Patent classifications
G11C29/78
MEMORY DEVICE AND OPERATING METHOD USING THE SAME
A memory device that includes a memory array, a program circuit, a verify circuit and a controller is introduced. The program circuit is configured to apply a program pulse to at least one memory cell to set the at least one memory cell to a target state. The verify circuit is configured to perform a verify operation to determine whether the at least one memory cell reaches the predetermine threshold and to determine a number of failed memory cells among the at least one memory cell in response to determining that at least one of the at least one memory cell does not reach the target state. The controller is configured to adjust the program pulse according to the number of the failed memory cells to generate an adjusted program pulse that is applied to the failed memory cells to set the failed memory cells to the target state.
METHODS TO TOLERATE PROGRAMMING AND RETENTION ERRORS OF CROSSBAR MEMORY ARRAYS
Systems and methods for reducing the impact of defects within a crossbar memory array when performing multiplication operations in which multiple control lines are concurrently selected are described. A group of memory cells within the crossbar memory array may be controlled by a local word line that is controlled by a local word line gating unit that may be configured to prevent the local word line from being biased to a selected word line voltage during an operation; the local word line may instead be set to a disabling voltage during the operation such that the memory cell currents through the group of memory cells are eliminated. If a defect has caused a short within one of the memory cells of the group of memory cells, then the local word line gating unit may be programmed to hold the local word line at the disabling voltage during multiplication operations.
METHODS TO TOLERATE PROGRAMMING AND RETENTION ERRORS OF CROSSBAR MEMORY ARRAYS
Systems and methods for reducing the impact of defects within a crossbar memory array when performing multiplication operations in which multiple control lines are concurrently selected are described. A group of memory cells within the crossbar memory array may be controlled by a local word line that is controlled by a local word line gating unit that may be configured to prevent the local word line from being biased to a selected word line voltage during an operation; the local word line may instead be set to a disabling voltage during the operation such that the memory cell currents through the group of memory cells are eliminated. If a defect has caused a short within one of the memory cells of the group of memory cells, then the local word line gating unit may be programmed to hold the local word line at the disabling voltage during multiplication operations.
Systems and methods for correcting data errors in memory
Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.
Intelligent post-packaging repair
Techniques are provided for storing a row address of a defective row of memory cells to a bank of non-volatile storage elements (e.g., fuses or anti-fuses). After a memory device has been packaged, one or more rows of memory cells may become defective. In order to repair (e.g., replace) the rows, a post-package repair (PPR) operation may occur to replace the defective row with a redundant row of the memory array. To replace the defective row with a redundant row, an address of the defective row may be stored (e.g., mapped) to an available bank of non-volatile storage elements that is associated with a redundant row. Based on the bank of non-volatile storage elements the address of the defective row, subsequent access operations may utilize the redundant row and not the defective row.
MEMORY SYSTEMS FOR PERFORMING FAILOVER
A memory system includes a plurality of memory devices, each of the plurality of memory devices including a plurality of memory cells, and at least one of the plurality of memory devices including a backup region, and a memory controller configured to store data to be stored in a plurality of selected memory cells in the plurality of selected memory cells and the backup region, the plurality of selected memory cells being connected to a selected word line of a selected memory device among the plurality of memory devices, and replace the selected word line with a redundancy word line to which a plurality of redundancy memory cells among the plurality of memory cells are connected in response to a correctable error correction code (CECC) occurring in at least one of the plurality of selected memory cells.
Apparatus and methods for controlling refresh operations
An apparatus includes a first word line, a second word line and a control. The second word line is contiguous to the first word line. The control circuit includes a first defective address storing circuit and a first detection circuit. The first defective address storing circuit stores first enable information along with first defective address. The first enable information indicates whether or not the second word line is functional. The first detection circuit provides a first signal when the first word line is accessed. The first signal indicates whether or not the second word line is functional. The control circuit activates the second word line when the first signal indicates that the second word line is functional and does not activate the second word line when the first signal indicates that the second word line is not functional.
Controller to detect malfunctioning address of memory device
A controller includes an internal memory to store an address and a memory control unit operatively coupled with the internal memory. The memory control unit includes logic to identify a malfunctioning address of primary data storage elements within an external memory device, the external memory device being another semiconductor device separate from the controller, store the malfunctioning address in the internal memory, and transmit, to the external memory device, a command to initiate a repair of the malfunctioning address using redundant data storage elements and an indication of an address associated with the malfunctioning address.
Apparatuses and methods for latching redundancy repair addresses at a memory
Apparatuses and methods for latching redundancy repair addresses at a memory are disclosed. An example apparatus includes block of memory including primary memory and a plurality of redundant memory units and repair logic. The repair logic including a plurality of repair blocks. A repair block of the plurality of repair blocks is configured to receive a set of repair address bits associated with a memory address for defective memory of the block of memory and to latch the set of repair address bits at a respective set of latches. The repair block is further configured to, in response to receipt of a memory access request corresponding to the set of repair address bits latched at the repair block, redirecting the memory access request to a redundant memory unit associated with the repair block.
Storage device and method of operating the same
Provided herein may be a storage device having improved operating speed and a method of operating the same. The storage device may include a memory controller configured to control the plurality of dies, each including two or more planes. The memory controller may include a reserved block information storage unit configured to store reserved block information that is information related to reserved blocks included in the plurality of dies; and a bad block management control unit configured to set, when a bad block occurs among memory blocks respectively included in the plurality of dies, a reserved block to replace the bad block depending on whether any one of available reserved blocks are included in a plane to which the bad block belongs, among the two or more planes included in a die including the bad block, based on the reserved block information.