G11C2029/5602

ON-CHIP DIAGNOSTIC CIRCUITRY MONITORING MULTIPLE CYCLES OF SIGNAL SAMPLES

A system and integrated circuits are disclosed for determining performance metrics over a plurality of cycles of an input signal using on-chip diagnostic circuitry. The system comprises a trigger generation module configured to generate a trigger signal, and diagnostic circuitry coupled with the trigger generation module. The diagnostic circuitry comprises a memory comprising a plurality of data lines, and a plurality of delay elements, each delay element of the plurality of delay elements connected between consecutive data lines of the plurality of data lines. The diagnostic circuitry is configured to receive at least one input signal, and write, upon receiving the trigger signal, values on the plurality of data lines to the memory, thereby acquiring samples of a plurality of cycles of the input signal.

Prober chuck for magnetic memory, and prober for magnetic memory provided with said chuck

There is provided a prober chuck capable of carrying out low leakage evaluation on a magnetic memory under environment in which a magnetic field is applied. A prober chuck 1 for a magnetic memory retains a wafer W having a magnetic memory formed thereon. The chuck 1 includes: a chuck top 10 that is made of a conductive material and has a wafer W placed thereon; an insulating layer 11 that is made of an insulating material and is adapted to support the bottom surface of the chuck top 10; and a guard layer 12 that is made of a conductive material and is arranged under the insulating layer 11, the guard layer being insulated from the chuck top 10 via the insulating layer 11. All of the members constituting the chuck 1 including the chuck top 10 and the guard layer 12 are made of a non-magnetic material.

Semiconductor apparatus
09741412 · 2017-08-22 · ·

A semiconductor apparatus may include: a data storage group including first to eight data storage areas; a first channel select pad configured to transmit a first channel select signal to the first and third data storage areas; a second channel select pad configured to transmit a second channel select signal to the second and fourth data storage areas; a third channel select pad configured to transmit the first channel select signal to the sixth and eighth data storage areas; a fourth channel select pad configured to transmit the second channel select signal to the fifth and seventh data storage areas; a first clock enable pad configured to transmit a first clock enable signal to the first and third data storage areas; a second clock enable pad configured to transmit a second clock enable signal to the second and fourth data storage areas; a third clock enable pad configured to transmit the first clock enable signal to the fifth and seventh data storage areas; and a fourth clock enable pad configured to transmit the second clock enable signal to the sixth and eighth data storage areas.

SELECTORS ON INTERFACE DIE FOR MEMORY DEVICE

Apparatuses including an interface chip that interfaces with dice through memory channels are described. An example apparatus includes: an interface chip that interfaces with a plurality of dice through a plurality of memory channels, each of the dice comprising a plurality of memory cells, and the interface chip comprising a test circuit. The test circuit includes: first and second terminals corresponding to the first and second memory channels respectively; a test terminal and a built in self test (BIST) circuit common to the first and second memory channels; and a selector coupled to the first and second terminals, the test terminal and the BIST circuit, and couples a first selected one of the first terminal, the test terminal and the BIST circuit to the first channel and a second selected one of the second terminal, the test terminal and the BIST circuit to the second channel.

Software-focused solution for arbitrary all-data odd sector size support
11430536 · 2022-08-30 · ·

An automated test equipment (ATE) system comprises a computer system comprising a system controller, wherein the system controller is communicatively coupled to a tester processor, wherein the system controller is operable to transmit instructions to the tester processor. The tester processor is operable to generate commands and data from the instructions for coordinating testing of a device under test (DUT), wherein the DUT supports an arbitrary sector size, and wherein software layers on the tester processor perform computations to be able control data flow between the tester processor and sectors of arbitrary size in the DUT.

Array of processor units with local BIST

An IC includes an array of processor units, arranged in two or more subarrays. A subarray has a test generator, a multiplexer to apply a test vector to a datapath, and a test result output. It includes one or more processor units. A test result compressor is coupled with an output of the datapath, and compresses output data to obtain a test signature, which it stores in a signature register. The signature register is legible from outside the subarray. The datapath includes one or more memories and one or more ALUs. Test data travels through the full datapath, including the memories and the ALUs. ALU control registers are overridden during test to ensure a testable datapath.

Testing system with differing testing slots

A testing environment may have at least one controller connected to at least first and second testing slots positioned in a housing. The first testing slot can be configured with a first thermal range capability and the second testing slot may be configured with a second thermal range capability that differs from the first thermal range capability.

Ground bounce generator in device under test, automatic test equipment, and method of testing with ground noise
11250925 · 2022-02-15 · ·

A ground bounce generator includes a resistor and at least one switch coupled in parallel with the resistor. The ground bounce generator is in a device under test circuit including a source, at least one ground bounce generator, at least one device under test, and a ground. The device under test is coupled in series between the source and the ground bounce generator. The device under test and the ground bounce generator are coupled in series between the source and the ground.

DEVICE INSPECTION METHOD, PROBE CARD, INTERPOSER, AND INSPECTION APPARATUS
20170256324 · 2017-09-07 ·

A signal input/output circuit is provided with an input line, a common output line, a plurality of individual output lines, relay switches, and resistor elements. The common output line is connected to a comparator. The common output line synthesizes response signals transmitted from a plurality of devices under test (DUT), and transmits a synthesized response signal generated by synthesizing, into one signal, the response signals outputted from the respective DUTs. In response to a test signal transmitted from a pattern generator, the comparator compares the synthesized response signal with a threshold value.

Storage medium-assisted system interface training scheme

A data storage system includes a storage medium and a storage controller configured to perform interface training operations. The interface training operations include loading a test data pattern into a first controller buffer of the storage controller, loading the test data pattern into a first storage medium buffer of the storage medium, setting a first read voltage or timing parameter at the storage controller, transferring the test data pattern from the first storage medium buffer to a second controller buffer of the storage controller using the first read voltage or timing parameter, comparing the test data pattern in the first controller buffer with the test data pattern in the second controller buffer, and determining a first read transfer error rate based on the first comparison.