A sense amplifier is biased to reduce leakage current equalize matched transistor bias during an idle state. A first read select transistor couples a true bit line and a sense amplifier true (SAT) signal line and a second read select transistor couples a complement bit line and a sense amplifier complement (SAC) signal line. The SAT and SAC signal lines are precharged during a precharge state. An equalization circuit shorts the SAT and SAC signal lines during the precharge state. A differential sense amplifier circuit for latching the memory cell value is coupled to the SAT signal line and the SAC signal line. The precharge circuit and the differential sense amplifier circuit are turned off during a sleep state to cause the SAT and SAC signal lines to float. A sleep circuit shorts the SAT and SAC signal lines during the sleep state.

Disclosed herein are related to reducing power consumption of a memory device when transitioning from a sleep state to an operational state. In one aspect, the memory device includes a memory cell to store data. In one aspect, the memory device includes an output driver configured to: generate an output signal indicating the stored data, in response to a sleep tracking signal indicating that the memory cell is in the operational state, and generate the output signal having a predetermined voltage irrespective of the stored data, in response to the sleep tracking signal indicating that the memory cell is in the sleep state. In one aspect, the sleep tracking signal is delayed from a sleep control signal causing the memory cell to operate in the sleep state or the operational state.

A semiconductor device may include a plurality of memory cells, and at least one peripheral circuit coupled to the plurality of memory cells and comprising a superlattice. The superlattice may include a plurality of stacked groups of layers with each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer thereon constrained within a crystal lattice of adjacent base semiconductor portions. The semiconductor device may further include a first power switching device configured to couple the at least one peripheral circuit to a first voltage supply during a first operating mode, and a second power switching device configured to couple the at least one peripheral circuit to a second voltage supply lower than the first voltage supply during a second operating mode.

In an embodiment of the present disclosure, a memory module may be provided. In an embodiment of the present disclosure, a system may be provided. In an embodiment of the present disclosure, an operation of a system and memory module may be provided. The memory module may include a plurality of ranks in which a defragmentation operation of a memory is performed based on entrance of a low-power operation mode, and a vacant region of the memory is powered off based on entrance of a self-refresh mode after the defragmentation operation is ended. The memory module may include a page table of which data are updated based on an ending of the defragmentation operation of the memory.

A hybrid memory system with improved bandwidth is disclosed. In one aspect, a memory system is provided that increases bandwidth relative to the JEDEC low-power double data rate version 5 (LPDDR5) standard. This improvement is made possible by increasing a data conductor count from sixteen to twenty-four. Optionally, the bandwidth may be further improved by increasing a clock frequency from a first value to a second value. This allows the hybrid memory system to provide improved bandwidth without the complications of merely doubling pin counts or doubling clock speed. Further, coding techniques tailored to the pin count and pin layout are provided.

A nonvolatile memory device includes a memory cell array having nonvolatile memory cells therein, which are electrically connected to a plurality of word lines and a plurality of bit lines. A write driver and row decoder are provided, which are electrically connected to the plurality of bit lines and the plurality of word lines, respectively. Control logic is configured to transfer a first voltage to the write driver and a second voltage to the row decoder. The control logic includes: (i) a normal standby mode circuit configured to operate in a normal standby mode, and (ii) a deep standby mode circuit configured to operate in a deep standby mode. To save power, the layout areas of a plurality of elements within the deep standby mode circuit are smaller than layout areas of elements within the normal standby mode circuit, so that current flowing within the deep standby mode circuit during the deep standby mode is less than current flowing within the normal standby mode circuit during the normal standby mode.

A power control circuit includes a power control signal generation circuit configured to generate a voltage control signal according to a deep sleep command for operating a semiconductor apparatus in a deep sleep mode; a voltage divider circuit having a division ratio that is changed according to the voltage control signal, and configured to generate a divided voltage by dividing an internal voltage at the changed division ratio; a comparator configured to generate a detection signal by comparing a reference voltage to the divided voltage; an oscillator configured to generate an oscillation signal according to the detection signal; and a pump configured to generate the internal voltage according to the oscillation signal.

A disclosed sense circuit for a memory circuit includes sense amplifiers that detect differences in voltage levels on complementary bitlines during read operations. Instead of the sense amplifiers having built-in footer devices that lead to significant leakage, the sense circuit incorporates a common footer device for all sense amplifiers. To ensure that this footer device has sufficient drive strength to enable voltage differential detection by each sense amplifier, the sense circuit also includes a sense signal generation and boost circuit (SSG&B circuit) that generates a sense mode control signal (SEN) to control the on/off states of the footer device and that further boosts SEN, at the appropriate time, to increase the drive current. By using the common footer device and the SSG&B circuit, leakage from the sense circuit is reduced during a pre-charge operation mode without sacrificing performance during a read operation mode. Also disclosed are associated method embodiments.

A method of operating a clock frequency detected control I/O buffer enable circuitry and/or features of saving power. In illustrative implementations, the method may be directed to providing low standby power consumption, such as providing low standby power consumption in high-speed synchronous SRAM and RLDRAM devices.

A semiconductor memory device can appropriately control operation timing, based on changes in the environment (for example, power supply voltage and temperature, etc.) when in use. The semiconductor memory device includes a temperature sensor 18 that detects the temperature of the semiconductor memory device, a voltage detection portion (composed of a ring oscillator 14 and a counter 15) that detects the power supply voltage of the semiconductor memory device, and a control portion 10 that controls the operation timing in the semiconductor memory device to meet specific conditions, according to the temperature detected by the temperature sensor 18 after the power is applied and the voltage detected by the voltage detection portion after the power is applied.