Some embodiments include apparatuses and methods of using the apparatuses. One of the apparatuses includes a substrate, a first deck including first memory cell strings located over the substrate, a second deck including second memory cell strings and located over the first deck, first data lines located between the first and second decks and coupled to the first memory cell strings, second data lines located over the second deck and coupled to the second memory cell strings, and first and second circuitries. The first and second data lines extending in a direction from a first portion of the substrate to a second portion of the substrate. The first buffer circuitry is located in the first portion of the substrate under the first memory cell strings of the first deck and coupled to the first data lines. The second buffer circuitry is located in the second portion of the substrate under the first memory cell strings of the first deck and coupled to the second data lines.

Apparatuses and methods can be related to performing operations in memory. Operations can be performed in the background while the memory is performing different operations. For example, comparison operations can be performed by the memory device while the memory device is reading data. The results of the comparison operations can be stored in registers of the memory device. The registers can be made accessible externally to the memory device.

A selection circuit includes: a first selection device coupled between a write IO line and a first node; a second selection device coupled between a read IO line and a second node; a third selection device controllable by a first address decode signal, and coupled between a first bit line and a third node; a fourth selection device controllable by a second address decode signal, and coupled between a second bit line and the third node; a first suppression device controllable by a write enable signal, and coupled between the second node and ground; a second suppression device controllable by a read enable signal, and coupled between the first node and ground; a first isolation device controllable by the write enable signal, and coupled between the first and third nodes; and a second isolation device controllable by the read enable signal, and coupled between the second and third nodes.

A non-volatile memory device includes a plurality of memory cells arranged in a matrix, a plurality of word lines extended in a row direction, and a plurality of bit lines extended in a column direction. Each of the memory cells is coupled to one of the word lines and one of the bit lines. The memory device further includes a word-line control circuit coupled to and configured to control the word lines, a first bit-line control circuit configured to control the bit lines and sense the memory cells in a digital mode, and a second bit-line control circuit configured to bias the bit lines and sense the memory cells in an analog mode. The first bit-line control circuit is coupled to a first end of each of the bit lines. The second bit-line control circuit is coupled to a second end of each of the bit lines.

A nonvolatile memory device includes a memory cell array and a row decoder. The memory cell array includes a plurality of mats. A first cell string of first mat is connected to a plurality of first word-lines, a first bit-line and a first string selection line. A second cell string of second mat is connected to a plurality of second word-lines, a second bit-line and a second string selection line. Each of the first and second cell strings includes a ground selection transistor, memory cells, and a string selection transistor coupled in series. The row decoder applies a first voltage to a third word-line among the plurality of first and second word-lines for a first period of time in a single mat mode and to apply a second voltage to the third word-line for a second period of time longer than the first period of time in a multi-mat mode.

A three-dimensional stacked integrated circuit (3D SIC) having a non-volatile memory die having an array of non-volatile memory partitions, a volatile memory die having an array of volatile memory partitions, and a processing logic die having an array of processing logic partitions. The non-volatile memory die, the volatile memory die, and the processing logic die are stacked. The non-volatile memory die, the volatile memory die, and the processing logic die can be arranged to form an array of functional blocks, and at least two functional blocks can each include a different data processing function that reduces the computation load of a controller.

A power control system, method, and architecture are disclosed for a multi-bank memory which provides independent, concurrent memory access to at least one memory block in each memory bank by using observation circuits to monitor bus masters connected over bus master interface signals to an interconnect for memory access requests to the multi-bank memory and to provide notifications to a power control circuitry that a valid memory access request was issued by a bus master over the bus master interface, where the power control circuitry processes the notifications received from each observation circuit and generates therefrom power control signals that are provided directly to each memory block and to bypass the interconnect, thereby separately controlling a power state for each memory block with power-up control signals that arrive at each memory block at or before a memory access request sent over the interconnect.

A pseudo-dual-port memory (PDPM) is disclosed that includes a first memory array bank and a second memory array bank of a plurality of memory array banks. The PDPM also includes parallel pin control logic circuitry configured to perform operations including taking a clock signal, a memory enable signal for a first port, a memory enable signal for a second port, a parallel pin control signal, and address signals for the first and the second memory array banks as inputs and generating a first internal clock and a second internal clock for performing operations corresponding to the first and the second memory array banks at the first port and the second port. A total number of memory array banks may be up to eight memory array banks and each including either a six-transistors (6-T) SRAM bit-cell or an eight-transistors (8-T) SRAM bit-cell in static random access memory architecture.

A nonvolatile memory device includes a memory cell array, a voltage generator, a page buffer circuit, a row decoder and a control circuit. The memory cell array includes a plurality of mats corresponding to different bit-lines. The voltage generator generates word-line voltages applied to the memory cell array. The page buffer circuit is coupled to the memory cell array through bit-lines. The row decoder is coupled to the memory cell array through word-lines, and the row decoder transfers the word-line voltages to the memory cell array. The control circuit controls the voltage generator, the row decoder and the page buffer circuit based on a command and an address. The control circuit selects a voltage between different voltages to apply the selected different voltages to at least one of the word-lines or at least one of the bit-lines according to a number of mats of the plurality mats, which operate simultaneously.

Apparatuses and methods for performing concurrent memory access operations for different memory planes are disclosed herein. An example apparatus may include a memory array having a plurality of memory planes. Each of the plurality of memory planes comprises a plurality of memory cells. The apparatus may further include a controller configured to receive a group of memory command and address pairs. Each memory command and address pair of the group of memory command and address pairs may be associated with a respective memory plane of the plurality of memory planes. The internal controller may be configured to concurrently perform memory access operations associated with each memory command and address pair of the group of memory command and address pairs regardless of page types associated with the pairs of the group (e.g., even if two or more of the memory command and address pairs may be associated with different page types).