A memory system includes a plurality of memory devices, each of the plurality of memory devices including a plurality of memory cells, and at least one of the plurality of memory devices including a backup region, and a memory controller configured to store data to be stored in a plurality of selected memory cells in the plurality of selected memory cells and the backup region, the plurality of selected memory cells being connected to a selected word line of a selected memory device among the plurality of memory devices, and replace the selected word line with a redundancy word line to which a plurality of redundancy memory cells among the plurality of memory cells are connected in response to a correctable error correction code (CECC) occurring in at least one of the plurality of selected memory cells.

Methods, systems, and apparatus, including computer programs encoded on computer storage media, for resynchronizing data in a storage system. One of the methods includes determining that a particular disk of a capacity object of a storage system is out-of-sync and that a primary disk is unavailable; and for each segment of one or more segments of the capacity object: generating a first version of the column of the segment corresponding to the unavailable primary disk; determining whether the data integrity token in the column summary of the generated first version is valid; and in response to determining that the data integrity token is valid, resynchronizing the column of the segment corresponding to the particular disk using i) the primary columns of the segment corresponding to each available primary disk and ii) the first version of the column of the segment corresponding to the unavailable primary disk.

Apparatuses and methods of sharing error correction memory on an interface chip are described. An example apparatus includes: at least one memory chip having a plurality of first memory cells and an interface chip coupled to the at least one memory chip and having a control circuit and a storage area. The control circuit detects one or more defective memory cells of the first memory cells of the at least one memory chip. The control circuit further stores first defective address information of the one or more defective memory cells of the first memory cells into the storage area. The interface chip responds to the first defective address information and an access request to access the storage area in place of the at least one memory chip when the access request has been provided with respect to the one or more defective memory cells of the first memory cells.

The present invention discloses a multi-bit-per-cell three-dimensional resistive random-access memory (3D-RRAM.sub.MB). It comprises a plurality of RRAM cells stacked above a semiconductor substrate. Each RRAM cell comprises a RRAM layer, which is switched from a high-resistance state to a low-resistance state during programming. By adjusting the programming current, the programmed RRAMs have different resistances.

A non-volatile memory system comprises an integrated memory assembly in communication with a memory controller. The integrated memory assembly includes a memory die bonded to a control die. The control die includes one or more control circuits for controlling the operation of the memory die. The control circuits are configured to receive a request to copy data on the memory die, read codewords on the memory die in response to the request, decode the codewords to identify errors in the codewords, correcting the errors in the codewords, and program the codewords back into the memory die. In one embodiment, the codewords read are stored in the memory die as single bit per memory cell data and the codewords programmed back into the memory die after correcting errors are programmed as multiple bit per memory cell data.

A dynamic random access memory (DRAM) comprises a plurality of primary data storage elements, a plurality of redundant data storage elements, and circuitry to receive a first register setting command and initiate a repair mode in the DRAM in response to the first register setting command. The circuitry is further to receive an activation command, repair a malfunctioning row address in the DRAM, receive a precharge command, receive a second register setting command, terminate the repair mode in the DRAM in response to the second register setting command, receive a memory access request for data stored at the malfunctioning row address, and redirect the memory access request to a corresponding row address in the plurality of redundant data storage elements.

A semiconductor memory device includes a memory cell array, a read/write circuit, control logic, and a bit flip sensor. The memory cell array includes a plurality of memory cells. The read/write circuit is configured to receive program data, and perform a program operation on selected memory cells among the plurality of memory cells, based on the program data. The bit flip sensor is configured to receive the program data from the read/write circuit, and determine whether a bit flip has occurred in the program data. The control logic is configured to control the program operation of the read/write circuit, and generate program status information, based on a determination result of the bit flip sensor.

Methods, systems, and devices for memory cells for storing operational data are described. A memory device may include an array of memory cells with different sets of cells for storing data. A first set of memory cells may store data for operating the memory device, and the associated memory cells may each contain a chalcogenide storage element. A second set of memory cells may store host data. Some memory cells included in the first set may be programmed to store a first logic state and other memory cells in the first set may be left unprogrammed (and may represent a second logic state). Sense circuitry may be coupled with the array and may determine a value of data stored by the first set of memory cells.

A memory may include a first repair analysis circuit suitable for storing an input fail address when the input fail address is different from a fail address which is already stored in the first repair analysis circuit, and outputting the input fail address as a first transfer fail address when a storage capacity of the first repair analysis circuit is full; and a second repair analysis circuit suitable for storing the first transfer fail address when the first transfer fail address is different from a fail address which is already stored in the second repair analysis circuit.

Methods, systems, and devices for memory health status reporting are described. A memory device may output to a host device a parameter value, which may be indicative of metric or condition related to the performance or reliability (e.g., a health status) of the memory device of the memory device. The host device may thereby determine that the memory device is degraded, possibly prior to device or system failure. Based on the parameter value, the host device may take preventative action, such as quarantining the memory device, deactivating the memory device, or swapping the memory device for another memory device.