Methods, systems, and devices for a magnetic cache for a memory device are described. Magnetic storage elements (e.g., magnetic memory cells, such as spin-transfer torque (STT) memory cells or magnetic tunnel junction (MTJ) memory cells) may be configured to act as a cache for a memory array, where the memory array includes a different type of memory cells. The magnetic storage elements may be inductively coupled to access lines for the memory array. Based on this inductive coupling, when a memory value is written to or read from a memory cell of the array, the memory value may concurrently be written to a magnetic storage element based on associated current through an access line used to write or read the memory cell. Subsequent read requests may be executed by reading the memory value from the magnetic storage element rather than from the memory cell of the array.

A memory system includes a non-volatile memory having a plurality of memory cells, and a controller configured to carry out write operations in a first mode in which n-bit data is written per target memory cell of the non-volatile memory until an allowable data amount of data items has been written, and then, in a second mode in which m-bit data is written per target memory cell of the non-volatile memory, where n is an integer of one or more and m is an integer greater than n. The controller is further configured to detect that an idle state, in which a command has not been received from the host, has continued for a threshold period of time or more, increase the allowable data amount in response thereto, and after the increase, carry out a write operation to write data items in the non-volatile memory in the first mode.

According to one embodiment, a semiconductor memory includes a first memory cell array including a plurality of first memory cells; and a second memory cell array including a plurality of second memory cells. Each of threshold voltages of the first memory cells and the second memory cells is set to any of a first threshold voltage, a second threshold voltage higher than the first threshold voltage, and a third threshold voltage higher than the second threshold voltage. Data of three or more bits including a first bit, a second bit, and a third bit is stored using a combination of a threshold voltage of the first memory cell and a threshold voltage of the second memory cell.

An example system implementing a processing-in-memory pipeline includes: a memory array to store data in a plurality of memory cells electrically coupled to a plurality of wordlines and a plurality of bitlines; a logic array coupled to the memory array, the logic array to implement configurable logic controlling the plurality of memory cells; and a control block coupled to the memory array and the logic array, the control block to control a computational pipeline to perform computations on the data by activating at least one of: one or more bitlines of the plurality of bitlines or one or more wordlines of the plurality of wordlines.

An example system implementing a processing-in-memory pipeline includes: a memory array to store a plurality of look-up tables (LUTs) and data comprising an input string; a logic array coupled to the memory array, the logic array to perform a set of logic operations on the data and the LUTs, the set of logic operations implementing a set of production rules of a context-free grammar to translate the input string into one or more symbols; and a control block coupled to the memory array and the logic array, the control block to control a computational pipeline by activating one or more LUTs of the plurality of LUTs, the computational pipeline implementing a parser evaluating the input string against the context-free grammar.

Disclosed is a memory system that has a memory controller and may have a memory component. The memory component may be a dynamic random access memory (DRAM). The memory controller is connectable to the memory component. The memory component has at least one data row and at least one tag row different from and associated with the at least one data row. The memory system is to implement a cache having multiple ways to hold a data group. The memory controller is operable in each of a plurality of operating modes. The operating modes include a first operating mode and a second operating mode. The first operating mode and the second operating mode have differing addressing and timing for accessing the data group. The memory controller has cache read logic that sends a cache read command, cache results logic that receives a response from the memory component, and cache fetch logic.

Disclosed in some examples are memory devices which feature intelligent adjustments to SLC cache configurations that balances memory cell lifetime with performance. The size of the SLC cache can be adjusted during usage of the memory device based upon a write amplification (WA) metric of the memory device. In some examples, the size of the SLC cache can be adjusted during usage of the memory device based upon a write amplification (WA) metric of the memory device and a memory device logical saturation metric (percentage of valid user data written in the device of the total user size).

An integrated circuit device may cache configuration data to enable rapid configuration from fabric cache memory. The integrated circuit device may include programmable logic fabric having configuration memory and programmable logic elements controlled by the configuration memory, and sector-aligned memory apart from the programmable logic fabric. A first sector of the configuration memory may be programmed with first configuration data. The sector-aligned memory may include a first sector of sector-aligned memory that may cache the first configuration data while the configuration memory is programmed with the first configuration data a first time. A second sector of sector-aligned memory may cache second configuration data for a second sector of the configuration memory in parallel while the first sector of sector-aligned memory caches the first configuration data for the first sector of the configuration memory.

Embodiments of 3D memory devices with a static random-access memory (SRAM) and fabrication methods thereof are disclosed herein. In certain embodiments, the 3D memory device includes a first semiconductor structure and a second semiconductor structure. The first semiconductor structure includes an array of SRAM cells and a first bonding layer, and the second semiconductor structure includes an array of 3D NAND memory strings and a second bonding layer. The first semiconductor structure is attached with the second semiconductor structure through the first bonding layer and the second bonding layer. The array of 3D NAND memory strings and the array of SRAM cells are coupled through a plurality of bonding contacts in the first bonding layer and the second bonding layer and are arranged at opposite sides of the plurality of bonding contacts.

A media management operation is executed to write data from a source block of a cache memory to a set of pages of a destination block of a storage area of a memory sub-system. An entry of a data structure identifying a page count corresponding to the source block of the cache memory is generated. A power loss event associated with the destination block of the storage area is identified. A data recovery operation is executed using the data stored in the source block to complete the write to the destination block. The data is erased from the source block in response to the page count satisfying a condition.