A method for trimming analog temperature sensors. First, raise a temperature of a temperature sensor to a highest temperature of a qualification temperature range. Then, trim the temperature sensor such that a high temperature code generated by the temperature sensor represents an actual temperature reported by the temperature sensor at the highest temperature. Next, lower the temperature of the temperature sensor to a lowest temperature of the qualification temperature range. Determine a slope error between the high temperature code and a low temperature code generated by the temperature sensor at the lowest temperature. Finally, determine a correction function that compensates for the slope error of measured temperature codes generated by the temperature sensor for temperatures across the qualification temperature range.

A memory device that includes a plurality of non-volatile memory cells and a controller. The controller is configured to erase the plurality of memory cells, program each of the memory cells, and for each of the memory cells, measure a threshold voltage applied to the memory cell corresponding to a target current through the memory cell in a first read operation, re-measure a threshold voltage applied to the memory cell corresponding to the target current through the memory cell in a second read operation, and identify the memory cell as defective if a difference between the measured threshold voltage and the re-measured threshold voltage exceeds a predetermined amount.

A thermal chamber includes a cavity that is enclosed by sides and one or more ports that expose the cavity within the thermal chamber. Each of the one or more ports is configured to receive a temperature control component having a solid physical structure and configured to transfer thermal energy to and from an electrical device exposed via the cavity. The thermal chamber includes a bottom side open area of the thermal chamber located below the one or more ports. The bottom side open area is configured to allow the temperature control component to contact the electrical device that is exposed via the bottom side open area.

A memory system includes a memory device including a plurality of memory blocks, each block having a plurality of pages to store data; and a controller suitable for detecting a number of error bits from data stored in the plurality of pages; summing the number of error bits; generating a bad word line list based on the sum of the error bits; and performing a test read operation on the plurality of pages based on the bad word line list.

A chip testing method for being implemented by a chip testing system includes: a chip mounting step implemented by using a chip mounting apparatus to respectively dispose a plurality of chips onto electrical connection sockets of a chip testing device; a moving-in step implemented by transferring the chip testing device carrying the chips into one of accommodating chambers of an environment control apparatus; a temperature adjusting step implemented by controlling a temperature adjusting device of the one of the accommodating chambers so that the chips are in an environment having a predetermined temperature; and a testing step implemented by providing electricity to the chip testing device, so that each testing module of the chip testing device performs a predetermined testing process on the chips on the corresponding electrical connection sockets connected thereto.

A fractured semiconductor die is disclosed, together with a semiconductor device including the fractured semiconductor die. During fabrication of the semiconductor dies in a wafer, the wafer may be scored in a series of parallel scribe lines through portions of each row of semiconductor dies. The scribe lines then propagate through the full thickness of the wafer to fracture off a portion of each of the semiconductor dies. It may happen that electrical traces such as bit lines in the memory cell arrays short together during the die fracture process. These electrical shorts may be cleared by running a current through each of the electrical traces.

A method of testing a non-volatile memory (NVM) array includes heating the NVM array to a target temperature. While the NVM array is heated to the target temperature, a current distribution is obtained by measuring a plurality of currents of a subset of NVM cells of the NVM array, each NVM cell of the NVM array is programmed to one of a logically high state or a logically low state, and first and second pass/fail (P/F) tests on each NVM cell of the NVM array are performed. A bit error rate is calculated based on the current distribution and the first and second P/F tests.

A memory device comprises a memory array that includes memory cells and a memory controller operatively coupled to the memory array. The memory controller includes an oscillator circuit, internal memory, a processor core coupled to the oscillator circuit and the internal memory, and configured to load operating firmware during a boot phase of the memory device, voltage detector circuitry configured to detect a decrease in a circuit supply voltage of the memory controller during the boot phase, and logic circuitry configured to halt operation of the oscillator circuit and power down the processor core and the internal memory during the boot phase in a low power mode in response to detecting the decrease in the circuit supply voltage.

Various implementations described herein relate to systems and methods for programming data, including determining a target row corresponding to a program command and setting row-based programming parameters for the target row using target physical device parameters of the target row and optimized programming parameters corresponding to the physical device parameters.

A data channel aging circuit, a memory, a data channel aging method, and a memory aging method are provided. The data channel aging circuit includes: a memory cell storing a voltage switching signal configured to provide a target voltage state for each of a plurality of data channels in an integrated circuit (IC); a control unit configured to generate a voltage control signal and to send the voltage control signal to each data channel; and a strobe unit configured to switch a conductive state of each data channel based on the voltage switching signal, and to adjust a voltage level of each data channel through the voltage control signal to induce voltage stress aging. The data channel aging circuit improves the reliability of the aging test and the operational stability of the IC products that have went through the aging test.