A chip testing apparatus and system suitable for performing testing on multiple chips in a chip cluster are provided. The chip testing apparatus includes a signal interface and a test design circuit. The signal interface transmits an input signal and multiple driving signals in parallel from a test equipment to each of the chips. The test design circuit receives multiple output signals from the chips through the signal interface and serially outputs a test data to the test equipment according to the output signals.

A system comprises a memory sub-system controller mounted to a printed circuit board (PCB) and an in-circuit test (ICT) device. The memory sub-system controller has test points on the PCB comprising stimulus points and observation points. The ICT device connects to the test points of the controller. The ICT device converts automated test pattern generation (ATPG) input test vectors to test signals. A first set of pin drivers of the ICT device applies the test signals to the stimulus points of the controller and a second set of pin drivers of the ICT device read output signals output at the observation points of the controller. A comparator of the ICT device compares the output signals with output test vectors. The comparator provides test result data comprising a result of the comparison.

A test system is disclosed. The test system includes a tester, a first voltage stabilization circuit, and a device under test (DUT). The tester generates a first operational voltage and a control signal. The first voltage stabilization circuit transmits a second operational voltage, associated with the first operational voltage, to a socket board. The DUT operates with the second operational voltage received through the socket board. The first voltage stabilization circuit is further configured to control, according to the control signal, the second operational voltage to have a first voltage level when the DUT is operating.

A semiconductor integrated circuit includes a write test circuit and a read test circuit. The write test circuit generates test data and transmits the generated test data to an external memory device without storing the test data in a local memory device. The read test circuit receives from the external memory device, read data that the external memory device has obtained by reading the test data, and compares the received read data with an expected value without storing either the read data or the expected value in the local memory device.

The present disclosure provides a semiconductor test method. The semiconductor test method includes the operations of: receiving a source code written in an interpreted language; and performing, by a first test apparatus, a first test on a device under test (DUT) based on the source code. The operation of performing, by the first test apparatus, the first test on the DUT based on the source code includes the operations of: interpreting, by a processor, the source code to generate a first interpreted code; and performing the first test on the DUT according to the first interpreted code. The first test apparatus is configured to execute the first interpreted code written in a first language.

A semiconductor memory training method includes: selecting two adjacent reference voltages from a plurality of reference voltages as a first reference voltage and a second reference voltage; obtaining a first minimum margin value for the plurality of target signal lines under the first reference voltage; obtaining a second minimum margin value for the plurality of target signal lines under the second reference voltage, according to a minimum margin value for each target signal line under the second reference voltage; determining a target interval for an expected margin value according to the first minimum margin value and the second minimum margin value, the expected margin value being the maximum one among the minimum margin values for the plurality of target signal lines under the plurality of reference voltages; and searching for the expected margin value in the target interval.

A redundancy analysis method of replacing a faulty part of a memory with at least one spare according to the present embodiment includes: acquiring fault information of the memory; and redundancy-allocating the fault with combinations of the spares to correspond to combination codes corresponding to the combinations of the spares, in which, the redundancy-allocating with the combination of the spare areas includes performing parallel processing on each combination of the spares.

A chip testing apparatus and system suitable for performing testing on multiple chips in a chip cluster are provided. The chip testing apparatus includes a signal interface and a test design circuit. The signal interface transmits an input signal and multiple driving signals in parallel from a test equipment to each of the chips. The test design circuit receives multiple output signals from the chips through the signal interface and serially outputs a test data to the test equipment according to the output signals.

An anti-fuse sensing device and an operation method thereof are provided. The anti-fuse sensing device is adapted for sensing a resistance state of an anti-fuse. The anti-fuse sensing device includes a voltage generating circuit, a comparison circuit, and a sensing circuit. The voltage generating circuit is configured to generate a comparison voltage that changes with temperature. The comparison circuit is coupled to the voltage generating circuit to receive the comparison voltage. The comparison circuit is configured to compare the comparison voltage with a reference voltage, and convert a difference between the comparison voltage and the reference voltage into a bias voltage that changes with temperature. The sensing circuit is coupled to the comparison circuit to receive the bias voltage. The sensing circuit is configured to sense the resistance state of the anti-fuse according to the bias voltage.

In certain aspects, a pattern generation system includes a pattern generator, a memory, a pin function register, a pin function mapper, and a set of source selectors. The pattern generator generates a plurality of source patterns. The memory stores a lookup table set. The lookup table set describes a mapping relationship between the plurality of source patterns and a set of test channels, and is indexed based on a pin function index. The pin function register stores a value of the pin function index. The pin function mapper executes a pin-mapping operation to generate a set of source selection signals based on the value of the pin function index and the lookup table set. Each source selector selects and outputs a source signal from the plurality of source patterns to a corresponding test channel based on a corresponding source selection signal received from the pin function mapper.