An example apparatus may perform concurrent threshold voltage compensation in a memory array with distributed row redundancy. The example apparatus may include a row decoder configured to configured to, in response to a determination that the prime row address matches a defective prime row address, concurrently initiate a threshold voltage compensation operation on both of a prime row of the respective plurality of prime rows of memory cells of a first row section of the plurality of row sections corresponding to the prime row address and the respective redundant row of a second row section of the plurality of row sections. The row decoder may be further configured to stop an access operation associated with the prime row from proceeding based on a comparison of subset of match signals from either the first or second pluralities of row sections.

A data storage system can utilize one or more data storage devices that employ a solid-state non-volatile read destructive memory consisting of ferroelectric memory cells. A leveling strategy can be generated by a wear module connected to the memory with the leveling strategy prescribing a plurality of memory cell operating parameters associated with different amounts of cell wear. The wear module may monitor activity of a memory cell and detect an amount of wear in the memory cell as a result of the monitored activity, which can prompt changing a default set of operating parameters for the memory cell to a first stage of operating parameters, as prescribed by the leveling strategy, in response to the detected amount of wear.

The disclosure relates to a method and system for memory testing to detect memory errors during operation of a memory module. Example embodiments include a method of detecting an error in a memory module (101), the method comprising the sequential steps of: i) receiving (302) a request from a processor executing an application for a read or write operation at a location of the memory module (101) identified by an address; ii) outputting data (304) from, or writing to, the location of the memory module (101); iii) generating (306) by an error detection module (102) a further read request for the location of the memory module (101) identified by the address; iv) receiving (307) at the error detection module (102) an error correction code from the memory module (101) for the location identified by the address; and vi) providing (311) by the error detection module (102) an alert output for the address if the error correction code indicates an error.

The present disclosure provides a circuit for detecting leakage between word lines in a memory device. The circuit includes a first and a second coupling capacitor. A first terminals of the first and second coupling capacitors are connected to a first word line and a second word line, respectively. The first terminals of the first and second coupling capacitors are also connected to a first and a second voltage supply, respectively. The circuit further includes a comparator, wherein a first input of the comparator is connected to a second terminal of the first coupling capacitor and a second input of the comparator is connected to a second terminal of the second coupling capacitor. The comparator is configured to send alarm signal when a differential voltage between the first input and the second input of the comparator is larger than a hysteresis level of the comparator.

The present disclosure provides a circuit for detecting leakage between word lines in a memory device. The circuit includes a first and a second coupling capacitor. A first terminals of the first and second coupling capacitors are connected to a first word line and a second word line, respectively. The first terminals of the first and second coupling capacitors are also connected to a first and a second voltage supply, respectively. The circuit further includes a comparator, wherein a first input of the comparator is connected to a second terminal of the first coupling capacitor and a second input of the comparator is connected to a second terminal of the second coupling capacitor. The comparator is configured to send alarm signal when a differential voltage between the first input and the second input of the comparator is larger than a hysteresis level of the comparator.

A method includes determining that a ratio of valid data portions to a total quantity of data portions of a block of memory cells is greater than or less than a valid data portion threshold and determining that health characteristics for the valid data portions of the block of memory cells are greater than or less than a valid data health characteristic threshold. The method further includes performing a first media management operation on the block of memory cells in response to determining that the ratio of valid data portions to the total quantity of data portions is greater than the valid data portion threshold and performing a second media management operation on at least a portion of the block of memory cells in response to determining that the ratio of valid data portions to the total quantity of data portions is less than the valid data portion threshold and the health characteristics for the valid data portions are greater than the valid data health characteristic threshold.

There is provided a semiconductor apparatus including a memory operation terminal group that includes a plurality of memory operation terminals; an inspection terminal group that includes a plurality of inspection terminals; a constant voltage terminal group that includes a plurality of constant voltage terminals; a drive terminal group that includes a plurality of drive terminals, the inspection terminal group, and the constant voltage terminal group, and of which voltage values change in accordance with an operation of a CPU; and a terminal mounting surface, in which at the terminal mounting surface, the inspection terminal group and the constant voltage terminal group are located to separate the memory operation terminal group and the drive terminal group, and the memory operation terminal group is located not to be adjacent to a terminal which is not included in the inspection terminal group and the constant voltage terminal group.

A method of testing a non-volatile memory (NVM) array includes obtaining a current distribution of a subset of NVM cells of the NVM array, the current distribution including first and second portions corresponding to respective logically high and low states of the subset of NVM cells, programming an entirety of the NVM cells of the NVM array to one of the logically high or low states, determining an initial bit error rate (BER) by performing first and second pass/fail (P/F) tests on each NVM cell of the NVM array, and using the current distribution to adjust the initial BER rate. Each of obtaining the current distribution, programming the entirety of the NVM cells, and performing the first and second P/F tests is performed while the NVM array is heated to a target temperature.

The disclosure is directed to a memory device with a leakage current verifying circuit for minimizing leakage current. In an aspect, the memory device includes not limited to a memory array, a leakage current verifying circuit, and a controller. The controller is configured to perform an erase operation for a first column of memory cells connected to a first WL, set a verify condition including a leakage current threshold, perform a leakage current verifying operation for the first column of the memory cells by comparing a leakage current of a cell of the first column of the memory cells to the leakage current threshold, detect a failure of the first column in response to a cell having the leakage current being above the leakage current threshold, and perform a post-program operation to repair the failure of the first column of the memory cells.

The disclosure is directed to a memory device with a leakage current verifying circuit for minimizing leakage current. In an aspect, the memory device includes not limited to a memory array, a leakage current verifying circuit, and a controller. The controller is configured to perform an erase operation for a first column of memory cells connected to a first WL, set a verify condition including a leakage current threshold, perform a leakage current verifying operation for the first column of the memory cells by comparing a leakage current of a cell of the first column of the memory cells to the leakage current threshold, detect a failure of the first column in response to a cell having the leakage current being above the leakage current threshold, and perform a post-program operation to repair the failure of the first column of the memory cells.