The disclosure provides a novel system and method of storing multi-bit information, including providing a nano-channel-based polymer memory device, the device having at least one memory cell comprising at least two addition nano-channels, each of the addition nano-channels arranged to add a unique chemical construct (or codes) to the polymer when the polymer enters the respective addition nano-channel, the polymer having a bead or origami on a non-writing end of the polymer; each nano-channel having a nano-port constriction having a port width which allows the polymer to pass through the nano-port, and does not allow the bead or origami to pass through and does not allow addition or deblocking enzymes (or beads attached thereto) to pass through the nano-port; successively steering the polymer through the nanopore into the addition nano-channels to add the codes to the polymer based on a predetermined digital data pattern to create the digital data pattern on the polymer.

An apparatus can include a partial superblock memory management component. The partial superblock memory management component can identify bad blocks in respective planes of a block of non-volatile memory cells. The partial superblock memory management component can determine that a plane of the respective planes includes at least good block in at least one different block of non-volatile memory cells. The partial superblock memory management component can perform an operation to reallocate the at least one good block in the plane to the at least one bad block in the plane to form blocks of non-volatile memory cells having a quantity of bad blocks that satisfies a bad block threshold.

A memory system includes a memory medium and a memory controller. The memory medium has a second address system that is different from a first address system of a host. The memory controller performs a control operation to access the memory medium based on a command from the host. The memory controller is configured to store a second address, corresponding to an address of a read data, when an error of the read data that is outputted from the memory medium is uncorrectable and is configured to repair a region of the memory medium, designated by the second address, when the region of the memory medium that is designated by the second address is repairable.

Methods, systems, and devices for data compression for global column repair are described. In some cases, a testing device may perform a first internal read operation to identify errors associated with on one or more column planes. A value (e.g., a bit) indicating whether an error occurred when testing each column plane may be stored. The testing device may perform a second internal read operation on the same column planes, or on column planes of a different bank of memory cells. The values (e.g., bits) indicating whether errors occurred during the first internal read operation and the values indicating whether errors occurred during the second internal read operation may be combined and stored in a register. The stored values may be read out (e.g., as a burst) to repair the defective column planes.

A memory apparatus comprising: a cell array comprising multiple first and second word lines, a fuse array configured to substitute a selection word line of the multiple first word lines with the multiple second word lines, a fail determination unit configured to determine, as a fail word line, a word line matched with a first condition during an access operation for the multiple first word lines and to determine a fail grade of the fail word line based on a second condition, an information storage unit configured to store a physical address, fail grade and access count of the fail word line as determination information for the fail word line, and a rupture operation unit configured to select the selection word line from the fail word lines based on a result of the analysis of the determination information, and perform rupturing the selection word line into the fuse array.

A memory circuit includes a first memory array and a second memory array. The first memory array and the second memory array are independent. The first memory array includes a plurality of general bits and the second memory array includes a plurality of spare bits. An address of defective bit in the first memory array is stored in the second memory array, and the memory circuit repairs the defective bit by one of the spare bits according to the address.

A memory device includes a row decoder, a column decoder, and a repair control circuit, which is configured to: (i) compare a row address with a stored failed row address, (ii) compare a column address with a stored failed column address, (iii) control the row decoder to activate the at least one of a plurality of redundancy word lines when the row address corresponds to the failed row address, and (iv) control the column decoder to activate at least one of a plurality of redundancy bit lines when the column address corresponds to the failed column address. The repair control circuit varies a repair unit according to an address input during a repair operation.

A system, and corresponding method, is described for correcting an uncorrectable error in a coherent system. The uncorrectable error is detecting using an error detecting code, such as parity or SECDED. The cache controller or agent calculates a set of possible addresses. The directory is queried to determine which one of the set of possible addresses is the correct address. The agent and/or cache controller is updated with the correct address or way. The invention can be implemented in any chip, system, method, or HDL code that perform protection schemes and require ECC calculation, of any kind. Embodiments of the invention enable IPs that use different protections schemes to reduce power consumption and reduce bandwidth access to more efficiently correct errors and avoid a system restart when an uncorrectable error occurs.

Apparatuses and methods for memory repair for a memory device are described. An example apparatus includes: a data input/output circuit that provides data via a plurality of data signal lines; memory cell arrays; an ECC/Parity redundancy array; and a redundancy circuit coupled to the plurality of data signal lines. The redundancy circuit includes an error correction block that generates error correction information based on the data and provides the error correction information to the ECC/Parity redundancy array. If during test it is determined that a failure is not repairable by standard redundancy including error correction code, the error correction parity array is not needed and can be redirected by a block repair circuit. The error correction circuit can now have its functionality changed to allow the error correction array to become a block repair.

A semiconductor memory device includes a memory cell array, a bit-line switch, a block switch, and a column decoder. The memory cell array includes memory blocks coupled to at least one word-line and each of the memory blocks includes memory cells. The bit-line switch is connected between a first half local input/output (I/O) line of a first memory block and a second half local I/O line of the first memory block. The block switch is connected between the second half local I/O line of the first memory block and a first half local I/O line of a second memory block adjacent to the first memory block. The column decoder includes a repair circuit that controls connections by applying a first switching control signal to the bit-line switch and a second switching control signal to the block switch.