components.

There is provided a data processing apparatus, which is suitable for verifying memory systems. Processing circuitry issues a plurality of memory access requests to a plurality of addresses in a memory. Point-of-trust circuitry receives the memory access requests from the processing circuitry via a first set of intermediate circuits. Secure channel circuitry enables secure communication of a correspondence between the plurality of addresses from the processing circuitry to the point-of-trust circuitry. The point-of-trust circuitry determines whether the addresses in the memory of the memory access requests received via the first set of intermediate circuits have a predetermined relationship based on the correspondence.

A non-volatile memory device includes a memory cell array including a plurality of memory cells respectively connected to a plurality of word lines; a plurality of first pass transistors each connected to one side of one of the plurality of word lines; a plurality of second pass transistors each connected to the other side of one of the plurality of word lines; a voltage generator configured to generate a plurality of operating voltages and to apply the plurality of operating voltages to the memory cell array; in response to a first switch control signal, a first switch circuit configured to connect the plurality of first pass transistors to the voltage generator; and in response to a first switch control signal, a second switch circuit configured to connect the plurality of second pass transistors to the voltage generator.

Provided is a non-volatile memory device. The non-volatile memory device includes: a memory cell array including cell strings, each including memory cells respectively connected to word lines; a page buffer circuit including page buffers respectively connected to the memory cells through bit lines, wherein a first page buffer is connected to a first cell string through a first bit line; a control logic circuit configured to control a pre-sensing operation to disconnect the first bit line and the first cell string from each other during a pre-sensing period for detecting a defect of the first bit line and control a post-sensing operation to connect the first bit line and the first cell string to each other in a post-sensing period for detecting defects of the word lines and the first bit line; and a defect detection circuit configured to detect defects of the word lines based the sensing operations.

Semiconductor devices, packaging architectures and associated methods are disclosed. In one embodiment, a semiconductor device is disclosed. The semiconductor device includes a first semiconductor die having a first bonding surface that is formed with a first set of contacts patterned with a first connection pitch. A second semiconductor die has a second bonding surface that is formed with a second set of contacts patterned with a second connection pitch. The second set of contacts are further patterned with a paired offset. The second semiconductor die is bonded to the first semiconductor die such that the first set of contacts is disposed in opposed electrical engagement with at least a portion of the second set of contacts.