An example apparatus may perform concurrent threshold voltage compensation in a memory array with distributed row redundancy. The example apparatus may include a memory cell array having a mat having a plurality of row sections that each include respective prime memory cell rows and a respective redundant memory cell row. The example apparatus may further include a row decoder configured to receive an access command and a prime row address. The row decoder may be configured to, in response to a determination that the prime row address matches a defective prime row address, concurrently initiate a threshold voltage compensation operation on both of a prime row of the respective plurality of prime rows of memory cells of a first row section of the plurality of row sections corresponding to the prime row address and the respective redundant row of a second row section of the plurality of row sections.

A memory system includes a memory; and a memory controller which includes a spare buffer suitable for storing an error location in the memory and data at the location, and commands the memory to perform a spare read operation when a read operation needs to be performed in a region of the memory including the error location.

A memory device includes a memory cell array including normal memory cells and redundant memory cells; first page buffers connected to the normal memory cells through first bit lines including a first bit line group and a second bit line group and arranged in a first area corresponding to the first bit lines in a line in a first direction; and second page buffers connected to the redundant memory cells through second bit lines including a third bit line group and a fourth bit line group and arranged in a second area corresponding to the second bit lines in a line in the first direction, wherein, when at least one normal memory cell connected to the first bit line group is determined as a defective cell, normal memory cells connected to the first bit line group are replaced with redundant memory cells connected to the third bit line group.

Disclosed herein is an apparatus that includes a plurality of column planes each including a plurality of bit lines, an access control circuit configured to select one of the plurality of bit lines in each of the plurality of column planes based on a column address to read a plurality of data-bits, a data generating circuit configured to generate an expected-bit based at least in part on the data-bits, and an analyzing circuit configured to generate a fail-bit data indicating which one of the data-bits does not match the expected-bit when one of the data-bits does not match the expected-bit.

A data processing circuit and a fault mitigating method are provided. The method is adapted for a memory having at least one fault bit. The memory provides a block for data storage. A difference between an output of a value of a plurality of bits input to at least one computing layer in a neural network and a correct value is determined. The bits are respectively considered the at least one fault bit. A repair condition is determined based on the difference. The repair condition includes a correspondence between a position where the fault bit is located in the block and at least one non-fault bit in the memory. A value of at least one non-fault bit of the memory replaces a value of the fault bit based on the repair condition.

A latch circuit includes a plurality of latch sets, each including an enable latch and a plurality of address latches; and a plurality of latch-width adjusting circuits respectively corresponding to the latch sets, wherein, in each of the plurality of latch sets, the corresponding latch-width adjusting circuit is disposed between the enable latch of the corresponding latch set and the address latch adjacent to the enable latch, and couples the enable latch to the adjacent address latch depending on whether or not the corresponding latch set is used, at an end of a boot-up operation.

A redundancy analysis method of replacing a faulty part of a memory with at least one spare according to the present embodiment includes: acquiring fault information of the memory; and redundancy-allocating the fault with combinations of the spares to correspond to combination codes corresponding to the combinations of the spares, in which, the redundancy-allocating with the combination of the spare areas includes performing parallel processing on each combination of the spares.

A method for operating a memory includes determining to perform an error correction operation; determining whether to perform an error correction operation; generating an internal address when the error correction operation is performed; reading data from memory cells that are selected based on the internal address and an error correction code corresponding to the data; performing an error correction operation on the data based on the error correction code to produce an error-corrected data; writing the error-corrected data and an error correction code corresponding to the error-corrected data into the memory cells; determining one or more regions among regions in the memory as a repair-requiring region based on an error detected when the error correction operation is performed; receiving a first command; backing up the data and the error correction code into a redundant region in response to the first command; and repairing the repair-requiring region with the redundant region.

An apparatus includes a boot-up control circuit configured to, when a first boot-up operation is performed, latch first fuse data by receiving the first fuse data and fuse information from a fuse circuit and configured to, when a second boot-up operation is performed, latch second fuse data by receiving the second fuse data from the fuse circuit based on the fuse information; and a rupture control circuit configured to store a failure address as the second fuse data by rupturing the fuse circuit based on the fuse information.

An anti-fuse device includes: a substrate; an anti-fuse gate, partially embedded in the substrate, a portion of the anti-fuse gate embedded in the substrate having one or more sharp corners; and an anti-fuse gate oxide layer, located between the anti-fuse gate and the substrate.